• Proceedings of the Korean Vacuum Society Conference
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• 2004.08a
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• pp.204-204
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• 2004

• Membrane Journal
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• v.14 no.2
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• pp.126-131
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• 2004

The surface of dense polysulfane films was modified through solvent treatment. The modification process consisted of dipping a film for one second in dimethylformamide and then immersing it Into a nonsolvent bath. After being solidified, the original transparent film transformed into an opaque white one, which is due to the light scattering on pores newly developed on the surface. The surface roughness entailing the pore formation was more explicit on a film coagulated by water as nonsolvent than on a film coagulated by isopropanol. The surface-modified films show the better pick-up efficiency than a conventional filter paper on the detaching of radioactive contaminants on the contaminated area. The pick-up efficiency of the film prepared by the water immersion process was superior to that of the film prepared in the isopropanol bath, which was consistent with the surface roughness result. The surface-modified films kept the dense inner structure, playing a major role preventing a possible secondary contamination during the pick-up process.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.30 no.3
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• pp.83-90
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• 2020

The effect of substrate surface roughness and sintering temperature on the adhesion strength of Ag-based thick film conductors formed on AlN substrates with excellent thermal conductivity was studied. The adhesion strength of the thick-film conductor manufactured using an AlN substrate having a surface roughness (R_a) of 0.5 was higher than that of a thick-film conductor manufactured using a substrate having a surface roughness greater or smaller than this. In the case of a substrate with a surface roughness of less than 0.5, the contact area between the Ag thick film conductor and the substrate was relatively smaller than that of a substrate with a surface roughness of 0.5, resulting in a lower adhesive strength. On the other hand, when a substrate having a surface roughness of more than 0.5 was used, it was found that the conductor film was not completely adhered to the substrate, and as a result, it was found that the adhesive strength was small. In addition, it was found that the surface smoothness of the Ag-based thick film conductor film obtained by sintering at 850℃ was the best compared to the smoothness of the conductor film obtained by sintering at different sintering temperatures, and as a result, it was found that the adhesive strength of the conductor film was the highest.

• Polymer(Korea)
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• v.25 no.4
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• pp.594-601
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• 2001

Direct thermal lamination of polyethylene film on aluminum plate without using adhesive was tried by modifying their surfaces to have polar groups. Polyethylene film was modified by treating with oxygen or acrylic acid plasma. Aluminum plate was modified by treating with boiling water or diaminocyclohexane plasma. Fairly high adhesion strength was obtained even in the case when only the polyethylene film was modified, and adhesion strength was so high that film was broken during the adhesion test if both the film and the aluminum plate were modified. Even chemical bonding seemed to be possible when the film treated with acrylic acid was laminated on the plate treated with diaminocyclohexane plasma by forming amide linkage through the reaction between COOH groups on the film surface and NH$_2$ groups on the plate surface.

• Journal of the Korean institute of surface engineering
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• v.43 no.3
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• pp.127-131
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• 2010

Adhesion of DLC film is very significant property that exhibits wear resistance, chemical inertness and high hardness when being deposited to metal substrate. This study was considered that change adhesion of DLC film produced by Plasma Enhanced Chemical Vapor Deposition can be presented through inserting interlayer (Cr, Si-C:H). The thickness of interlayer was result of changing adhesion and residual stress. It was showed that the maximum 12 N of adhesion is on DLC film of Cr interlayer, and that a tendency is to be increased residual stress depend on the thickness. DLC film of Si-C:H interlayer represented 16 N of adhesion at $1{\mu}m$, whereas adhesion is decreased when the thickness is increased. For the interlayer at multi-layer, it was the best that adhesion of Cr/Si-C:H/DLC film was 33 N. Si-C:H interlayer at DLC film controled adhesion of the whole film. It was relaxed the internal stress of DLC film produced by inserting Cr, Si-C:H interlayer.

