• 한국재료학회지
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• 제15권8호
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• pp.528-535
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• 2005

It is inclined to increase that use of hazardous substances such as lead(Pb), mercury (Hg), cadmium(Cd) etc. are prohibited in the electronics according to environmental friendly policies of an advanced nation for protecting environment of earth. As this reasons, many researches for ensuring the reliability were proceeding in Pb free soldering process. n the flux remains on the PCB(printed circuit board) in the soldering process or the electronics exposed to corrosive environment, it becomes the reasons of breakdown or malfunction of the electronics caused by corrosion. Therefore in this studies we researched the polarization and Tafel properties of Sn40Pb and SnCu system solders based on the electrochemical theory. The experimental polarization curves were measured in distilled ionized water and 1 mole $3.5 wt\%$ NaCl electrolyte of $40^{\circ}C$, pH 7.5. Ag/AgCl and graphite were utilized by reference and counter electrodes, respectively. To observe the electrochemical reaction, polarization test was conducted from -250mV to +250mV. From the polarization curves composed of anodic and cathodic curves, we obtained Tafel slop, reversible electrode potential(Ecorr) and exchange current density((cow). In these results, we compared the corrosion rate of SnPb and SnCu solders.

• 한국재료학회지
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• 제24권3호
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• pp.166-173
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• 2014

The effects of printed circuit board electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) surface finishes on the electromigration reliability and shear strength of Sn-3.5Ag Pb-free solder bump were systematically investigated. In-situ annealing tests were performed in a scanning electron microscope chamber at 130, 150, and $170^{\circ}C$ in order to investigate the growth kinetics of intermetallic compound (IMC). Electromigration lifetime and failure modes were investigated at $150^{\circ}C$ and $1.5{\times}10^5A/cm^2$, while ball shear tests and failure mode analysis were conducted under the high-speed conditions from 10 mm/s to 3000 mm/s. The activation energy of ENIG and OSP surface finishes during annealing were evaluated as 0.84 eV and 0.94 eV, respectively. The solder bumps with ENIG surface finish showed longer electromigration lifetime than OSP surface finish. Shear strengths between ENIG and OSP were similar, and the shear energies decreased with increasing shear speed. Failure analysis showed that electrical and mechanical reliabilities were very closely related to the interfacial IMC stabilities.

• 반도체디스플레이기술학회지
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• 제15권4호
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• pp.10-15
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• 2016

In this paper, novel ball grid array (BGA) interconnection process using solderable anisotropic conductive adhesives (SACAs) with low-melting-point alloy (LMPA) fillers have been developed to enhance the processability in the conventional capillary underfill technique and to overcome the limitations in the no-flow underfill technique. To confirm the feasibility of the proposed technique, BGA interconnection test was performed using two types of SACA with different LMPA concentration (0 and 4 vol%). After the interconnection process, the interconnection characteristics such as morphology of conduction path and electrical properties of BGA assemblies were inspected and compared. The results indicated that BGA assemblies using SACA without LMPA fillers showed weak conduction path formation such as solder bump loss or short circuit formation because of the expansion of air bubbles within the interconnection area due to the relatively high reflow peak temperature. Meanwhile, assemblies using SACA with 4 vol% LMPAs showed stable metallurgical interconnection formation and electrical resistance due to the favorable selective wetting behavior of molten LMPAs for the solder bump and Cu metallization.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2016년도 추계학술대회 논문집
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• pp.153-153
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• 2016

Aluminum alloys have poor corrosion resistance compared to the pure aluminum due to the additive elements. Thus, anodizing technology artificially generating thick oxide films are widely applied nowadays in order to improve corrosion resistance. Anodizing is one of the surface modification techniques, which is commercially applicable to a large surface at a low price. However, most studies up to now have focused on its commercialization with hardly any research on the assessment and improvement of the physical characteristics of the anodized films. Therefore, this study aims to select the optimum temperature of sulfuric electrolyte to perform excellent corrosion resistance in the harsh marine environment through electrochemical experiment in the sea water upon generating porous films by variating the temperatures of sulfuric electrolyte. To fabricate uniform porous film of 5083 aluminum alloy, we conducted electro-polishing under the 25 V at $5^{\circ}C$ condition for three minutes using mixed solution of ethanol (95 %) and perchloric (70 %) acid with volume ratio of 4:1. Afterward, the first step surface modification was performed using sulfuric acid as an electrolyte where the electrolyte concentration was maintained at 10 vol.% by using a jacketed beaker. For anode, 5083 aluminum alloy with thickness of 5 mm and size of $2cm{\times}2cm$ was used, while platinum electrode was used for cathode. The distance between the two was maintained at 3 cm. Afterward, the irregular oxide film that was created in the first step surface modification was removed. For the second step surface modification process (identical to the step 1), etching was performed using mixture of chromic acid (1.8 wt.%) and phosphoric acid (6 wt.%) at $60^{\circ}C$ temperature for 30 minutes. Anodic polarization test was performed at scan rate of 2 mV/s up to +3.0 V vs open circuit potential in natural seawater. Surface morphology was compared using 3D analysis microscope to observe the damage behavior. As a result, the case of surface modification presented a significantly lower corrosion current density than that without modification, indicating excellent corrosion resistance.

