• Korean Journal of Plant Resources
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• v.23 no.1
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• pp.25-30
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• 2010

This study was carried out to understand the effect of low temperature($4^{\circ}C$), heat shock($37^{\circ}C$) and drought stresses on the growth and gene expression of Arabidopsis ATSIZ3(at1g08910) mutants. The seedling growth of SIZ3-mutants were markedly inhibited by the treatment of heat shock or chilling stresses. However, there was no significant differences between wild type and SIZ3-mutants in seeding fresh weight. As compared to wild type plants, SIZ3-mutants showed 63.9% inhibition of seedling fresh weight by the treatment of 10 days drought stress, suggesting that SIZ3 is involved in the resistance of Arabidopsis to drought stress. Base on RT-PCR analysis, expression of SIZ3 mRNA in the wild type showed 20% inhibition by chilling stress, 3.7 and 4.5 fold increase by the treatment of heat shock or drought stresses, respectively.

• Journal of Marine Life Science
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• v.5 no.1
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• pp.17-24
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• 2020

We have identified a heat shock protein 70 gene from freshwater snail, Semisulcospira coreana. The freshwater snail HSP70 gene encode a polypeptide of 639 amino acids. Based on bioinformatic sequence characterization, HSP70 gene possessed three classical signature motifs and other conserved residues essential for their functionality. The phylogenetic analysis showed that S. coreana HSP70 had closet relationship with that of golden apple snails, Pomacea canaliculata. The HSP70 mRNA level was significantly up-regulated in response to thermal and salinity challenges. These results are in agreement with the results of other species, indicating that S. coreana HSP70 used be a potential molecular marker in response to external stressors and the regulatory process related to the HSP70 transcriptional response can be highly conserved among species.

• Nuclear Engineering and Technology
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• v.51 no.1
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• pp.190-197
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• 2019

W-K-TiC alloys with different titanium carbide concentrations (0.05, 0.1, 0.25, 0.5, 1, 2) wt.% were fabricated through Mechanical Alloying and Spark Plasma Sintering. The effects of the addition of nano-scaled TiC particles on the relative density, Vickers micro-hardness, microstructure, crystal information, thermal shock resistance, and tensile strength were investigated. It is revealed that the doped TiC nano-particles located at the grain boundaries. The relative density and Vickers micro-hardness of W-K-TiC alloys was enhanced with TiC addition and the highest Vickers micro-hardness is 731.55. As the TiC addition increased from 0.05 to 2 wt%, the room-temperature tensile strength raised from 141 to 353 MPa. The grain size of the W-K-TiC alloys decreased sharply from $2.56{\mu}m$ to 330 nm with the enhanced TiC doping. The resistance to thermal shock damage of W-K-TiC alloys was improved slightly with the increased TiC addition.

• Proceedings of the Korean Nuclear Society Conference
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• 2002.10a
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• pp.414.1-414
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• 2002

• Transactions of the Korean Society of Mechanical Engineers A
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• v.22 no.1
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• pp.73-79
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• 1998

The development of a new material which should be continuously usable under severe environment of very high temperature has been urgently requested. The conventional thermal barrier coating(TBC) is a two layer coating, but a composition and a microstructure of functionally graded material(FGM) are varied continuously from place to place in ways designed to provide it with the maximum function of mitigating the induced thermal stress. The purpose of this study is to evaluate the heat-resistant characteristics by thermal shock of laser and furnace heating. The fracture behaviors of non-FGM(NFGM) and FGM were investigated based on acoustic emission(AE) technique during thermal shock test. Therefore, it can be concluded that FGM gives higher thermal resistance compared to NFGM by AE signal and fracture surface analysis.

• Journal of The Korean Astronomical Society
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• v.37 no.5
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• pp.299-305
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• 2004

We find evidence of a hard X-ray excess above the thermal emission in two cool clusters (Abell 1750 and IC 1262) and a soft excess in two hot clusters (Abell 754 and Abell 2163). Our modeling shows that the excess components in Abell 1750, IC 1262, and Abell 2163 are best fit by a steep power law indicative of a significant non-thermal component. In the case of Abell 754, the excess emission is thermal, 1 ke V emission. We analyze the dynamical state of each cluster and find evidence of an ongoing or recent merger in all four clusters. In the case of Abell 2163, the detected, steep spectrum, non-thermal X-ray emission is shown to be associated with the weak merger shock seen in the temperature map. However, this shock is not able to produce the flatter spectrum radio halo which we attribute to post-shock turbulence. In Abell 1750 and IC 1262, the shocked gas appears to be spatially correlated with non-thermal emission suggesting cosmic-ray acceleration at the shock front.

