Browse > Article

Design Alterations of a Wafer Grinder for the Improved Stability  

Shin, Yun Ho (Graduate School, Kumoh National Institute of Technology)
Ro, Seung Hoon (Dept. of Mechanical System Engineering, Kumoh National Institute of Technology)
Yoon, Hyun Jin (Graduate School, Kumoh National Institute of Technology)
Kil, Sa Geun (Daeshin Design Co.)
Kim, Young Jo (Dept. of Mechanical Engineering, Gumi University)
Lee, Dae Woong (Hanon Systems Co., Ltd.)
Kim, Sang Hwa (Korea Polytechnics)
Publication Information
Journal of the Semiconductor & Display Technology / v.18, no.3, 2019 , pp. 82-87 More about this Journal
Abstract
One of the most critical aspects of the semiconductor industry is the quality of the wafer surface. And the vibrations of wafer grinder are supposed to be the most dominant factors to damage the wafer surface quality. In this study, structure of a wafer grinder has been analyzed through experiments and computer simulations to figure out the main reasons of the vibrations. And the design alterations based on the analysis were applied to identify the effects of those alterations on the vibration suppression. The result shows that the design alterations can effectively suppress about 90% of the vibrations.
Keywords
Semiconductor Wafer; Wafer Grinder; Design Alterations; Vibration Control; Improved Stability;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
연도 인용수 순위
1 Kim, J. Y., "Global market growth of 2.6% this year," 14th, Jan, 2019, https://www.yna.co.kr/view/AKR20190113019900003, Latest Article.
2 Kil, S. G., and Ro, S. H., "Design alterations of a grinder of semiconductor wafer for the improved stability," Journal of the Semiconductor & Display Technology, Vol. 16, No. 1, pp. 1-3, 2017.
3 Silicon Valley Microelectronics, "450mm Wafers," 2017, https://www.svmi.com/silicon-wafers/450mm-wafers/, Silicon Wafers.
4 Ro, S. H., and Park, Y. R., "Stability Design of a Laser Cutter for the Strengthened Glass", Journal of the Semiconductor & Display Technology, Vol. 14, No. 1, pp. 19-25, 2015.