• Title/Summary/Keyword: surface etching

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The Effect of the Anti-corrosion by$CHF_3$ Treatment after Plasma Etching of Al Alloy Films (Al 합금막의 식각후 $CHF_3$ 처리에 의한 부식억제 효과)

  • 김창일;권광호;윤용선;백규하;남기수;장의구
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.11 no.7
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    • pp.517-521
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    • 1998
  • After etching Al-Cu alloy films using $SiCl_4/Cl_2/He/CHF_3$ plasma, a corrosion phenomenon on the metal surface has been studied with XPS(X-ray pheotoelectron spectroscopy) and SEM (Scanning electron microscopy). In Al-Cu alloy system, the corrosion occurs rapidly on the etched surface by residual chlorine atoms. To prevent the corrosion, $CHF_3$ plasma treatment subsequent to the etch has been carried put. A passivation layer is formed by fluorine-related compounds on the etched Al-Cu surface after $CHF_3$ treatment, and the layer suppresses effectively the corrosion on the surface as the $CHF_3$treatment in the pressure of 300m Torr.

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Analysis and Reduction of Impurity Contamination Induced by Plasma Etching on Si Surface (플라즈마 식각에 의하여 실리콘 표면에 유기된 불순물 오염의 분석 및 제거)

  • Cho, Sun-Hee;Lee, Won-Jong
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.19 no.12
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    • pp.1078-1084
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    • 2006
  • Impurity contamination induced by $CF_4\;and\;HBr/Cl_2/O_2$ plasma etching on Si surface was examined by using surface spectroscopes. XPS(x-ray photoelectron spectroscopy) surface analysis showed that F of 0.4 at % exists in the surface layer in the form of Si-F bonding but Br and Cl are below the detection limit $(0.1{\sim}1.0%)$ of the spectroscope. Static-SIMS(secondary ion mass spectrometry) surface analysis showed that the etched Si surface was contaminated with etching gas elements such as H, F, Cl and Br, and they existed to the depth of about $20{\sim}40nm$. The etched Si surface was treated with three different methods that were HF dip, thermal oxidation followed by HF dip and oxygen-plasma oxidation followed by HF dip. They showed an effect in reducing the impurity contamination and the oxygen-plasma oxidation followed by HF dipping method appears to be a little bit more effective.

COMPARISON OF RETENTIVE FORCE OF REPAIR RESIN BY VARIOUS SURFACE TREATMENT METHODS IN THE REPAIR OF FRACTURED PORCELAIN FUSED TO METAL CROWN (도재소부전장관(陶材燒付前奬冠) 파절수리시(破折修理時) 표면처리(表面處理) 방법(方法)에 따른 수복(修復)레진의 유지력(維持力)에 관(關)한 연구(硏究))

  • Lim Heon-Song;Heo Seong-Joo;Cho In-Ho
    • The Journal of Korean Academy of Prosthodontics
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    • v.30 no.1
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    • pp.73-83
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    • 1992
  • Now composite resin restoration is clinically accepted in the repair of fractured PFM case, many mechanical surface treatment methods are performed to increase retentive force. The main purpose of this study was to compare the retentive force among the possible surface treatments and to insure the best method for the clinical application to the fractures porecelain and the exposed metal surface. To compare and to analyze the retentive force of repair resin, porcelain specimen were divided into 2 groups, etching group and non-etching group, and etching group were treated with 37% $H_3PO_4$, 1.23% APF, 10% HF and non-etching groups were treated with diamond bur, micro-sandblasasting. Also, metal specimens were divided by 2 groups : one was non-precious metal group which was treated with diamond bur, micro-sandblasting and tin plating and electrolytic etching, the other was precious metal group which was composed of micro-sandblasting treatment only and tin plating treatment with micro-sandblasting. Each specimen had been restored for 48 hours and the bond strength of each specimen was calculated with Universal testing machine. The results were as follows : 1. Porcelain specimen had higher bonding strength than metal specimen for the repair resin(P<0.01). 2. In porcelain specimen, 10% HF etching group had the highest bonding strength among etching and non-etching group. 3. Metal specimen treated with micro-sandblasting had highest bonding strength among the non-sandblasting had hightest bonding strength among the non-precious group, tin plating group had higher bonding strength than micro-sandblasting group between the precious metal groups. 4. Bonding strength of tin plating was increased in precious metal group only.