• Journal of the Korean Ceramic Society
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• v.42 no.8 s.279
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• pp.532-536
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• 2005

Thermal shock resistance of structural ceramics is a property that is difficult to quantity, and as such is usually expressed in terms of a number of empirical resistance parameters. These are dependant on the conditions imposed, but one method that can be used is the examination of density, Young's modulus and thermal expansion retention after quenching. For high temperature applications, long-annealing thermal durability, cycle thermal stability and residual mechanical properties are very important if these materials are to be used between $1000^{\circ}C$ and $1300^{\circ}C$. In this study, an excellent thermal shock-resistant material based on $Al_2TiO_5-mullite$ composites of various compositions was fabricated by sintering reaction from the individual oxides and adjusting the composition of $Al_2O_3TiO_2/SiO_2$ ratios. The characterization of the damage induced by thermal shock was done by measuring the evolution of the Young's modulus using ultrasonic analysis, density and thermal expansion coefficients.

• Molecules and Cells
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• v.23 no.2
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• pp.239-245
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• 2007

DnaK is a major antigen in Streptococcus pneumoniae, and is induced by a minor shift in temperature (30 to $37^{\circ}C$) but not by ethanol shock. Although HrcA in the presence of $Ca^{{+}{+}}$ represses the expression of both groEL and hrcA, the control of transcription of the dnaK operon is not completely understood. In this study, the dnaK operon of S. pneumoniae (5' hrcA-grpE-dnaK-dnaJ) was cloned and analyzed. It contains large intergenic regions in grpE/dnaK and dnaK/dnaJ. Pulse labeling with [$^{35}S$]-methionine and immunoblot analyses revealed the presence of higher levels of DnaK than of HrcA even in the presence of $Ca^{{+}{+}}$ after heat shock suggesting that $Ca^{{+}{+}}$ differentially regulates the heat shock responses of hrcA and dnaK. By blocking de novo mRNA synthesis with rifampin it was shown that neither the hrcA nor the groEL transcripts were stabilized by heat shock even though dnaK transcripts were stabilized. We conclude that S. pneumoniae uses fine regulation of the transcription of the individual genes of the tetracistronic dnaK operon to cope with the various stresses experienced during infections.

• Journal of Animal Environmental Science
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• v.20 no.4
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• pp.147-154
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• 2014

Heat stress is a significant burden to animal production in most areas of the world. Improving our knowledge of physiological and metabolic mechanisms of acclimation may contribute to the development of procedures that may help to maintain health and production efficiency under hot temperature. The effect of Ulmus pumila (UP) extract in inducing Heat Shock Proteins (HSPs) expression in heat-stressed RAW264.7 macrophage cells was investigated. Cell viability assay showed a dose dependent increase in cells after treatment with UP for 24 hours. RT-PCR and western blot analysis showed that increasing concentrations of UP induce the expression of Heat Shock Factor 1 (HSF1) and dose dependently upregulated the expression of Heat shock protein 70 (Hsp70) and Hsp90. LPS-induced nitric oxide was dose-dependently reduced while phagocytic activity greatly recovered with UP treatment. These data demonstrated that UP can be a potential candidate in the development of cytoprotective agent against heat stress.

• Korean Journal of Materials Research
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• v.17 no.3
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• pp.152-159
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• 2007

When the electronics are tested with thermal shock for Pb-free solder joint reliability, there are temperature conditions with use environment but number of cycles for test don't clearly exist. To obtain the long term reliability data, electronic companies have spent the cost and times. Therefore this studies show the test method and number of thermal shock cycles for evaluating the solder joint reliability of electronic components and also research bonding strength variation with formation and growth of intermetallic compounds (IMC). SMD (surface mount device) 3216 chip resistor and 44 pin QFP (quad flat package) was utilized for experiments and each components were soldered with Sn-40Pb and Sn-3.0 Ag-0.5 Cu solder on the FR-4 PCB(printed circuit board) using by reflow soldering process. To reliability evaluation, thermal shock test was conducted between $-40^{\circ}C\;and\;+125^{\circ}C$ for 2,000 cycles, 10 minute dwell time, respectively. Also we analyzed the IMCs of solder joint using by SEM and EDX. To compare with bonding strength, resistor and QFP were tested shear strength and $45^{\circ}$ lead pull strength, respectively. From these results, optimized number of cycles was proposed with variation of bonding strength under thermal shock.