• Proceedings of the Korean Society For Composite Materials Conference
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• 1999.11a
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• pp.83-87
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• 1999

The fabrication process and thermal properties of 50~71vol% SiCp/Al metal matrix composites (MMCs) were investigated. The 50~71vol% SiCp/Al MMCs fabricated by pressure infiltration casting process showed that thermal conductivities were 118~170W/mK and coefficient of thermal expansion (CTE) were 9.5~$6.5{\times}10^{-6}/K$. Specially, the thermal conductivity and CTE of 71vol%SiCp/Al MMCs were 115~156W/mK and 6~$7{\times}10^{-6}/K$. respectively, which showed a improved themal properties than the conventional electronic packaging materials such as ceramics and metals.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.377-378
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• 2006

Thermal management technology is a critical element in all new chip generations, caused by a power multiplication combined with a size reduction. A heat sink, mounted on a base plate, requires the use of special materials possessing both high thermal conductivity (TC) and a coefficient of thermal expansion (CTE) that matches semiconductor materials as well as certain packaging ceramics. In this study, nano tungsten coated copper powder has been developed with a wide range of compositions, 90W-10Cu to 10W-90Cu. Powder technologies were used to make samples to evaluate density, TC, and CTE. Measured TC lies among theoretical values predicted by several existing models.

• Journal of the Korean Chemical Society
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• v.47 no.3
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• pp.199-205
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• 2003

Complexes of uranyl ion $UO^{+2}_2$with Schiff-bases obtained by condensing glycylglycine with salicylaldehyde; 2-hydroxy-1-naphthaldehyde, 2,3-dihydroxybenzaldehyde, and 2,4-dihydroxybenzaldehyde have been synthesized and characterized through elemental analysis, conductivity measurements, magnetic susceptibility determinations, u.v., i.r. and $^1H$ nmr spectra as well as d.t.a., t.g. and d.s.c. techniques. Structures and mechanisms of thermal decomposition are proposed.

• Polymer(Korea)
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• v.38 no.4
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• pp.441-448
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• 2014

Polyurethane/melamine phosphate composite foam (MP-PUF) was prepared from poly(adipate)diol/melamine phosphate composite (f=2), polyether-polyol (f=4.6), and PMDI (f=2.5). The thermal properties of MP-PUF such as morphology, closed-cell content, thermal conductivity, and thermal stabilities were characterized. Water was used as a blowing agent, and the composition of melamine phosphate (MP) was maintained at $1.43{\pm}0.3wt%$ of MP-PUF. As the content of water increased, the thermal conductivity of pure polyurethane foam (PUF) decreased, whereas the thermal conductivity of MP-PUF increased. The thermal stabilities of the PUF and the MP-PUF were maximized at 5 php $H_2O$, and then decreased at the higher $H_2O$ contents. The thermal stabilities of MP-PUF were greatly enhanced due to the synergetic effect of MP and urea, which was generated during the blowing process. The temperature of 50% residual mass of MP-PUF increased to $370{\sim}450^{\circ}C$ and the temperature of 30% residual mass exceeded over $700^{\circ}C$. Compared to the PUF, the temperature of 50% residual mass and 30% residual mass were higher than 25 and $70^{\circ}C$, respectively.