• Proceedings of the KIEE Conference
• /
• 1987.07a
• /
• pp.481-485
• /
• 1987

The fabrication of a micro mass flow sensor on a silicon chip by means of micro-machining technology is described on this paper. The operation of micro mass flow sensor is based on the heat transfer from a heated chip to a fluid. The temperature differences on the chip is a measure for the flow velocity in a plane parallel with the chip surface. An anisotropic etching technigue was used for the formation of the V-type groove in this fabrication. The micro mass flow sensor is made up of two main parts ; A thin glass plate embodying the connecting parts and mass flow sensor parts in silicon chip. This sensor have a very small size and a neglible dead space. Micro mass flow sensor can fabricate on silicon chip by micro machining technology too.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2003.06a
• /
• pp.246-250
• /
• 2003

In this study, two new types of micro-grippers in which micro-fingers are actuated by piezoelectric multi-layer benders and stacks are introduced for the manipulation of micrometer-sized objects. First, we constructed a 3-chopstick-mechanism tungsten gripper, which is composed of three chopsticks: two are designed to grip micro-objects, and tile third is used to help grasp and release the objects through overcoming especially electrostatic force among some surface effects including electrostatic, van der Waals forces and surface tension. Second, a 2-chopstick-mechanism silicon micro-gripper that uses an integrated force sensor to control the gripping force was developed. The micro-gripper is composed of a piezoelectric multilayer bender for actuating the gripper fingers, silicon fingertips fabricated by use of silicon-based micromachining, and supplementary supports. The micro-gripper is referred to as a hybrid-type micro-gripper because it is composed of two main components; micro-fingertips fabricated using micromachining technology to integrate a very sensitive force sensor for measuring the gripping force, and piezoelectric gripper finger actuators that are capable of large gripping forces and moving strokes. The gripping force signal was found to have a sensitivity of 667 N/V. To the design of each of components of both of the grippers. a systematic design approach was applied, which made it possible to establish the functional requirements and design parameters of the micro-grippers. The micro-grippers were installed on a manual manipulator to assess its performance in tasks such as moving micro-objects from one position to a desired position. The experiment showed that the micro-grippers function effectively.

• Journal of the Semiconductor & Display Technology
• /
• v.1 no.1
• /
• pp.15-19
• /
• 2002

A new vacuum packaging process in wafer level is developed for the surface micromachining devices using glass silicon anodic bonding technology. The inside pressure of the packaged device was measured indirectly by the quality factor of the mechanical resonator. The measured Q factor was about 5$\times10^4$ and the estimated inner pressure was about 1 mTorr. And it is also possible to change the inside pressure of the packaged devices from 2 Torr to 1 mTorr by varying the amount of the Ti gettering material. The long-term stability test is still on the way, but in initial characterization, the yield is about 80% and the vacuum degradation with time was not observed.

• 한국ITS학회:학술대회논문집
• /
• 2004.11a
• /
• pp.224-227
• /
• 2004

• The Journal of Korean Institute of Electromagnetic Engineering and Science
• /
• v.16 no.7 s.98
• /
• pp.753-759
• /
• 2005

In this paper, we have developed a new type of single balanced mixer with the RF MEMS $180^{\circ}$ hybrid coupler using surface micromachining technology. The $180^{\circ}$ hybrid coupler in this mixer is composed of the dielectric-supported air gapped microstriplines(DAMLs) which have signal line with $10{\mu}m$ height to reduce substrate dielectric loss and dielectric posts with size of $20{\mu}m{\times}20{\mu}m$ to elevate the signal line on air with stability At LO power of 7.2 dBm, the conversion loss was 15.5 dB f3r RF frequency or 57 GHz and RF power of -15 dBm. Also, we obtained the good RF to LO isolation of -40 dB at LO frequency of 58 GHz and LO power of 7.2 dBm. The main advantage of this type of mixer is that we are able to reduce the size of the chips due to integrating the MEMS passive components.

