• 한국추진공학회:학술대회논문집
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• 한국추진공학회 2010년도 제35회 추계학술대회논문집
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• pp.620-621
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• 2010

우주공간에서 임무를 수행하는 인공위성이 궤도상에서 원활하게 작동할 수 있도록 열모델의 보정과정을 통하여 열해석 모델을 검증하는 과정이 이루어진다. 본 연구에서는 열해석 모델을 검증하는 과정으로 지상 열진공시험결과를 이용하여 요구조건을 충족시키기 위하여 열모델의 보정을 수행하였다.

• Journal of Electrical Engineering and Technology
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• 제9권3호
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• pp.882-887
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• 2014

In this paper, the water cooling method among the forced coolant cooling methods is considered to be applied to the 110kW-class IPMSM for railway vehicles. First, basic thermal property analysis of the IPMSM is conducted using the three-dimensional thermal equivalent network method. Then, based on the results of the basic thermal property analysis, some design requirements for the water cooling jacket are deduced and a basic design of the water cooling jacket is carried out. Finally, thermal equivalent circuit of the water cooling jacket is attached to the IPMSM's 3D thermal equivalent network and then, the basic thermal and effectiveness analysis are conducted for the case of applying the water cooling jacket to the IPMSM. In the future, the thermal variation trends inside the IPMSM by the application of the water cooling jacket is expected to be quickly and easily predicted even at the design step of the railway traction motor.

• 한국정밀공학회지
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• 제25권5호
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• pp.52-59
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• 2008

The accuracy of the machine tools is degraded because of thermal error of structure due to thermal variation. To improve the accuracy of a machine tools, measurement and prediction of thermal error is very important. The main part of thermal source is spindle due to high speed with friction. The thermal error of spindle is very important because it is over 10% in total thermals errors. In this paper, the suitable thermal error prediction technology for machine tools with open architecture controller is developed and implemented to machine tools. Two thermal error prediction technologies, neural network and multi-linear regression, are investigated in several methods. The multi-linear regression method is more effective for implementation to CNC. The developed thermal error prediction technology is implemented on the internal function of CNC.

• Food Science and Biotechnology
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• 제14권3호
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• pp.334-339
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• 2005

An instrument using thermal probe method was designed to measure thermal conductivity of liquid and solid foods. Thermal conductivity probe was designed with diameter to length ratio of 100 and diameter of 0.51 mm to minimize axial flow effect on thermal conductivity measurement. Thermal conductivities of distilled/deionized water, glycerin, and beef frankfurter meat were measured at $20-80^{\circ}C$. Mean thermal conductivity values of water showed less than 2.0% difference from several reference values without using time correction factor or probe calibration constant. For glycerin, difference was less than 0.7% from reference values at $20-50^{\circ}C$. Mean values of thermal conductivity for beef frankfurter meat ranged from 0.389 to $0.350\;W/m{\cdot}K$ at $20-80^{\circ}C$.

• 한국분말재료학회지
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• 제29권6호
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• pp.505-510
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• 2022

The thermal shock resistance of cement composites with hollow glass microspheres (HGM) is investigated. Cement composites containing various concentrations of HGM are prepared and their properties studied. The density, thermal conductivity, and coefficient of thermal expansion of the composites decrease with increasing HGM concentration. A thermal shock test is performed by cycling between -60 and 50℃. After the thermal shock test, the compressive strength of the cement composite without HGM decreases by 28.4%, whereas the compressive strength of the cement composite with 30 wt% HGM decreases by 5.7%. This confirms that the thermal shock resistance of cement is improved by the incorporation of HGM. This effect is attributed to the reduction of the thermal conductivity and coefficient of thermal expansion of the cement composite because of the incorporation of HGM, thereby reducing the occurrence of defects due to external temperature changes.

• 한국태양에너지학회 논문집
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• 제27권3호
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• pp.155-160
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• 2007

This study shows the results on thermal performance test with domestic solar collector for low-temperature applications using KS, then reveals the efficiency difference between KS and EN standard. Using the test results, this study Presents the status of thermal performance with domestic solar collector including flat-plate, single evacuated, and double evacuated (with mirror or U-tube) solar collector.

