• Journal of the Korean Society for Precision Engineering
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• v.27 no.3
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• pp.50-57
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• 2010

A high precision air bearing stage has been developed and calibrated. This linear-motor driven stage was designed to transport a glass or wafer with the X and Y following errors in nanometer regime. To achieve this level of precision, bar type mirrors were adopted for real time ${\Delta}X$ and ${\Delta}Y$ laser measurement and feedback control. With the laser wavelength variation and instability being kept minimized through strict environment control, the orthogonality of this type of control system becomes purely dependent upon the surface flatness, distortion, and assembly of the bar mirrors. Compensations for the bar mirror distortions and assembly have been performed using the self-calibration method. As a result, the orthogonality error of the stage was successfully decreased from $0.04^{\circ}$ to 2.48 arcsec.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.18 no.2
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• pp.130-136
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• 2009

Semi-solid casting(SSC) of magnesium alloys is increasingly being used to produce high quality components. This process is similar to the injection molding of plastics and is called thixomolding. Using this process, higher strength, thinner wall sections and tighter tolerances without porosity are obtained. The high strength and low weight characteristics of magnesium alloys render the high-precision fabrication of thin-walled components with large surface areas. They are widely used for the IT, auto and consumer electronics industries. However, warpage of the thin-walled sections degrade quality of the parts produced in the SCC process. To produce thin-walled magnesium alloy parts, the geometry of gating system on the quality of the finished products should be clearly studied. In this paper, to minimize warpage of the thin-walled sections, Taguchi method is applied to the optimal design of the gate geometry in the thixomolding process. Width, height, length and angle of the gating system are selected for the robust design parameters. Effectiveness of the robust design is verified through the CAE software.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.555-556
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• 2006

In recent years, the higher flatness level in wafer shape has been strictly demanded with a high integration of the semiconductor devices. It has become difficult for a conventional wafer preparing process to satisfy those demands. In order to meet those demands, surface grinding with in-feed grinder is adopted. In an in-feed grinding method, a chuck table fur fixing a semiconductor wafrr rotates on its rotation axis with a slight tilt angle to the rotation axis of a cup shaped grinding wheel and the grinding wheel in rotation moves down to grind the wafer. So, stability of the grinder structure is very important to aquire a wafer of good quality. This paper describes the features of the in-feed grinder and some FEM analysis results of the grinder structure.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.23 no.5
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• pp.435-442
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• 2014

This paper describes an improved design model that can be used to configure a non-contact pneumatic device to turn a large sheet at the in-line system. For rotational moving in the conveyor system, the conventional method is to turn the system itself. The improved non-contact pick-up system mainly uses 8 pairs of L-shaped latches and 12 swirl type heads. It is positioned above the upward air flow table. This system performs the non-contact gripping and side-edge contact support in the vertical and rotational directions to hold the self-weight of a large flat sheet. A non-contact air head can exert a sufficient gripping ability at 4N lower than the standard working pressure. The side latches support 60% of the lifting force required. Through structural and flow analysis, the working conditions were simultaneously considered in accordance with the deflection and flatness of the glass.

• Journal of radiological science and technology
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• v.33 no.3
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• pp.253-260
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• 2010

The primary focus of this study was to explore the variation in dose distributions of electron beams between different types of construction structure of cut-out blocks embodied in electron cones, given that the structure is considered one of the causes of multiple scattered radiation from electrons which may affect dose distributions. For evaluation, two types of cut-out blocks, divergency and straight, manufactured for this study, were compared in terms of area of interval in distribution of dose, and flatness and symmetric state of surface being radiated. The results showed that divergency cut-out blocks reduced the lateral scattering effects on the thickness of cut-out blocks more substantially than straight ones, leading to more uniform dose distribution at baseline depth. Notably in divergency cut-out blocks, the high dose area decreased more significantly, and more uniform dose distribution was observed at the edge of the irradiated field. This points to a need to consider the characteristics of dose distribution of electron beams when setting up radiotherapy planing at the venues. Therefore, this study is significant as an exploratory work for ensuring high accuracy in dose delivery for patients.

• Journal of the Korean Society of Radiology
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• v.16 no.6
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• pp.687-695
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• 2022

To find a 3D printer material that can replace lead used as a shield for high-energy electron beam treatment, the shielding composites were simulated by using MCNP6 programs. The Percent Depth Dose (PDD), Flatness, and Symmetry of linear accelerators emitting high-energy electron beams were measured, and the linear accelerator was compared with MCNP6 after simulation, confirming that the source term between the actual measurement and simulation was consistent. By simulating the lead shield, the appropriate thickness of the lead shield capable of shielding 95% or more of the absorbed dose was selected. Based on the absorption dose data for lead shield with a thickness of 3 mm, the shielding performance was analyzed by simulating 1, 5, 10, and 15 mm thicknesses of ABS+W (10%), ABS+Bi (10%), and PLA+Fe (10%). Each prototype was manufactured with a 3D printer, measured and analyzed under the same conditions as in the simulation, and found that when ABS+W (10%) material was formed to have a thickness of at least 10mm, it had a shielding performance that could replace lead with a thickness of 3mm. The surface morphology and atomic composition of the ABS+W (10%) material were evaluated using a scanning electron microscope (SEM) and an energy dispersive X-ray spectrometer (EDS). From these results, it was confirmed that replacing the commercialized lead shield with ABS+W (10%) material not only produces a shielding effect such as lead, but also can be customized to patients using a 3D printer, which can be very useful for high-energy electron beam treatment.