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Transparent Conductive Oxides for Display Applications

  • Szyszka, B.;Ruske, F.;Sittinger, V.;Pflug, A.;Werner, W.;Jacobs, C.;Kaiser, A.;Ulrich, S.
    • 한국정보디스플레이학회:학술대회논문집
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    • 2007.08a
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    • pp.181-185
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    • 2007
  • We report on our material and process research on ZnO:Al films and on our investigations on wet chemical etching using a variety of etching solutions. We achieve resistivity as low as $750{\mu}{\Omega}cm$ for ZnO:Al films with film thickness of 140 nm. Etching with phosphorous acid allows for accurate fine patterning of the ZnO:Al films on glass substrates.

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Investigation of effect of zirconia on osseointegration by surface treatments (지르코니아 표면처리가 골유착에 미치는 영향)

  • Jeong, Jin-Woo;Song, Young-Gyun
    • Journal of Dental Rehabilitation and Applied Science
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    • v.37 no.1
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    • pp.23-30
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    • 2021
  • Purpose: The aim of this study was to investigate effect of zirconia on osseointegration and Surface appearance by surface treatments using various acid solution. Materials and Methods: The prepared zirconia disks were treated with hydrofluoric acid solution and photo-assisted etching under various condition. The surface was analyzed by SEM and the surface roughness was analyzed by using surface profiler. The osteogenic effect of MC3T3-E1 cells was assessed via fluorescent staining observation and reverse transcriptase-polymerase chain reaction (RT-PCR). Results: Various roughness were obtained according to the surface treatment method. The surface roughness increased in the group treated with hydrofluoric acid solution, but that had week network structure. In the method using photo-assisted etching, the surface roughness increased in micro units. Cell reaction showed better results in the photo-assisted etching group than in the hydrofluoric acid-treated group (P < 0.05). And it showed even osteoblastic cell distribution in photo-assisted etching group. Conclusion: As a result, the photo-assisted etching method is more effective than the simple acid solution treatment for zirconia treatment for osseointegration.

Etching Characteristics BST Thin Film in $CF_4$/Ar Plasma ($CF_4$/Ar 플라즈마에 의한 BST 박막 식각 특성)

  • 김동표;김창일;서용진;이병기;장의구
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.07a
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    • pp.866-869
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    • 2001
  • In this study, (Ba,Sr)TiO$_3$(BST) thin films were etched with a magnetically enhanced inductively coupled plasma(MEICP). Etching characteristics of BST thin films including etch rate and selectivity were evaluated as a function of the etching parameters such as gas mixing ratio, rf power, dc bias voltage and chamber pressure. The maximum etch rate of the BST films was 1700 $\AA$/min at Ar(90)/CF$_4$(10), 600 W/350 V and 5 mTorr. The selectivity of BST to PR was 0.6, 0.7, respectively. To analyze the composition of surface residue remaining after the etching, samples etched with different CF$_4$/Ar gas mixing ratio were investigated with X-ray photoelectron spectroscopy (XPS) and secondary ion mass spectrometry (SIMS). From the results of XPS and SIMS, there are chemical reaction between Ba, Sr, Ti and C, F radicals during the etching and remained on the surface.