• 마이크로전자및패키징학회지
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• 제24권4호
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• pp.91-95
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• 2017

Package-On-Package (PoP) technology is developing toward smaller form factors with high-speed data transfer capabilities to cope with high DDR4x memory capacity. The common application processor (AP) used for PoP devices in smartphones has the bottom package as logic and the top package as memory, which requires both thermally and electrically enhanced functions. Therefore, it is imperative that PoP designs consider both thermal and power distribution network (PDN) issues. Stacked packages have poorer thermal dissipation than single packages. Since the bottom package usually has higher power consumption than the top package, the bottom package impacts the thermal budget of the top package (memory). This paper investigates the thermal and electrical characteristics of PoP designs, particularly the bottom package. Findings include that via and dense via-cluster volume have an important role to lower thermal resistance to the motherboard, which can be an effective way to manage chip hot spots and reduce the thermal impact on the memory package. A Cu block and dense via-cluster layout with an optimal location are proposed to drain the heat from the chip hot spots to motherboard which will enhance thermal and electrical performance at the design stage. The analytical thermal results can be used for design guidelines in 3D packaging.

• 한국정밀공학회지
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• 제27권1호
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• pp.91-98
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• 2010

The increasing of power and processing speed and miniaturization of central processor unit (CPU) used in electronics equipment requires better performing thermal management systems. A typical thermal management package consists of thermal interfaces, heat dissipaters, and external cooling systems. There have been a number of experimental techniques and procedures for estimating thermal conductivity of thin, compressible thermal interface material (TIM). The TIM performance is affected by many factors and thus TIM should be evaluated under specified application conditions. In compact packaging of electronic equipment the chip is interfaced with a thin heat spreader. As the package is made thinner, the coupling between heat flow through TIM and that in the heat spreader becomes stronger. Thus, a TIM characterization system for considering the heat spreader effect is proposed and demonstrated in detail in this paper. The TIM test apparatus developed based on ASTM D-5470 standard for thermal interface resistance measurement of high performance TIM, including the precise measurement of changes in in-situ materials thickness. Thermal impedances are measured and compared for different directions of heat dissipation. The measurement of the TIM under the practical conditions can thus be used as the thermal criteria for the TIM selection.

• 한국전산유체공학회:학술대회논문집
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• 한국전산유체공학회 2009년 춘계학술대회논문집
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• pp.142-147
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• 2009

COMS (Communication, Ocean and Meteorological Satellite) is a geostationary satellite and has been developing by KARI for communication, ocean and meteorological observations. It will be tested under vacuum condition and very low temperature in order to verify thermal design of COMS. The test will be performed by using KARI large thermal vacuum chamber, which was developed by KARI, and the COMS will be the first flight satellite tested in this chamber. The purposes of thermal balance test are to correlate analytical model used for design evaluation and predicting temperatures, and to verify and adjust thermal control concept. KARI has plan to use heating plates to simulate space hot condition especially for radiator panels such as north and south panels. They will be controlled from 90K to 273K by circulating GN2 and LN2 alternatively according to the test phases, while the shroud of the vacuum chamber will be under constant temperature, 90K, during all thermal balance test. This paper presents thermal modelling including test chamber, heating plates and the satellite without solar array wing and Ka-band reflectors and discusses temperature prediction during thermal balance test.

• Journal of Biosystems Engineering
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• 제4권2호
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• pp.53-63
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• 1979

The knowlege of thermal properties of rough rice has become of greate importance to the analysis of heat and mass transfer phenomenon in rice drying and storage process. Some information is available on the thermal properties of rough rice in foreign countries but is not available for these properties in Korea. A fundamental study was made to determine the thermal conductivity and thermal diffusivity of rough rice with line source method and to select current and resistance suitable for these properties from investigating the effect of current and resistance of heating wire on the temperature rise. The result of this study may be summarized as follows ; 1. Even through the power per unit length of heating wires is about the same, the tendency of temperature rise showed a little difference among them , and the suitable range of it for thermal properties was found to be 3.56-5.37w/m. 2. the most desirable resistance and current of heating wire was 18.40 ohm/m, 0.44 amperes among three kinds of heating wires and currents, respectively. because it took 13 minutes or so for the heating wire to reach equilibrium temperature. 3. The thermal conductivity of rough rice was 0.120-0.130 w/m$ ^\circ C$. and thermal diffusivity of it was $5.8210 $\times10^{-8} -9.7529 $\times10^{-8} m^2 /s.$ 4.The thermal conductivity showed a little difference in variation with resistance of heating wire but the variation of current of heating wire at the same resistance did not affect the thermal conductivity , and the thermal diffusivity was not affected by the variation of resistance and current.