• International Journal of Fuzzy Logic and Intelligent Systems
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• 제6권2호
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• pp.95-99
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• 2006

A tape feeder of a SMD(Surface Mount Device) mounter is a device that sequentially feeds electronic components on a tape reel to the pick-up system of the mounter. As components are getting much smaller, feeding accuracy of a feeder becomes one of the most important factors for successful component pick-up. Therefore, it is critical to keep the feeding accuracy to a specified level in the assembly and production of tape feeders. This paper describes a tape feeder inspection system that was developed to automatically measure and to inspect feeding accuracy using machine vision. It consists of a feeder base, an image acquisition system, and a personal computer. The image acquisition system is composed of CCD cameras with lens, LED illumination systems, and a frame grabber inside the PC. This system loads up to six feeders at a time and inspects them automatically and sequentially. The inspection software was implemented using Visual C++ on Windows with easily usable GUI. Using this system, we can automatically measure and inspect the quality of ail feeders in production process by analyzing the measurement results statistically.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
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• pp.69-72
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• 2004

In order to use HTS tape on electric power applications, such as cable, motor, transformer, fault current limiter, a long length of HTS tape with a good uniformity of critical current is inevitable. The longer length of HTS tape, the wider in the range of application and the lower cost of HTS tape. In this study three long length Bi-2223/Ag tapes(268m, 253m and 187m) were fabricated. Critical current uniformity along the length was greatly improved through the optimization of cold deformation and thermo-mechanical process. Average critical current of the tapes was 63.2 A, 54.6 A and 64.2 A, respectively Critical tensile strength and critical bending radius (77 K, 5 % Ic degradation) was 135 MPa and 56 m, respectively.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2000년도 추계학술대회논문집B
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• pp.186-191
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• 2000

Stability of a Bi-2223/Ag tape was studied by using a numerical method. A numerical modeling has been developed to analyze the dynamic evolution of normal zone in a composite tape Bi-2223/Ag. In this paper, the stability of HTS tape is studied by considering the non-uniform temperature distribution in a cross-sectional area. The finite-difference method(FDM) is used to solve the two-dimensional heat conduction equation. Two kinds of analyses are compared to quantify the critical disturbance energy fur quenching HTS tapes. One is the length-thickness(x-y) side and the other is the length-width(x-z) side. The results of analyses shows that the critical disturbance energies for each cases seem to be very close for considered Bi-2223/Ag tape.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2000년도 추계학술발표강연 및 논문개요집
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• pp.80-80
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• 2000

차세대 대화면 평판 디스플레이에서 가장 주목을 받고 있는 디스플레이 소자는 PDP라고 할 수 있다. PDP 패널 제조 공정 기술에서 난해한 공정 중 하나인 투명 유전체 제조 공정은 현재까지 인쇄법에 의한 연구가 주로 진행되어 왔다. 그러나 인쇄법은 여러 번의 인쇄와 건조, 소성이 반복되어야 함으로써 유전체 제조에 있어서 복잡한 제조 공정이므로 대폭 단순화할 필요가 있다. 이에 대한 해결책으로서 제시된 것이 tape casting을 이용한 건식 공정이다. 본 연구에서는 tape casting용 slurry에 포함되는 유기물인 binder, plasticizer, solvent의 변화에 따른 dry film의 특성 및 소성 조건에 따른 유전체 특성에 관하여 조사하였다. PbO-SiO$_2$-B$_2$O$_3$계 유리 분말과 유기 vehicle을 ball mill을 이용하여 분산, 혼합하여 tape casting용 slurry를 제조하고, 이 slurry를 doctor blade법으로 tape를 제조하고 건조한 후 유리기판에 transfer한 후 소성하였다. Slurry의 조건과 소성 조건에 따른 투광성, 표면 조도 및 단면의 미세구조 등 투명 유전체의 특성을 평가하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 춘계학술대회 논문집
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• pp.300-303
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• 1999

For the fast dry of the aqueous tape, the process which water was replaced by organic solvent was proposed. So-called, it was the solvent washing dry, Three organic solvents (methanol, ethanol, and acetone) were selected for the washing solvent. The weight loss of the washed tapes was measured to evaluate the dry rate of the tapes and dried tapes were examined the generation of the cracks with the variations of the organic solvent and the washing time. Methanol, ethanol, and acetone were all available organic solvents for this method. The tapes washed in methanol, ethanol, and acetone were dried rapidly for twenty minutes. After thirty minutes, the weight losses were not any more. The solvent of the lower surface tension can decreases the crack of dried tape. If solvent substitutes water completely, though it was fast dried, crack can be eliminated. The tape casting system was designed for the solvent washing dry and prepared. An homogeneous tape was established by continuous tape casting process.

