• Journal of the Korean Society for Precision Engineering
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• v.28 no.3
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• pp.265-274
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• 2011

This paper presents current state of the prediction simulator of structural characteristics of machinery equipment accuracy. Developed accuracy prediction simulator proceeds and estimates the structural analysis between the designer and simulator through the internet for convenience of designer. 3D CAD model which is input to the accuracy prediction simulator would simplified by the process of removing the small hole, fillet and chamfer. And the structural surface joints would be presented as the spring elements and damping elements for the structural analysis. The structural analysis of machinery equipment joints, containing rotary motion unit, linear motion unit, mounting device and bolted joint, are presented using Finite Element Method and their experiment. Finally, a general method is presented to tune the static stiffness at a rotation joint considering the whole machinery equipment system by interactive use of Finite Element Method and static load experiment.

• Journal of the Semiconductor & Display Technology
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• v.15 no.3
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• pp.18-23
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• 2016

QFN (Quad Flat No-leads Package) is one of the SMD (Surface Mount Device). Since there is no lead in QFN, there are many defects on solder. Therefore, we propose an efficient mechanism for QFN solder defect detection at this paper. For this, we employ Convolutional Neural Network (CNN) of the Machine Learning algorithm. QFN solder's color multi-layer images are used to train CNN. Since these images are 3-channel color images, they have a problem with applying to CNN. To solve this problem, we used each 1-channel grayscale image (Red, Green, Blue) that was separated from 3-channel color images. We were able to detect QFN solder defects by using this CNN. In this paper, it is shown that the CNN is superior to the conventional multi-layer neural networks in detecting QFN solder defects. Later, further research is needed to detect other QFN.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05c
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• pp.291-294
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• 2003

The circuit substrate was made from the Low Temperature Cofired Ceramics(LTCC) that a $\varepsilon_\gamma$ was 7.8. Accumulated Varactor and the low noise transistor which were a Surface Mount Device-type element on LTCC substrate. Let passive element composed R, L, C with strip-line of three dimension in the multilayer substrate circuit inside, and one structure accumulate band-pass filter, resonator, a bias line, a matching circuit, and made it. Used Screen-Print process, and made Strip-line resonator. A design produced and multilayer-type VCO(Voltage Controlled Oscillator), and recognized a characteristic with the Spectrum Analyzer which was measurement equipment. Measured multilayer structure VCO is oscillation frequency 1292[MHz], oscillation output -28.38[dBm], hamonics characteristic -45[dBc] in control voltage 1.5[V], A phase noise is -68.22[dBc/Hz] in 100 KHz offset frequency. The oscillation frequency variable characteristic showed 30[MHz/V] characteristic, and consumption electric current is approximately 10[mA].

• Agribusiness and Information Management
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• v.6 no.1
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• pp.37-44
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• 2014

This study was conducted to evaluate light intensity and uniformity of two SMD (surface-mount device) type LEDs for protected crop production. A low-power (0.1 W) and a high-power (1 W) LEDs were selected and the intensity and uniformity was evaluated at different vertical (height) and horizontal (distance) intervals. When the horizontal interval of the LED bar was fixed, the light intensity increased and the uniformity decreased as the height decreased. At the 30~40 cm heights, 20~30% of the area showed $200{\pm}20{\mu}molm^{-2}s^{-1}$. As the horizontal distance of the LED bars increased, while the uniformity increased as well, the light intensity decreased. At the distances of 6~10 cm, 17~23% of the area showed $200{\pm}20{\mu}molm^{-2}s^{-1}$. When the LED bars were added to the sides, the light intensity and uniformity were generally improved. Results showed that the light intensity and uniformity depended on the height and interval of the LED bulbs; therefore, optimum arrangement for the crops interested should be determined through experiments.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.12
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• pp.8306-8313
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• 2015

Open-type current sensors have been commonly used for DC motor controller, AC variable controller and Uninterruptible Power Supply. Recently they have begun to be used more widely, as the growth of renewable energy and smart-grid in power system. Considering most of the open-type current sensors are imported, developing the core technology needed to produce open-type current sensors is required. This paper describes the development and test results of open-type current sensors. Design of C type magnetic core, selection and test of a Hall sensor, design of current source circuit and signal conditioning circuit are described. 100A class DIP(Dual In-line Package) type and SMD(Surface Mount Devide) type open-type current sensors was made and tested. Test results show that the developed open-type current sensor satisfies the accuracy requirement of 2% and linearity requirement of 2% at 100 A of DC and AC current of 60Hz. Temperature compensation was carried out by using a temperature compensation circuit with NTC(Negative Temperature Coefficient) thermistor and the effect of the temperature compensation are described.