• Journal of Sensor Science and Technology
• /
• v.28 no.2
• /
• pp.127-132
• /
• 2019

In this study, the fabrication of through-silicon vias (TSVs) filled with SWNTs/Sn by utilizing surface/bulk micromachining and MEMS technologies is proposed. Tin (Sn) and single-walled nanotube (SWNT) powders are used as TSV interconnector materials in the development of a novel TSV at low temperature. The measured resistance of a TSV filled with SWNT/Sn powder is considerably reduced by increasing the fraction of Sn and is lower than that of a TSV filled with only Sn. This is because of a decrease in the surface scattering of electrons along with an increase in the grain size of sintered SWNTs/Sn. The proposed method is conducted at low temperatures (< $400^{\circ}C$) due to the low melting temperature of Sn; hence, the proposed TSVs filled with SWNTs/Sn can be utilized in CMOS based applications.

• Proceedings of the KIEE Conference
• /
• 1996.07c
• /
• pp.1968-1970
• /
• 1996

We investigate a surface-micromachined polysilicon microgyroscope, whose resonant frequencies are electrostatically-tunable after fabrication. The microgyroscope with two oscillation nudes has been designed so that the resonant frequency in the sensing mode is higher than that in the actuating mode. The microgyroscope has been fabricated by a 4-mask surface-micrormachining process, including the deep RIE of a $6{\mu}m$-thick LPCVD polycrystalline silicon layer. The resonant frequency in the sensing mode has been lowered to that in actuating mode through the adjustment of an inter-plate bias voltage; thereby achieving a frequency matching at 5.8kHz under the bias voltage of 2V in a reduced pressure of 0.1torr. For an input angular rate of $50^{\circ}/sec$, an output signal of 20mV has been measured from the tuned microgyroscope under an AC drive voltage of 2V with a DC bias voltage of 3V.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
• /
• 2002.10a
• /
• pp.370-375
• /
• 2002

Recently, the interest on micro optical parts has increased rapidly with the development of technology related to microsystems. Among the optical parts, micro lens is one of the most broadly used micro parts. To mass-produce the micro lenses, it is very effective to use the mold insert and injection molding process. There are many methods to fabricate the mold insert for micro lenses: electroforming, etching, mechanical micromachining and so on. In this study, we fabricated the mold insert for micro lenses using a micro ball endmill to apply mechanical micromaching method and analyzed the effect of main process parameters such as spindle speed, feed rate, dwell time on the processed surface. Then, using fabricated the mold insert we fabricated the micro lenses through injection molding process.

• Journal of Sensor Science and Technology
• /
• v.19 no.4
• /
• pp.320-327
• /
• 2010

In this paper, electrostatically actuated direct contact type RF MEMS switches have been designed and demonstrated. As driving structures of the switch, cantilever, bridge, and torsion spring beam structures are used and the actuation voltage characteristics of the switches have been compared and discussed. The designed RF switches are fabricated with the surface micromachining technology using the electroplated gold and nickel structures. The characteristics of the fabricated switches are measured and analyzed. The switch, which is fabricated using the 510 ${\mu}m$-length bridge structure with the thickness of 1.5 ${\mu}m$, is actuated with 15 V driving voltage. The insertion losses are less than 0.2 dB over the measured frequency ranges from 0 to 20 GHz and the isolations are more than 30 dB.

• Journal of Biomedical Engineering Research
• /
• v.44 no.6
• /
• pp.404-413
• /
• 2023

In this research, we studied the development of a SUS304 microneedle array based on microfabrication technology and the applicability of Parylene-C thin film, a medical polymer material. First of all, four materials commonly used in the field of medical engineering (SUS304, Ti, PMMA, and PEEK) were selected and a 5 ㎛ Parylene-C thin film was deposited. The applicability of Parylene-C coating to each material was confirmed through SEM analysis, contact angle measurement, surface roughness(Ra) measurement, and adhesion test according to ASTM standards for each specimen. Parylene-C thin film was deposited based on chemical vapor deposition (CVD), and a 5 ㎛ Parylene-C deposition process was established through trial and error. Through characteristic experiments to confirm the applicability of Parylene-C, SUS304 material, which is the easiest to apply Parylene-C coating without pretreatment was selected to develop a microneedle array based on CNC micromachining technology. The CNC micromachining process was divided into a total of 5 steps, and a microneedle array consisting of 19 needles with an inner diameter of 200 ㎛, an outer diameter of 400 ㎛, and a height of 1.4 mm was designed and manufactured. Finally, a 5 ㎛ Parylene-C coated microneedle array was developed, which presented future research directions in the field of microneedle-based drug delivery systems.