• Transactions of Materials Processing
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• v.22 no.1
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• pp.36-41
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• 2013

The present study examines the micro-pattern replication on a plastic film using ultrasonic imprinting. Ultrasonic imprinting uses ultrasonic waves to generate repetitive microscale deformation in the polymer film. The resulting deformation heat on the surface of the film causes the surface region to soften sufficiently so that a replication of the micro-pattern can be obtained. To successfully replicate the micro-pattern on a large area of polymer film, a high replication ratio is needed as well as good uniformity over the entire region. In this study, a horn design is investigated by finite element analysis and is optimized through a response surface analysis. In the ultrasonic imprinting experiments, the response surface method was also used to determine the optimal processing conditions for better replication characteristics.

• Journal of the Korean Magnetics Society
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• v.5 no.5
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• pp.645-649
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• 1995

The depletion of thin liquid films due to the combined effect of centrifugation, surface roughness, and air-shear has recently been studied. While surface roughness of a rotating solid disk can be represented by deterministic cures, it has been argued that spatial random processes provide a more realistic description. Chiefly because of surface roughness, there is an asymptotic limit of retention of a thin film flowing on the rotating disk. The aim of this article is to model the depletion of thin-film flow and analyze the interplay of centrifugation, surface tension, viscosity, air-shear, disjoining pressure, and surface roughness that affect the depletion of the film. Also, the robustness of stochastic description of surface roughness is examined.

• Journal of the Korean Society of Food Culture
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• v.8 no.3
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• pp.249-255
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• 1993

To minimize the waste amount of surface layer kochujang during aging, the effects of the three finishing methods(nothing, salt scatering and Polyethylene film on the kochujang surface) and sunning(conventional aging method) or nonsunning aging(cap covering) on water content, redness and spreadability, film forming yeast occurance and salinity of surface layer kochujang during 120 days aging were investigated. In the case of sunning aging, film forming yeast was not visually found on the surface. The surface layer kochujang was so low spreadability(zero) and very high salinity(18-30%) that could not eat. However, the aging method after PE-film covering on the kochujang surface, and then cap covering(nonsunning) was very effective in keeping of soundness of surface layer kochujang without film forming yeast growth on the surface kochujang, especially was greatly effective in keeping of redness, moderate moisture content and spreadability. The PE-film and cap covering aging were effective in prevention of water evaporation and $CO_2$ release, and in accumulation of ethanol and organic acids between the PE-film and surface layer of kochujang.

• Journal of the Korean Ceramic Society
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• v.34 no.11
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• pp.1121-1128
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• 1997

In this study, the Ar plasma treatment was used to improve the surface roughness of Poly-Si1-xGex thin film deposited by RTCVD. The surface roughness and the resistivity of Si1-xGex thin film were investigated with variation of Ar plasma treatment parameters (electrode distance, working pressure, time, substrate temperature and R.F power). When the Ar plasma treatment was used, the cluster size decreased by the surface etching effect due to the increasing surface collision energy of particles (ion, neutral atom) in plasma under the conditions of decreasing electrode distance and increasing pressure, time, temperature, and R. F power. Although the surface roughness value decreased by the reduction of the cluster size due to surface etching effect, however, the resistivity increased. This may be due to the surface damage caused by the increasing surface collision energy. It was concluded that the surface roughness could be improved by the Ar plasma treatment, while the resistivity was increased by the surface damage on the substrate.

• 한국전기화학회:학술대회논문집
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• 2002.11a
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• pp.57-65
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• 2002

The presence of tetragonal phase at the surface of $LiMn_2O_4$ pinicle due to a Jahn-Teller offset was previously reported to be one of the causes for capacity fading observed during cycling of $Li//Li_xMn_2O_4$ in 4V range. Further, it is reported that a Jahn-Teller effect in 4V range may be suppressed by substitution of Mn ions with Li ions or other transition metal ions. However, the direct evidence of the suppression of a Jahn-Teller effect in 4V range by substitution of Mn ions with other metal ions has not been reported. The dissolution and formation of surface film at the surface of $LiMn_2O_4$ electrodes also reportedly affect the capacity fading or rate capability. This study reports on the evidence of the onset and suppression of a Jahn-Teller effect in 4V range and the dissolution and formation of surface film at the surface of $LiMn_2O_4$ thin film electrodes using in situ bending beam method (BBM) in situ electrochemical quartz crystal microbalance (EQCM).