• Journal of the Korean Crystal Growth and Crystal Technology
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• v.25 no.4
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• pp.153-159
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• 2015

Inorganic pigments have been received a great attention for various applications including paint, glazed ceramic ink, art tile, and building exterior due to their excellent thermal and chemical stability. Traditionally, the compositions of $PbCrO_4$, CdS and CdSe have been widely used as a yellow inorganic pigment. However, the use of these compositions has been restricted in recent years, because they contain harmful elements such as Cd, Cr, Pb and Se. In this study, new environment-friendly ceria-based pigment was synthesized using solid state reaction. Crystal structure and morphology of the obtained $Ce_{1-x}Zr_xBi_yO_{2-y/2}$ yellow pigment were analyzed using XRD and SEM, respectively. Substitutional effect of Zr and Bi on the pigment color was analyzed using UV-vis. spectrophotometer and CIE $L^*a^*b^*$ analysis. The crystal structure of the obtained pigments was dependent on the calcination temperature. The color characteristics and absorption band of the pigments were dependent on the calcination temperature and Zr, Bi contents. As a result, all the obtained yellow pigments showed the effective absorption ranged from ultraviolet to visible light, and $Ce_{0.44}Zr_{0.36}Bi_{0.20}O_{0.19}$ (x = 0.36, y = 0.20) pigment showed the most brilliant yellow color.

• Journal of the Korean Society for Precision Engineering
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• v.3 no.1
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• pp.40-49
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• 1986

Crack, craze and void are common defects which may be found in the bulk of polymeric materials such as either themoplastics or thermosets. The healing phenomena, autohesion, of these defects are known to be a intrinsic material property of various polymeric materials. However, only a few experimental and theoretical investigations on crack, void and craze healing phenomena for various polymeric materials have been reported up to date [1, 2, 3]. This may be partly due to the complications of healing processes and lacking of appropriate theoretical developments. Recently, some investigators have been urged to study the healing phenomena of various polymenic materials since the significance of the use of polymer based alloys or composites has been raised in terms of specific strength and energy saving. In the earlier published reports [1, 2, 3, 4], the crack and void healing velocity, healing toughness and some other healing mechanical and physical properties were measured experimentally and compared with predicted values by utilizing a simple model such as the reptation model under some resonable assumptions. It seems, however, that the general acceptance of the proposed modeling analyses is yet open question. The crack healing processes seem to be complicate and highly dependent on the state of virgin material in terms of mechanical and physical properties. Furthermore, it is also strongly dependent on the histories of crack, craze and void development including fracture suface morphology, the shape of void and the degree of disentanglement of fibril in the craze. The rate of crack healing may be a function of environmental factors such as healing temperature, time and pressure which gives different contact configurations between two separated surfaces. It seems to be reasonable to assume that the crack healing processes may be divided in several distinguished steps like stress relaxation with molecular chain arrangement, surface contact (wetting), inter- diffusion process and com;oete healing (to obtain the original strength). In this context, it is likely that we no longer have to accept the limitation of cumulative damage theories and fatigue life if it is probable to remove the defects such as crack, craze and void and to restore the original strength of polymers or polymer based compowites by suitable choice of healing histories and methods. In this paper, we wish to present a very simple and intuitive theoretical model for the prediction of healed fracture toughness of cracked or defective polymeric components. The central idea of this investigation, thus, may be the modeling of behavior of chain molecules under healing conditions including the effects of chain scission on the healing processes. The validity of this proposed model will be studied by making comparisons between theoretically predicted values and experimentally determined results in near future and will be reported elsewhere.

