• 한국정보디스플레이학회:학술대회논문집
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• 2002.08a
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• pp.628-631
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• 2002

$Al_2O_3$ capping layer and MgO protective layer were deposited by electron beam evaporation method using single crystal source. Thickness of the capping layer, $Al_2O_3$, was varied from 5 nm to 10 nm. Surface morphology was observed by SEM and AFM before and after hydration. And microstructure of deposited $Al_2O_3$ layer and chemical shift of electron binding energy were also observed by high resolution TEM and XPS, respectively, after hydration. From these results, it was found that Mg atoms diffused into $Al_2O_3$ layer, reacted with moisture and formed $Mg(OH)_2$ during hydration. As thickness of $Al_2O_3$ increased, extent of hydration increased. $Al_2O_3$ capped MgO thin films and uncapped MgO thin films were deposited on AC-PDP test panel to characterize discharge properties. Although $Al_2O_3$ has poor discharge properties rather than MgO, because of many hydrated species on the surface of MgO, similar discharge properties were observed.

• Laser Solutions
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• v.14 no.2
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• pp.24-29
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• 2011

The design of a telecentric f-${\theta}$ lens with a field of view (FOV) $30^{\circ}$ and an effective focal length of 1000mm is presented. The optical stop is placed at the front plane and the design is based on a geometric ray tracing technique, and the designed system consists of a series of convex and concave lenses. The designed f-${\theta}$ lens showed a considerable reduction in weight with a simplified structure and resulted in a good performance in the designated FOV. Detail analysis of rays is also presented. 653nm (red laser), 586nm (green laser), and 468nm (blue laser) were simulated as a light source and image illuminating source. The developed optical design requires 7 pieces of lenses made of SF1, N-FK56, N-LAK33, and BK7 glass materials. With optimal parametric design, the effective focal length was calculated to be 974.839mm which is very close to the initial design target. For the manufacturing purpose, the dimensions of lens curvature and thickness were truncated with error ranging 0.1% to 3.2%. As a result, the overall error was calculated to be 3.2% which can be still tolerable for display, laser material, and machining processing.

• Journal of Sensor Science and Technology
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• v.16 no.6
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• pp.401-406
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• 2007

In this paper, we fabricated the polymer waveguide type surface plasmon resonance (SPR) sensor using a white light source and optical spectrum analyzer (OSA). Fabricated sensor uses the principle of phase matching between evanescent wave and surface plasmon wave. According to the measuring result, the shift of resonance wavelength conducts the change of the refractive index. The proposed SPR sensor is expected to apply the integrated multichannel SPR sensor and the realtime monitoring system.

• Journal of the Semiconductor & Display Technology
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• v.6 no.3
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• pp.61-64
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• 2007

V-groove device was fabricated for precision coupling of planar optical splitter and optical fibers. V-groove was made through select wet etching of Si wafer by using KOH solution. Etching rate and surface roughness were checked, changing KOH composition(10, 20, 30, 33, 40 wt.%) and etching temperature (50, 60, 70, $80^{\circ}C$) to fabricate V-groove device effectively. Etching rate was the fastest as $1.84\;{\mu}m/min$ in case of etching by 20 wt.% KOH on $80^{\circ}C$, surface roughness was the best in case of etching by 33 wt. % KOH on $80^{\circ}C$.

• Journal of the Semiconductor & Display Technology
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• v.2 no.4
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• pp.19-22
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• 2003

In this paper, Si anisotropic etching characteristics of tetramethylammonium hydroxide (TMAH)/ammonium persulfate (AP) solutions were investigated to realize the optimum structure of a diaphragm for the piezoresistive pressure sensor application. Due to its low toxicity and its high compatibility with the CMOS processing, TMAH was used as Si anisotropic etchants. The variations of Si etch rate on the etching temperature, TMAH concentration, and etching time were obtained. With increasing the etching temperature and decreasing TMAH concentrations, the Si etch rate is increased while a significant non-uniformity exists on the etched surface because of formation of hillocks on the <100> surface. With the addition of AP to TMAH solution, the Si etch rate is increased and an improvement in flatness on the etching front is observed. The Si etch rate is also maximized with increasing the number of addition of AP to TMAH solution per one hour. The Si square diaphragms of 20$\mu\textrm{m}$ thickness and 100-400 $\mu\textrm{m}$ one-side length were fabricated successfully by adding AP of (5/6)g to 800 ml TMAH solution every 10 minutes.

