• 대한전자공학회논문지SD
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• 제41권8호
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• pp.37-44
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• 2004

본 논문에서는 RF 부품 수동소자 중 가장 기본적인 요소가 되는 전송선로를 DAML(Dtelectric-supported Airbridge Microstrip Line) 형태의 새로운 구조로 제안하였으며, DAMS(Micro Electro Mechanical System) 기술 중 표면 마이크로머싱닝(surface micromachining) 기법을 이용하여 구현하였다. 제안된 구조는 마이크로스트립 라인(microstrip line)의 응용 형태로서 기존의 신호선(signal line)과 ground 사이에 유전체 지지대(dielectric post)를 사용하였고, 신호선을 공중으로 띄우면서 넓은 범위의 임피던스에서 유전체 손실(dielectric loss)을 최소화하였다. 본 논문에서 제작된 전송선로는 10 ㎛의 신호선의 높이와 10 ㎛ × 10 ㎛의 지지대(Post) 면적과 9 ㎛의 지지대(post)의 높이와 5 mm의 길이로 제작되었다. 50 GHz에서 일반적인 마이크로스티립(microstrip) 전송선의 손실이 약 7.5 dB/cm 이상 되는 것과 비교하여 본 논문에서 제안한 구조에서는 50 GHz에서 전송선의 손실이 약 1.1 dB/cm가 되는 것을 얻었다.

• 전자공학회논문지D
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• 제35D권9호
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• pp.48-53
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• 1998

실리콘 벌크 마이크로머시닝과 표면 마이크로머시닝기술을 혼합하여 새로운 구조의 정전렌즈를 제작하였다. 표면 마이크로머시닝을 위한 구조층과 희생층으로는 폴리실리콘을 사용하였으며 구조층을 열산화막으로 보호하여 실리콘 습식 식각시 손상되지 않도록 하였다. 이전의 마이크로컬럼에 사용되던 정전렌즈에 비하여 이 구조가 갖는 장점은 1) 양극 접합의 수를 줄일 수 있어 구멍간 정렬, 렌즈의 생산성, 신뢰도, 손상 면에서 우수하고, 2) 마이크로컬럼의 집적화를 통한 arrayed lithography에도 유리하다는 것이다.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제49권2호
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• pp.140-148
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• 2000

In this paper, using surface micromachining technology with thick photoresist and aluminum, an SLM(Spatial Light Modulator), which is applied to the fields of adaptive optics and pattern recognition system, was fabricated and the electromechanical properties of the fabricated micro SLM are measured. In order to maximize fill-factor and remove mechanical coupling between micro SLM actuators, the micro SLM is composed of three aluminum layers so that spring structure and upper electrode are placed beneath the mirror plate, and $10\times10$ each mirror plate is individually actuated. Also, the micro SLM was designed to be able to modulate phase and amplitude of incoming light in order to have a continuity of phase modulation of incoming light. In the case of amplitude and phase modulation, maximum vertical displacement is 4$\mum$, and maximum angular displacement is $\pm4.6^{\corc}$ respectively. The height difference of the fabricated mirror plate was able to be reduced to 1100A with mirror plate planarization method using negative photoresist(AZ5214). The electromechanical properties of the fabricated micro SLM were measured with the optical measurement system using He-Ne laser and PSD(position sensitive device).

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2005년도 추계종합학술대회
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• pp.925-928
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• 2005

In this study, we fabricated the DAMLs using surface micromachining technology as well a low loss coupler for the millimeter-wave band applications using these DAMLs. The structure of DAML is that a signal line is supported on ground plane by dielectric posts. Therefore it has advantages about the loss characteristic and the stable structure. The other advantage of the DAML process is a simple and convenient technique using 4 mask steps, even if it has a micromachining technology. The lowest loss of the fabricated DAML was obtained 2.2 dB/cm at 110 GHz. To obtain the low loss characteristic, couplers were designed and fabricated by using DAMLs. The fabricated ring hybrid coupler has the coupling of 3.58 dB and the thru of 3.31 dB at 60 GHz. We can also obtain the coupling of 3.42 dB, the thru of 3.82 dB from fabricated branch line coupler at 60 GHz.