• Journal of the Korea Concrete Institute
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• v.25 no.5
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• pp.497-508
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• 2013

This paper introduces a numerical model which can evaluate the fire-resistant capacity of reinforced concrete members. On the basis of the transient heat transfer considering the heat conduction, convection and radiation, time-dependent temperature distribution across a section is determined. A layered fiber section method is adopted to consider non-linear material properties depending on the temperature and varying with the position of a fiber. Furthermore, effects of non-mechanical strains of each fiber like thermal expansion, transient strain and creep strain are reflected on the non-linear structural analysis to take into account the extreme temperature variation induced by the fire. Analysis results by the numerical model are compared with experimental data from the standard fire tests to validate an exactness of the introduced numerical model. Also, time-dependent changes in the resisting capacities of reinforced concrete members exposed to fire are investigated through the analyses and, the resisting capacities evaluated are compared with those determined by the design code.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.2
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• pp.49-53
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• 2017

We study on the change of electrical properties of two-dimensional (2D) $SnSe_2$ materials with respect to Cl doping as $SnSe_{1.994}Cl_{0.006}$ under a high temperature condition. (300~450 K) By the simple solid-state reaction method, non-and Cl-doped 2D $SnSe_2$ materials are successfully synthesized with negligible impurities as confirmed by X-ray diffraction. From the temperature dependence of resistivity, it is observed that the conduction mechanism is changed from hopping to degenerate conduction with Cl doping. By Hall effect measurement, an increase on electron carrier concentration from ${\sim}7{\times}10^{16}$ to ${\sim}3{\times}10^{18}cm^{-3}$ with Cl doping verifies that Cl is an effective electron donor which results in the encouraged carrier concentration. Detailed analysis for temperature dependent Hall mobility reveals that the electrical transports in high temperature regime are governed by the grain boundary-controlled mechanism for non-doped $SnSe_2$, which is effectively suppressed by Cl-doping as entering metallic transport regime.

• Journal of the Korean Vacuum Society
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• v.18 no.3
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• pp.213-220
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• 2009

The optimal condition of low temperature deposition of transparent conductive Al-doped zinc oxide (AZO) films is studied by RF magnetron sputtering method. To achieve enhanced-electrical property and good crystallites quality, we tried to deposit on glass using a two-step growth process. This process was to deposit AZO buffer layer with optimal growth condition on glass in-situ state. The AZO film grown at rf 120 W on buffer layer prepared at RF $50{\sim}60\;W$ shows the electrical resistivity $3.9{\times}10^{-4}{\Omega}cm$, Carrier concentration $1.22{\times}10^{21}/cm^3$, and mobility $9.9\;cm^2/Vs$ in these results, The crystallinity of AZO film on buffer layer was similar to that of AZO film on glass with no buffer later but the electrical properties of the AZO film were 30% improved than that of the AZO film with no buffer layer. Therefore, the cause of enhanced electrical properties was explained to be dependent on degree of crystallization and on buffer layer's compressive stress by variation of $Ar^+$ ion impinging energy.

• Journal of the Korea Concrete Institute
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• v.24 no.5
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• pp.567-575
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• 2012

A research was conducted to develop a 2-D nonlinear Galerkin finite element analysis of reinforced concrete structures subjected to high temperature with experiments. Algorithms for calculating the closed-form element stiffness for a triangular element with a fully populated material conductance are developed. The validity of the numerical model used in the program is established by comparing the prediction from the computer program with results from full-scale fire resistance tests. Details of fire resistance experiments carried out on reinforced concrete slabs, together with results, are presented. The results obtained from experimental test indicated in that the proposed numerical model and the implemented codes are accurate and reliable. The changes in thermal parameters are discussed from the point of view of changes of structure and chemical composition due to the high temperature exposure. The proposed numerical model takes into account time-varying thermal loads, convection and radiation affected heat fluctuation, and temperature-dependent material properties. Although, this study considered standard fire scenario for reinforced concrete slabs, other time versus temperature relationship can be easily incorporated.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.9
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• pp.1408-1414
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• 2004