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Planarization of Diamond Films Using KrF Excimer Laser Processing (KrF 엑사이머 레이저 법을 이용한 다이아몬드 박막의 평탄화)

  • Lee, Dong-Gu
    • Journal of the Korean Society for Heat Treatment
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    • v.13 no.5
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    • pp.318-323
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    • 2000
  • The planarization of rough polycrystalline diamond films synthesized by DC arc discharge plasma jet CVD (chemical vapor deposition) was attempted using KrF excimer laser pulses. The effects of laser incidence angle and reaction gases (ozone and oxygen) on etching rate of diamond were studied. The temperature change of diamond and graphite with different laser fluences was calculated by computer simulation to explain the etching behavior of diamond films. The threshold energy density from the experiment for etching of pure crystalline diamond was about $1.7J/cm^2$ and fairly matched the simulation value. Preferential etching of a particular crystallographic plane was observed through scanning electron microscopy. The etching rate of diamond with ozone was lower than that with oxygen. When the angle of incidence was $80^{\circ}$ to the diamond surface normal, the peak-to-valley surface roughness was Significantly reduced from $20{\mu}m$ to $0.5{\mu}m$.

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A Study on the Electrical Characteristics of Dye-Sensitized Solar Cell with Glass Substrate surface Etching (유리기판 표면 Etching을 통한 분광특성연구)

  • Kim, Haemaro;Lee, Don-Kyu
    • Journal of IKEEE
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    • v.23 no.2
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    • pp.534-537
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    • 2019
  • The optical loss is caused by reflection on the surface of the solar cell, without being absorbed inside the solar cell. Research is actively being conducted to reduce optical loss due to such reflection of light and to improve conversion efficiency of solar cells. In this paper, the surface of the FTO glass substrate was wet etched, and the structural characteristics of the tough surface were evaluated. In addition, optical properties on the surface were analyzed, etched using spectrometer. When light was introduced to a rough surface formed by etching, it was confirmed that the multiple reflections reduced the amount of light reflection from the surface, thereby increaseing the amount of light penetrating the glass substrate.

Planarization of the Diamond Film Surface by Using the Hydrogen Plasma Etching with Carbon Diffusion Process (수소 플라즈마 에칭과 탄소 확산법에 의한 다이아몬드막 표면의 평탄화)

  • Kim, Sung-Hoon
    • Journal of the Korean Chemical Society
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    • v.45 no.4
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    • pp.351-356
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    • 2001
  • Planarization of the free-standing diamond film surface as smooth as possible could be obtained by using the hydrogen plasma etching with the diffusion of the carbon species into the metal alloy (Fe, Cr, Ni). For this process, we placed the free-standing diamond film between the metal alloy and the Mo substrate like a metal-diamond-molybdenum (MDM) sandwich. We set the sandwich-type MDM in a microwave-plasma-enhanced chemical vapor deposition (MPECVD) system. The sandwich-type MDM was heated over ca. 1000 $^{\circ}C$ by using the hydrogen plasma. We call this process as the hydrogen plasma etching with carbon diffusion process. After etching the free-standing diamond film surface, we investigated surface roughness, morphologies, and the incorporated impurities on the etched diamond film surface. Finally, we suggest that the hydrogen plasma etching with carbon diffusion process is an adequate etching technique for the fabrication of the diamond film surface applicable to electronic devices.

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Decontamination of Metal Surface by Reactive Cold Plasma

  • YUN Sang-pil;JEON Sang-hwan;KIM Yang-saa
    • Proceedings of the Korean Radioactive Waste Society Conference
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    • 2005.11b
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    • pp.300-315
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    • 2005
  • Recently plasma surface-cleaning or surface-etching techniques have been focused in the respect of decontamination of spent or used nuclear parts and equipment. In this study decontamination rate of metallic cobalt surface was experimentally investigated via its surface etching rate with a $CF_4-O_2$ mixed gas plasma and metallic surface wastes of cobalt oxides were simulated and decontaminated with $NF_3$ - Ar mixed gas plasma. Experimental results revealed that a mixed etchant gas with about $80{\%}\;CF_4-20{\%}\;O_2$ gives the highest reaction rate of cobalt disk and the rate reaches with a negative 300 DC bias voltage up to $0.43\;{\mu}m$/min at $380^{\circ}C$ and $20{\%}\;NF_3-80\%$ Ar mixed gas gives $0.2\;{\mu}m$/min of reaction rate of cobalt oxide film.

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