• 대한전기학회논문지:전기기기및에너지변환시스템부문B
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• 제54권12호
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• pp.586-591
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• 2005

Magnetization loss of high temperature superconductoring BSCCO tape and YBCO coated conductor(YBCO CC) is most important issue in the development of superconducting power devices. In this paper, the measured results of magnetization losses in BSCCO tape and YBCO CC are presented and compared with each other. Measurements of magnetization losses are performed under various angles of external magnetic field to consider the anisotropic characteristics of YBCO CC. Also, we present the compared results of magnetization losses measured at arbitrary directional magnetic fields and analyzed with perpendicular magnetic field components of those. The results show that magnetization loss of YBCO CC agree well with the analyzed value by it's perpendicular magnetic field component, but BSCCO tape is not.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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• pp.284-285
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• 2005

Bi-2223 High-Temperature Superconducting(HTS) tape is one of the most widely used HTS tape for power application. Characteristics of the over current of HTS tape with different sheath are described. This paper presents the basic properties such as temperature and resistivity rise of the Bi-2223 HTS tape which is exposed to the over current. It is expected that results from this study can be utilized as basic data in designing superconducting power devices.

• 한국초전도학회:학술대회논문집
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• 한국초전도학회 1999년도 High Temperature Superconductivity Vol.IX
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• pp.280-290
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• 1999

The microstructures of a Tl$_{0.8}Pb_{0.2}Bi_{0.2}Sr_{1.6}Ca_2Cu_3O_{9+{\delta}}$/Ag tape (tape I ) with J$_c$ of 17,600 A/cm$^2$ at 77 K and 0 T and three Tl$_{0.8}Pb_{0.2}Bi_{0.2}Sr_{1.8}Ba_{0.2}Ca_{2.2}Cu_3O_{9+{\delta}}$/Ag tapes with J$_c$'s of 9,300 (tape II), 16,700 (tape III) and 25,200 A/cm$^2$ (tape IV)prepared using the powder-in-tube method and an in-situ reaction method, were investigated using scanning electron microscopy and high-resolution transmission electron microscopy, and compared each other. ln the tape preparation, an intermediate rolling process was incorporated during final heat-treatment for the last tape, but not for the rest of the tapes. The microstructural analysis revealed clear differences in grain-texturing, crystallographic defects and impurity phases, depending on the chemical composition of the tape. Tendency of directional grain-alignment increased in an order of tapes I, II III and IV. In tape IV, T1-1223 grains are textured, at least in local regions. In crystallographic defects, while stacking faults were prevalent in the former composition, dislocations and voids were frequently observed in the latter. Also impurity phases were appeared to be more abundant in the former than in the latter. The relationship between 1,and the microstructure in the tapes was attempted to explain in a term of grain-linking.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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• pp.26-27
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• 2006

The fundamental mechanical characteristics under tensile and bending deformations of hermetically-sealed reinforced Bi-2223 tape and CTOP processed Bi-2223 tape were examined at 77K. Also, the Tensile strain dependence of the critical current, $I_c$, was obtained at 77K and self-field. The reinforced hermetic tape showed higher tensile strength and a better Tensile strain tolerance than the CTOP processed tape. For bending tests, a rho-shaped sample holder was used giving multiple bending strains. in increasing order. In the same case under bending deformation, the hermetic tape showed a higher bending strain tolerance than the CTOP processed tape. This higher strength of the hermetic tape can be attributed to the thick hardened copper reinforcement layer.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집
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• pp.32-35
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• 2002

The work focuses on the development of a Cu lead-frame with a single-sided adhesive tape for cost reduction and reliability improvement of LOC (lead on chip) package products, which are widely used for the plastic-encapsulation of memory chips. Most of memory chips are assembled by the LOC packaging process where the top surface of the chip is directly attached to the area of the lead-frame with a double-sided adhesive tape. However, since the lower adhesive layer of the double-sided adhesive tape reveals the disparity in the coefficient of thermal expansion from the silicon chip by more than 20 times, it often causes thermal displacement-induced damage of the IC pattern on the active chip surface during the reliability test. So, in order to solve these problems, in the resent work, the double-sided adhesive tape is replaced by a single-sided adhesive tape. The single-sided adhesive tape does net include the lower adhesive layer but instead, uses adhesive materials, which are filled in clear holes of the base film, just for the attachment of the lead-frame to the top surface of the memory chip. Since thermal expansion of the adhesive materials can be accommodated by the base film, memory product packaged using the lead-flame with the single-sided adhesive tape is shown to have much improved reliability. Author allied this invention to the Korea Patent Office for a patent (4-2000-00097-9).