The use of flip-chip technology has many advantages over other approaches for high-density electronic packaging. ACF (anisotropic conductive film) is one of the major flip-chip technologies, which has short chip-to-chip interconnection length, high productivity, and miniaturization of package. In this study, thermal fatigue lift of ACF bonding flip-chip package has been predicted. Elastic and thermal properties of ACF were measured by using DMA and TMA. Temperature dependent nonlinear hi-thermal analysis was conducted and the result was compared with Moire interferometer experiment. Calculated displacement field was well matched with experimental result. Thermal fatigue analysis was also conducted. The maximum shear strain occurs at the outmost located bump. Shear stress-strain curve was obtained to calculate fatigue life. Fatigue model for electronic adhesives was used to predict thermal fatigue life of ACF bonding flip-chip packaging. DOE (Design of Experiment) technique was used to find important design factors. The results show that PCB CTE (Coefficient of Thermal Expansion) and elastic modulus of ACF material are important material parameters. And as important design parameters, chip width, bump pitch and bump width were chose. 2$^{nd}$ DOE was conducted to obtain RSM equation far the choose 3 design parameter. The coefficient of determination ($R^2$) for the calculated RSM equation is 0.99934. Optimum design is conducted using the RSM equation. MMFD (Modified Method for feasible Direction) algorithm is used to optimum design. The optimum value for chip width, bump pitch and bump width were 7.87mm, 430$\mu$m, and 78$\mu$m, respectively. Approximately, 1400 cycles have been expected under optimum conditions. Reliability analysis was conducted to find out guideline for control range of design parameter. Sigma value was calculated with changing standard deviation of design variable. To acquire 6 sigma level thermal fatigue reliability, the Std. Deviation of design parameter should be controlled within 3% of average value.

• Journal of Korean Society of Steel Construction
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• v.12 no.6
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• pp.759-767
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• 2000

In this study, the time dependent internal stress changes of a Concrete Filled Steel Tube(CFT) column during a fire test were quantitatively analyzed. The strain ratio of a CFT column on the different loads was measured by tensile strength tests in terms of yield strength, tensile strength average extensibility and elasticity modulus. To understand the internal material properties change of concrete in CFT column damaged due to a fire, the compressive strength and elastic modulus tests were measured on a core sample from the center of the steel tube after the fire test. The elastic modulus test measured the strain from the stress. To determine the fire temperature of the test material, a differential thermal analysis was done. From the tested result, the gained data were conducted and an analysis method was suggested. The purpose of this work is to suggest a basic data for structure regulation enactments of the internal fire design of CFT.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.215-215
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• 2010

The feasibility of InSbTe (IST) chalcogenide materials prepared by metalorganic chemical vapor deposition (MOCVD) for phase-change memory (PRAM) applications was demonstrated. Films grown below $225^{\circ}C$ exhibited an amorphous structure, and the films grown at $300^{\circ}C$ Cincluded various crystalline phases such as In-Sb-Te, In-Sb, In-Te, and Sb-Te. The composition of the amorphous films grown at $225^{\circ}C$ was dependent on the working pressure. Films grown at $225^{\circ}C$ exhibited a smooth morphology with a root mean square(rms) roughness of less than 1nm, and the step-coverage of the films grown on a trench structure with an aspect ratio of 5:1 was greater than 90%. An increase in deposition time increased the filling rate, while retaining the conformal step-coverage. Films grown at $225^{\circ}C$ for 3h in a working pressure of $13{\times}10^2$ Pa exhibited a reproducible and complete filling in a trench structure.

• Journal of the Society of Naval Architects of Korea
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• v.53 no.2
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• pp.85-91
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• 2016

The most important factor in the structural design of ships and offshore structures operating in arctic region is ice load, which results from ice-structure interaction during the ice collision process. The mechanical properties of ice related to strength and failure, however, show very complicated aspect varying with temperature, volume fraction of brine, grain size, strain rate and etc. So it is nearly impossible to establish a perfect material model of ice satisfying all the mechanical characteristics completely. Therefore, in general, ice collision analysis was carried out by relatively simple material models considering only specific aspects of mechanical characteristics of ice and it would be the most significant cause of inevitable errors in the analysis. Especially, it is well-known that the most distinctive mechanical property of ice is high dependency on strain rate. Ice shows brittle attribute in higher strain rate while it becomes ductile in lower strain rate range. In this study, the simulation method of ice collision to ship hull using the nonlinear dynamic FE analysis was dealt with. To consider the strain rate effects of ice during ice-structural interaction, strain rate dependent constitutive model in which yield stress and hardening behaviors vary with strain rate was adopted. To reduce the huge amount of computing time, the modeling range of ice and ship structure were restricted to the confined region of interest. Under the various scenario of ice-ship hull collision, the structural behavior of hull panels and failure modes of ice were examined by nonlinear FE analysis technique.