• Transactions on Electrical and Electronic Materials
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• 제11권3호
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• pp.130-133
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• 2010

A flexible three-axial tactile sensor was fabricated on Kapton polyimide film using polymer micromachining technology. Nichrome (Ni:Cr = 8:2) strain gauges were positioned on an etched membrane to detect normal and shear loads. The optimal positions of strain gauges were determined through strain distribution from finite element analysis. The sensor was evaluated by applying normal and shear loads from 0 N to 0.8 N using an evaluation system. Sensitivity of the tactile sensor to normal and shear loads was about 206.6 mV/N and 70.1 mV/N, respectively. The sensor showed good linearity, and its determination coefficient ($R^2$) was about 0.982. The developed sensor can be applied in a curved or compliant surface that requires slip detection and flexibility, such as a robotic fingertip.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1998년도 하계학술대회 논문집 G
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• pp.2518-2520
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• 1998

Silicon can be reactive ion etched (RIE) either isotropically or anisotropically. In this paper, a new micromachining technology combining these two etching characteristics is proposed. In the proposed method, the fabrication steps are as follows. First. a polysilicon layer, which is used as the bottom electrode, is deposited on the silicon wafer and patterned. Then the silicon substrate is etched anisotropically to a few micrometer depth that forms a cavity. Then an PECVD oxide layer is deposited to passivate the cavity side walls. The oxide layers at the top and bottom faces are removed while the passivation layers of the side walls are left. Then the substrate is etched again but in an isotropic etch condition to form a round trench with a larger radius than the anisotropic cavity. Then a sacrificial PECVD oxide layer is deposited and patterned. Then a polysilicon structural layer is deposited and patterned. This polysilicon layer forms a pivot structure of a rocker-arm. Finally, oxide sacrificial layers are etched away. This new micromachining technology is quite simpler than conventional method to fabricate joint structures, and the devices that are fabricated using this technology do not require a flexing structure for motion.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 1999년도 추계종합학술대회 논문집
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• pp.905-908
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• 1999

In this paper, we present a polysilicon actuator on silicon wafer using surface micromachining technology which employs an electrostatic stepwise driven Scratch Drive Actuator to generate a force that can move an external object. For optical applications, we propose wavelength selector using distributed feedback structures and this micro actuator.

• 한국정밀공학회지
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• 제14권12호
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• pp.153-159
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• 1997

A thermally-driven polysilicon microactuator has been fabricated using surface micromachining techniques. It consists of P-doped polysilicon as a structural layer and TEOS(tetraethylorthosilicate) oxide as a sacrificial layer. The polysilicon was annealed for the relaxation of residual stress which is the main cause to its deformation such as bending and buckling. And newly developed HF GPE(gas-phase etching) process was also employed to eliminate the troublesome stiction problem using anhydrous HF gas and CH$_{3}$OH vapor, and successfully fabricated the microactuators. The actuation is incurred by the thermal expansion due to the current flow in the active polysilicon cantilever, which motion is amplified by lever mechanism. The moving distance of polysilicon microactuator was experimentally conformed as large as 21 .mu. m at the input voltage level of 10V and 50Hz square wave. The actuating characteris- tics are also compared with the simulalted results considering heat transfer and thermal expansion in the polysilicon layer. This microactuator technology can be utilized for the fabrication of MEMS (microelectromechanical system) such as microrelay, which requires large displacement or contact force but relatively slow response.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2005년도 춘계학술대회 논문집
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• pp.47-50
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• 2005

In this study, micro mirror array for small form factor optical pick-up was replicated by micro UV-molding. First, mold for micro mirror array was fabricated using micromachining. Also, to analyze the characteristics of the surface quality, flatness of replicated mirror surface were measured by white light scanning inteferometry system. The results show that the micro mirror array with a sufficient surface quality can be obtained by polymer replication process.

• 센서학회지
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• 제14권6호
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• pp.374-380
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• 2005

Vibration sensors have a wide scope of applications in the field of monitoring systems that needs to perceive an undesirable physical vibration before a critical failure occurs in a system, and then costly unplanned repairs can be avoided. The conventional vibration sensors developed so far have many disadvantages, such as complex manufacturing process, bulkiness, high cost, less reliability and so on. This paper reports a simple-structured vibration sensor, which has been developed using a commercialized conductive ball and silicon bulk-micromachining technology. The sensor consists of a conductive ball placed in $600{\mu}m$-deep micromachined silicon groove, in which Au thin film has been patterned using a shadow mask technique. Prior to the formation of the Au thin film, the sharp convex corner was rounded for smooth meatl deposition on the non-planar surface at the edge of the groove. The measurement results of the fabricated vibration sensor demonstrate a stable response characteristic to low-frequency vibration range ($1{\sim}30{\;}Hz$).