• Tribology and Lubricants
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• v.32 no.2
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• pp.44-49
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• 2016

Diamond mechanical polishing (DMP) is a crucial process in a sapphire wafering process to improve flatness and achieve the target thickness by using free abrasives. In a DMP process, material removal rate (MRR) is a key factor to reduce process time and cost. Controlling mechanical parameters, such as velocity and pressure, can increase the MRR in a DMP process. However, there are limitations of using high velocities and pressures for achieving a high MRR owing to their side effects. In this paper, we present the lapping characteristics and improvement of MRR by using a fixed abrasive plate through an experimental study. The change in MRR as a function of velocity and pressure follows Preston's equation. The surface roughness of a wafer decreases as the plate velocity and pressure increases. We observe a sharp decrease in MRR over the lapping time at a high velocity and pressure in the velocity and pressure test. An analysis of surface roughness (Rq and Rpk) indicates that wear of abrasives decreases the MRR sharply. In order to investigate the effect of abrasive wear on the MRR, we utilize a cutting fluid and a rough wafer. The cutting fluid delays the wear of abrasives resulting in improvement of MRR drop. The rough wafer maintains the MRR at a stable rate by self-dressing.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.3
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• pp.9-14
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• 2004

In this study, Si anisotropic etching characteristics of tetramethylammonium hydroxide (TMAH)/ ammonium persulfate(AP)/isopropyl alcohol(IPA) solutions were investigated to realize the optimum structure of a diaphragm for the piezoresistive pressure sensor application. Due to its low toxicity and its high compatibility with the CMOS processing, TMAH was used as Si anisotropic etchants. The variations of Si etch rate on the etching temperature, TMAH concentration, and etching time were obtained. With increasing the etching temperature and decreasing TMAH concentrations, the Si etch rate is increased while a significant non-unifonnity exists on the etched surface because of formation of hillocks on the (100) surface. The addition of IPA to TMAH solution leads to smoother etched surfaces but, makes the Si etch rate lower. However, with the addition of AP to TMAH solution, the Si etch rate is increased and an improvement in flatness on the etching front is observed. The Si etch rate is also maximized with increasing the number of addition of AP to TMAH solution per one hour. The Si square membranes of 20${\mu}{\textrm}{m}$ thickness and l00-400${\mu}{\textrm}{m}$ one-side length were fabricated successfully by applying optimum Si etching conditions of TMAH/AP solutions.

• Journal of Electrical Engineering and Technology
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• v.5 no.2
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• pp.337-341
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• 2010

In this paper, an extremely low voltage operated micro corner cube retroreflector (CCR) was fabricated for free-space optical communication applications by using bulk silicon micromachining technologies. The CCR was comprised of an orthogonal vertical mirror and a horizontal actuated mirror. For low voltage operation, the horizontal actuated mirror was designed with two PZT cantilever actuators, torsional bars, hinges, and a mirror plate with a size of $400{\mu}m{\times}400{\mu}m$. In particular, the torsional bars and hinges were carefully simulated and designed to secure the flatness of the mirror plate by using a finite element method (FEM) simulator. The measured tilting angle was approximately $2^{\circ}$ at the applied voltage of 5 V. An orthogonal vertical mirror with an extremely smooth surface texture was fabricated using KOH wet etching and a double-SOI (silicon-on-insulator) wafer with a (110) silicon wafer. The fabricated orthogonal vertical mirror was comprised of four pairs of two mutually orthogonal flat mirrors with $400{\mu}m4 (length) $\times400{\mu}m$ (height) $\times30{\mu}m$ (thickness). The cross angles and surface roughness of the orthogonal vertical mirror were orthogonal, almost $90^{\circ}$ and 3.523 nm rms, respectively. The proposed CCR was completed by combining the orthogonal vertical and horizontal actuated mirrors. Data transmission and modulation at a frequency of 10 Hz was successfully demonstrated using the fabricated CCR at a distance of approximately 50 cm.

• Journal of Fashion Business
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• v.12 no.2
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• pp.87-99
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• 2008

This study aims to classify lower trunk body types of Chinese men in their middle age (30s and 40s) and suggest the standard for them to design slacks pattern. Mollison's relation deviations were used to analyze the direct measurement items in this research compared to those of Size Korea 2004. Though Korean middle-aged men were higher in most items than Chinese counterparts, all items except mid-thigh circumference and side hip length were merely within the range of ${\pm}1\sigma$. According to the results of size classification by absolute values, factor analysis extracted to 2 factors(horizontal size of lower body and vertical size of lower body), and cluster analysis brought about 3 types(type1: tall and thin trunk (36.9%), type 2 : normal height and thick trunk(45.5%), and type 3 : short and normal trunk(17.6%) with some significant differences among them. Also, the results of shape classification by index values, they were extracted 4 factors (waist-hip flatness, waist-hip cross section, vertical waist-groin and hip-surface length) by factor analysis and revealed 3 types(type 1: different waist-hip width, thick, long waist, long upper hip, and short hip-surface length(27.8%), type 2 : different waist-hip width, flat, short upper hip, high hip and groin, and average hip-surface length(29.4%), and type 3: small waist-hip width, thick, average upper hip, and short hip-surface length (42.8%)) with significant differences among them by cluster analysis. The results of standard body types by shape-size combination, 19subjects(10.16%) under these values are regarded as standard body types. Significance was not seen in all items in the t-test results between the total group and the standard group. The latter had lower variation coefficients and smaller individual differences than the former. However, in-depth research is required for generalization since this research is limited to a small number of subjects in Ningbo of Zhejiang.