• The Transactions of the Korean Institute of Electrical Engineers D
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• v.54 no.5
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• pp.338-347
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• 2005

A computer-based low back muscle evaluation system was designed to simultaneously acquire, process, display, quantify, and correlate electromyographic(EMG) activity with muscle force, and range of motion(ROM) in the lumbar muscle of human. This integrated multi-channel system was designed around notebook PC. Each channel consisted of a time and frequency domain block, and T-F(time-frequency) domain block. The captured data in each channel was used to display and Quantify : raw EMG, histogram, zero crossing, turn, RMS(root mean square), variance, mean, power spectrum, median frequency, mean frequency, wavelet transform, Wigner-Ville distribution, Choi-Williams distribution, and Cohen-Posch distribution. To evaluate the performance of the designed system, the static and dynamic contraction experiments from lumbar(waist) level of human were done. The experiment performed in five subjects, and various parameters were tested and compared. This system could equally well be modified to allow acquisition, processing, and analysis of EMG signals in other studies and applications.

• Journal of Information Display
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• v.3 no.3
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• pp.17-23
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• 2002

In this work we report methods of formation of three-dimensional structures of particles in a liquid crystal host. We found that, under the appropriate conditions, the particles are captured and dragged by the moving isotropic/nematic front during the phase transition process. This movement of the particles can be enhanced significantly or suppressed drastically with the influence of an electric field and/or with changing the conditions of the phase transition, such as the rate of cooling. As a result, a wide variety of particle structures can be obtained ranging from a fine-grained cellular structure to stripes of varying periods to a course-grained "root" structures. Changing the properties of the materials, such as the size and density of the particles and the surface anchoring of the liquid crystal at the particle surface, can also be used to control the morphology of the three-dimensional particle network and adjust the physical properties of the resulting dispersions. These particle structures may be used to affect the performance of LCD's much as polymers have been used in the past.

• Journal of the Semiconductor & Display Technology
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• v.18 no.3
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• pp.82-87
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• 2019

One of the most critical aspects of the semiconductor industry is the quality of the wafer surface. And the vibrations of wafer grinder are supposed to be the most dominant factors to damage the wafer surface quality. In this study, structure of a wafer grinder has been analyzed through experiments and computer simulations to figure out the main reasons of the vibrations. And the design alterations based on the analysis were applied to identify the effects of those alterations on the vibration suppression. The result shows that the design alterations can effectively suppress about 90% of the vibrations.

• Journal of the Semiconductor & Display Technology
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• v.18 no.3
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• pp.115-121
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• 2019

Response surface methodology (RSM) is used to investigate the complex coupling effects of different operating parameters on silicon growth rate in planetary CVD reactor. Based on the computational fluid dynamics (CFD) model, an accurate RSM model is obtained to predict the growth rate with different parameters, including temperature, pressure, rotation speed of the wafer, and the mole fraction of dichlorosilane (DCS). Analysis of variance is used to estimate the contributions of process parameters and their interactions. Among the four operating parameters that have been studied, the influences of susceptor temperature and the operating pressure were the most significant factors that affect silicon growth rate, followed by the mole fraction of DCS. The influence of wafer rotation is the least. The validation tests show that the results of silicon deposition rate obtained from the regression model are in good agreement with those from CFD model and the maximum deviations is 2.15%.

• Journal of the Semiconductor & Display Technology
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• v.13 no.1
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• pp.7-12
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• 2014

In this study, we investigate the effects of corona-discharge pre-treatment on the properties of carbon nanotubes (CNTs) which are used as flexible transparent electrodes. The CNTs are deposited on PET (polyethylene terephthalate) substrates using a spray coating method. Prior to the deposition of CNTs, the PET substrates are corona-treated by varying the feeding directions of the PET substrate and the numbers of treatments. The variations in the surface morphologies and roughnesses of the PET substrates due to corona-treatment are characterized via atomic force microscopy (AFM). Dynamic contact angles (DCAs) of the corona-treated PET substrates are measured and analyzed as functions of the treatment conditions. Also, the sheet resistances and visible-range transmittances of the CNTs deposited on PET substrates are measured before and after bending test. The experimental results obtained in this study provide strong evidences that the adhesive forces between CNTs and PET substrates can be substantially enhanced by corona-discharge pretreatment.