• Transactions of the KSME C: Technology and Education
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• v.3 no.2
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• pp.131-140
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• 2015

The mono-ski for the paraplegia designed to skiing is formed as seat bucket on the sled. The impact force transferred by snow surface during skiing is absorbed by the leg joints of normal human, but it is transferred to the human body on the seat when using mono-ski. Most of commercially available mono-ski have absorbing device and link mechanism between seat and ski mount in order to complement it. In this study we developed the comfort evaluation model that could provide skiing simulation of mono-ski with hydraulic damper and analyzed vibrational acceleration occurred during skiing uneven surface. The evaluation method used in this study is the international standard BS6841. We evaluated comfort performance of mono-ski in accordance with nozzle adjustment of hydraulic damper.

• Journal of the Korean Institute of Gas
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• v.21 no.1
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• pp.1-5
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• 2017

In the event of toxic gas accidents, soil deposition is a main factor which has an effect on extent of the damage. In this study, it presents the influence of soil deposition properties according to the change of soil depth and the organic matter contents in soil. In this experimentation, the soil deposition device developed in Air Force Research Laboratory in USA is recreated. The tested samples of mixing soil have each value of the organic matter contents. After a variety of synthetic soil were exposed to constant Cl2 concentration, the chlorinity is measured using an anion exchange chromatography(ICS-1100) to quantify the mount of deposition. As the results, the increase of soil depth causes an decreased soil deposition and the increase of exposure time causes an increased soil deposition in surface. Also, the increase of soil deposition mainly depended on the organic matter contents in surface.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.217-220
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• 2009

Conductive adhesives have been investigated for use in microelectronics packaging as a lead-free solder substitute due to their advantages, such as low bonding temperature. However, high resistivity and poor mechanical behavior may be the limiting factors for the development of conductive adhesives. The metal fillers and the polymer resins provide electrical and mechanical interconnections between surface mount device components and a substrate. As metal fillers used in conductive adhesives, silver is the most commonly used due to its high conductivity and the stability. However the cost of conductive adhesives with silver fillers is much higher than usual lead-free solders and silver has poor electro-migration performance. So, copper can be a promising candidate for conductive filler metal due to its low resistivity and low cost, but oxidation causes this metal to lose its conductivity. In this study, electrically conductive adhesives (ECAs) using surface modified copper fillers were developed. Especially, in order to overcome the problem associated with the oxidation of copper, copper particles were coated with silver, and the silver-coated copper was tested as a filler metal. Especially the effect of silver coating on the electrical resistance just after curing and after aging was investigated. As a result, it was found that the electrical resistance of ECA with silver-coated copper filler was clearly lower and more stable than that of ECA with pure copper filler after curing process. And, during high temperature storage test, the degradation rate of electrical resistance for ECA with silver coated copper filler was quite slower than that for ECA with pure copper filler.

• Korean Journal of Materials Research
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• v.17 no.3
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• pp.152-159
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• 2007

When the electronics are tested with thermal shock for Pb-free solder joint reliability, there are temperature conditions with use environment but number of cycles for test don't clearly exist. To obtain the long term reliability data, electronic companies have spent the cost and times. Therefore this studies show the test method and number of thermal shock cycles for evaluating the solder joint reliability of electronic components and also research bonding strength variation with formation and growth of intermetallic compounds (IMC). SMD (surface mount device) 3216 chip resistor and 44 pin QFP (quad flat package) was utilized for experiments and each components were soldered with Sn-40Pb and Sn-3.0 Ag-0.5 Cu solder on the FR-4 PCB(printed circuit board) using by reflow soldering process. To reliability evaluation, thermal shock test was conducted between $-40^{\circ}C\;and\;+125^{\circ}C$ for 2,000 cycles, 10 minute dwell time, respectively. Also we analyzed the IMCs of solder joint using by SEM and EDX. To compare with bonding strength, resistor and QFP were tested shear strength and $45^{\circ}$ lead pull strength, respectively. From these results, optimized number of cycles was proposed with variation of bonding strength under thermal shock.

• Journal of the Korea institute for structural maintenance and inspection
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• v.26 no.6
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• pp.82-92
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• 2022

This study aims to investigate the effect of total electrochemical cell resistance (TECR) on electrochemical impedance (EI) measurements of reinforced concrete (RC) by electrochemical impedance spectroscopy (EIS) using a three-electrode system. A series of experimental study is performed to measure electrochemical behavior of a steel bar embedded in a concrete cube specimen, with a side length of 200 mm, in various experimental conditions. Main variables include concrete dry conditions, coupling resistance between sensing electrodes and concrete surface, and area of the counter electrode. It is demonstrated that EI values remains stable when the compliant voltage of a measuring device is sufficiently great compared to the potential drop caused by TECR of concrete specimens. It is confirmed that the effect of the coupling resistance of TECR is far more influential than other two factors (concrete dry conditions and area of the counter electrode). The results in this study can be used as a fundamental basis for development of a surface-mount sensor for corrosion monitoring of reinforced concrete structures exposed to wet-and-dry cycles under marine environment.