• 한국표면공학회지
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• 제49권6호
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• pp.530-538
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• 2016

There is a close relationship between the performance and the heat generation of the electronic device. Heat generation causes a significant degradation of the durability and/or efficiency of the device. It is necessary to have an effective method to release the generated heat. Based on demands of the printed circuit board (PCB) manufacturing, it is necessary to develop a robust and reliable plating technique for substrates with high thermal conductivity, such as alumina ($Al_2O_3$), aluminium nitride (AlN), and silicon nitride ($Si_3N_4$). In this study, the plating of metal layers on an insulating silicon nitride ($Si_3N_4$) ceramic substrate was developed. We formed a Pd-$TiO_2$ adhesion layer and used APTES(3-Aminopropyltriethoxysilane) to form OH groups on the surface and adhere the metal layer on the insulating $Si_3N_4$ substrate. We used an electroless Ni plating without sensitization/activation process, as Pd particles were nucleated on the $TiO_2$ layer. The electrical resistivity of Ni and Cu layers is $7.27{\times}10^{-5}$ and $1.32{\times}10^{-6}ohm-cm$ by 4 point prober, respectively. The adhesion strength is 2.506 N by scratch test.

• 전자공학회논문지C
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• 제35C권9호
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• pp.11-20
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• 1998

고속 복소수 연산장치는 채널등화, 동기신호 복원, 변조 및 복조 등 디지탈 통신 시스템의 기저대역 신호처리에 필수적인 기능블록이다. 본 논문에서는 redundant binary (RB) 연산과 radix-4 Booth recoding을 결합한 새로운 복소수 승산 알고리듬을 제안한다. 제안되는 복소수 승산 방법은 실수 승산기를 사용하는 기존의 방법과 비교하여 부분곱의 수를 반으로 감소시키며, 단순화된 병렬구조로 구현되므로 고속 동작 및 저전력 소모를 가능하게 한다. 제안된 알고리듬을 적용하여 10-bit operand를 갖는 prototype 복소수 승산-누적기(complex-number multiplier-accumulator ; CMAC) 코어를 0.8-㎛ N-Well CMOS 공정으로 설계, 제작하였다. 제작된 CMAC 칩은 18,000여개의 트랜지스터로 구성되며, 코어부분의 면적은 약 1.60 × 1.93 ㎟이다. 제작된 칩을 테스트 보드에 실장하여 특성을 평가한 결과, 전원전압 V/sub DD/=3.3-V에서 120-MHz의 속도로 동작함을 확인하였으며, 이때의 전력소모는 약 63-mW로 측정되었다.

• JSTS:Journal of Semiconductor Technology and Science
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• 제9권1호
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• pp.1-7
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• 2009

This paper describes design of high energy efficiency 32 bit parallel processor core using instruction-levels data gating and dynamic voltage scaling (DVS) techniques. We present instruction-levels data gating technique. We can control activation and switching activity of the function units in the proposed data technique. We present instruction-levels DVS technique without using DC-DC converter and voltage scheduler controlled by the operation system. We can control powers of the function units in the proposed DVS technique. The proposed instruction-levels DVS technique has the simple architecture than complicated DVS which is DC-DC converter and voltage scheduler controlled by the operation system and a hardware implementation is very easy. But, the energy efficiency of the proposed instruction-levels DVS technique having dual-power supply is similar to the complicated DVS which is DC-DC converter and voltage scheduler controlled by the operation system. We simulate the circuit simulation for running test program using Spectra. We selected reduced power supply to 0.667 times of the supplied power supply. The energy efficiency of the proposed 32 bit parallel processor core using instruction-levels data gating and DVS techniques can improve about 88.4% than that of the 32 bit parallel processor core without using those. The designed high energy efficiency 32 bit parallel processor core can utilize as the coprocessor processing massive data at high speed.

