• Title/Summary/Keyword: the diffusion process

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Tensile Strength Properties of the Diffusion Bonding Copula Shape for Micro PCD Tool Fabrication (초소형 PCD 공구 제작을 위한 확산접합부의 형상에 따른 인장강도 특성)

  • Jeong, Ba Wi;Kim, Uk Su;Chung, Woo Seop;Park, Jeong Woo
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.14 no.2
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    • pp.25-30
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    • 2015
  • This study involved the fabrication of precision machine tools using a polycrystalline diamond tip [sintered PCD and cemented carbide (WC-Co) tip] and WC-Co shanks via diffusion bonding with a paste-type nickel alloy filler metal. Diffusion bonding is a process whereby two materials are pressed together at high temperature and high pressure for a sufficient period of time to allow significant atomic diffusion to occur. For smooth progress, a filler metal of nickel alloy was used at the interface. Optical microscopy images were used to observe the copula of the bonded layer. It was confirmed that cracks occurred near the junction in all cases. The tensile strength of the bond was measured using a universal testing machine (UTM) with WC-Co proportional test specimens.

적응성 유한체적법을 적용한 다차원 확산공정 모델링

  • 이준하;이흥주;변기량
    • Proceedings of the Korean Society Of Semiconductor Equipment Technology
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    • 2004.05a
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    • pp.55-58
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    • 2004
  • This paper presents a 3-dimensional diffusion simulation with adaptive solution strategy. The developed diffusion simulator VLSIDIF-3 was designed to re-refine areas where difference of doping concentration between any of two nodes of each element is greater than tolerance and redo diffusion process until error is tolerable. Numerical experiment in low doping diffusion problem showed that this adaptive solution strategy is very efficient in both memory and time, and expected this scheme would be more powerful in complex diffusion model.

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Experimental Study of Chlorides Ion Diffusion Characteristics under Combined Condition of Chlorides and Sulfates (염해 및 황산염의 복합작용에 따른 염소이온 확산특성의 실험적 연구)

  • 오병환;김선우;정상화;서정문
    • Proceedings of the Korea Concrete Institute Conference
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    • 2000.10a
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    • pp.413-418
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    • 2000
  • The test results on the deterioration process of concrete under single and combined action of chloride penetration have been obtained. Within the test period of 15 weeks, it is seen that the internally penetrated chloride ion contents are slightly less in the combined action of NaCI and $Na_2SO_4$ than the single action of NaCI. Also the theoretical prediction of chloride penetration based on measured diffusion coefficient agress well with the test data of single deterioration process but disagress with that of combined process. Therefore it should be needed that improved chloride diffusion model for the combined deterioration process.

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Analysis of Bonding Characteristics of a T-shape Structure Fabricated by Superplastic Hydroforming and Diffusion Bonding using two Ti-3Al-2.5V tubes (Ti-3Al-2.5V 튜브의 초소성 하이드로포밍과 확산접합으로 제조된 T형 구조물의 접합 특성 분석)

  • Yoo, Y.H.;Lee, S.Y.
    • Journal of the Korean Society for Heat Treatment
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    • v.31 no.2
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    • pp.49-55
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    • 2018
  • A T-shape structure was manufactured by the superplastic forming and diffusion bonding process using two Ti-3Al-2.5V alloy tubes. A Ti-3Al-2.5V tube was prepared for the hydroforming in the superplastic condition until it reaches a surface area such as a roof welded in the hole of another Ti-3Al-2.5V tube. Afterward, the superplastic forming process and the diffusion bonding process were carried out simultaneously until the appropriate bonding along the interface area of two Ti-3Al-2.5V tubes was obtained. The bonding qualities were different at each location of the entire interface according to the applied process conditions such as strain, pressure, temperature, holding time, geometries, etc. The microstructures of bonding interface have been observed to understand the characteristics of the applied processes in this study.

A Study of Semiconductor Process Simulator with User Friendly Framework (사용자 친숙형 반도체 공정 시뮬레이터의 구성에 관한 연구)

  • 이준하;이흥주
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.5 no.4
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    • pp.331-335
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    • 2004
  • In this paper, we modeling the oxidation, diffusion, and ion-implantation for semiconductor process simulation, and construct the integrated framework for efficient execution and continuous process simulation. For oxidation process, to predict the accurate LOCOS shape and stress distributions, stress-dependent viscous model was performed using SVP algorithm. For diffusion process, predeposition and OED simulation was performed using point defect theory. For ion implantation, Monte-Carlo method based on TRIM simulation was performed with various process conditions. For input to each unit process, we used the dialog boxes which are windows application's standards. This dialog box allows us to verify and minimize input error at input steps. Using the combination of compiler's function and windows's API function, simulation was done with small memory size.

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Ruin probabilities in a risk process perturbed by diffusion with two types of claims (두 가지 유형의 보험청구가 있는 확산과정 리스크 모형의 파산확률)

  • Won, Ho Jeong;Choi, Seung Kyoung;Lee, Eui Yong
    • Journal of the Korean Data and Information Science Society
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    • v.24 no.1
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    • pp.1-12
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    • 2013
  • In this paper, we introduce a continuous-time risk model where the surplus follows a diffusion process with positive drift while being subject to two types of claims. We assume that the sizes of both types of claims are exponentially distributed and that type I claims occur more frequently, however, their sizes are smaller than type II claims. We obtain the ruin probability that the level of the surplus becomes negative, by establishing an integro-differential equation for the ruin probability. We also obtain the ruin probabilities caused by each type of claim and the probability that the level of the surplus becomes negative naturally due to the diffusion process. Finally, we illustrate a numerical example to compare the impacts of two types of claim on the ruin probability of the surplus with that of the diffusion process in the risk model.

Analysis of Counter-diffusion of Aromatic Compounds on Alumina by Spectrophotometry (알루미나에서 방향족화합물의 분광광도법에 의한 역확산 해석)

  • Ko, Tae-Seog;Chung, Kyeong-Hwan
    • Analytical Science and Technology
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    • v.8 no.2
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    • pp.205-213
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    • 1995
  • Counter-diffusion of coronene desorbed from alumina with addition of tetra-phenylporphine was studied by spectrophotometry. The counter-diffusion processes of adsorbing and desorbing materials in liquid phase were simulated by counter-diffusion model based on Fritz's binary component isotherm under an assumption of equimass diffusion. The counter-diffusivities of desorbed coronene with addition of tetra-phenylporphine were as ${\sim}10^{-15}m^2/sec$ and that of adsorbed tetra-phenylporphine as ${\sim}10^{-11}m^2/sec$. The counter-diffusivity of coronene determined from desorption process was smaller by ${\sim}10^5$ times than the diffusivity determined from adsorption process of a single species. The reduction of the determined counter-diffusivity of coronene in desorption process was explained by the cross of diffusion fluxes and build-up of high gradient of coronene in pore.

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