• International Journal of Fluid Machinery and Systems
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• 제4권1호
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• pp.179-190
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• 2011

The swirling flow developing in Francis turbine draft tube under part load operation leads to pressure fluctuations usually in the range of 0.2 to 0.4 times the runner rotational frequency resulting from the so-called vortex breakdown. For low cavitation number, the flow features a cavitation vortex rope animated with precession motion. Under given conditions, these pressure fluctuations may lead to undesirable pressure fluctuations in the entire hydraulic system and also produce active power oscillations. For the upper part load range, between 0.7 and 0.85 times the best efficiency discharge, pressure fluctuations may appear in a higher frequency range of 2 to 4 times the runner rotational speed and feature modulations with vortex rope precession. It has been pointed out that for this particular operating point, the vortex rope features elliptical cross section and is animated of a self-rotation. This paper presents an experimental investigation focusing on this peculiar phenomenon, defined as the upper part load vortex rope. The experimental investigation is carried out on a high specific speed Francis turbine scale model installed on a test rig of the EPFL Laboratory for Hydraulic Machines. The selected operating point corresponds to a discharge of 0.83 times the best efficiency discharge. Observations of the cavitation vortex carried out with high speed camera have been recorded and synchronized with pressure fluctuations measurements at the draft tube cone. First, the vortex rope self rotation frequency is evidenced and the related frequency is deduced. Then, the influence of the sigma cavitation number on vortex rope shape and pressure fluctuations is presented. The waterfall diagram of the pressure fluctuations evidences resonance effects with the hydraulic circuit. The influence of outlet bubble cavitation and air injection is also investigated for low cavitation number. The time evolution of the vortex rope volume is compared with pressure fluctuations time evolution using image processing. Finally, the influence of the Froude number on the vortex rope shape and the associated pressure fluctuations is analyzed by varying the rotational speed.

• 한국전자파학회논문지
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• 제11권1호
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• pp.18-25
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• 2000

본 논문에서는 YIG 발진기(YTO)를 사용한 산업용 FM-CW 마이크로파 거리계를 설계 제작하여, 그 측정 겸과를 제시하였다.YTO는 주파수 선형성이 매우 우수하므로 거리계의 구성에서 별도의 선형화 장치를 필요로 하지 않는다. 운용환경 주변의 장애물로부터 발생되는 반사 선호를 제거하기 위해서 중간주파 선호에 디지털 대역통과 필터를 적용하였다. 이를 위해서 Kaiser window를 사용한 FIR 필터가 설계되었다. 거리 측정 테스트는 4 40m까지 측정할 수 있는 야외 시험장에서 1m 간격으로 실시되었으며, 측정오차의 표준편차가2.33 cm인 측정 결과플 얻었다 본 논문에서 제작된 마이크로파 거리계는 제철소의 용선 운반 차량과 같이 사람이 접근하기 어 려운 산업 시설에서 거리측정용으로 사용될 수 있다

• 조명전기설비학회논문지
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• 제14권4호
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• pp.1-7
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• 2000

본 논문에서 원전의 핵연료 다발의 중섬자속을 측정할 수 있는 노내중성지속 감시계통의 구동모터를 제어하기 위한 스위치의 오동작 원인 분석 및 이 문제를 해결하기 위한 방안을 제시하고자 한다. 노내중성자속 감시계동은 검출기 안내관을 통해 검출기가 노심으로 삽입되거나 인출될 경우 접점선호를 발생하는 기계식 스위치레버를 장착하고 있다. 그러나 기계적인 열화나 환경적인 요인에 의해 기계식 스위치레버의 특성이 점점 변화되어 마침내 잘못된 접점신호를 발생하게 된다. 그러므로 아들 문제 해결을 위해 기계식 스위지 대선 전자식 스위치를 검출기 안내관 밖에 배치하였고, 공진효과를 이용하여 점점신호를 발생하는 회로개선과 소음 및 전기적 방해를 방지하기 위한 콘데서를 전자회로 전원 입력측에 설치하였다. 이러한 개선을 완료한 후, 여러 조건하에서 이 향상된 스위치 제어회로를 반복적으로 시험하였는데, 결국 이를 통해 원하는 접점신호를 얻게되었을 뿐 아니라 발전소 정상운전 중에 관련시스템의 주기시험을 통해서도 검출기 접점 오동작 신호가 발생되지 않음울 확인할 수 있게 되었다.