• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.104-107
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• 2001

In order to investigate the effect of Ge addition to the Cu matrix on the microstructure and the critical current density, four kinds of internal tin processed Nb$_3$Sn strands with pure Cu and Cu 0.2, 0.4, 0.6 wt % Ge alloys were drawn to 0.8 mm diameter. The microstructure and critical current of internal tin processed Nb$_3$Sn wires that were heat treated at temperatures ranging from 68$0^{\circ}C$ to 74$0^{\circ}C$ for 240h were investigated. The Ge addition to the matrix did not make workability worse. A Ge rich layer in the Cu-Ge matrix suppressed the growth of the Nb$_3$Sn layer and promoted grain coarsening. The greater the Ge content in the matrix, the lower the net Jc result after Nb$_3$sn reaction heat treatment. There was no significant variation in Jc observed with heat treatment temperature ranging from 68$0^{\circ}C$ to 74$0^{\circ}C$. The values of AC loss of Ge added wires were decreased to 40 % compare with no addition wire. Low AC loss was due to segregation of Ge rich layer in the Cu-Ge matrix. If Ge added wire with thin Nb filaments were fabricated, slow diffusion rate of Sn would be overcome and decreased AC loss that is weak Point of internal tin method.

• 한국초전도학회:학술대회논문집
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• v.9
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• pp.165-170
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• 1999

We have investigated the mixed-state Hall effect in HgBa$_2CaCu_2O_6$, HgBa$_2Ca_2Cu_3O_8$, and Tl$_2Ba_2Cau_2O_8$ thin films as functions of the magnetic field up to 18 T. At high fields and low temperatures, the scaling exponent in ${\rho}_{xy}$ = A${\rho}_{xx}\;^{\beta}$ shows a universal behavior, ${\beta}$ = 1 ${\pm}$ 0.1, regardless of the field, the number of CuO$_2$ layers, the types of defects, and even the types of compounds. At low fields and high temperatures, p = 1 ${\pm}$ 0.1 also appears as a universal number although the observed field range is rather limited. These observations show the universal scaling of Hall resistivity in the regions of the clean and the moderately clean limit, consistent with a theory based on the midgap states in the vortex core.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1993.05a
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• pp.22-27
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• 1993

we prepared 70K new BiPbAgSrCaCuO superconductor used diffusion of dual layer which composed of SrCaCuO and BiPbAgCuO compound. This method is used permeation and diffusion on partial melting point of BiPbAgCuO compound. Samples were analyzed by means of X-ray diffraction analysis, Thermal analysis, critical temperature and scanning electron microscopy. It was found that the best results were obtained for spread volume (A:B=1:0.6) and sintring time 210hours.

• Progress in Superconductivity and Cryogenics
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• v.15 no.2
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• pp.20-23
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• 2013

For sensitive measurements of micro-Tesla nuclear magnetic resonance (${\mu}T$-NMR) signal, a low-noise superconducting quantum interference device (SQUID) system is needed. We have fabricated a liquid He dewar for an SQUID having a large diameter for the pickup coil. The initial test of the SQUID system showed much higher low-frequency magnetic noise caused by the thermal magnetic noise of the aluminum plates used for the vapor-cooled thermal shield material. The frequency dependence of the noise spectrum showed that the noise increases with the decrease of frequency. This behavior could be explained from a two-layer model; one generating the thermal noise and the other one shielding the thermal noise by eddy-current shielding. And the eddy-current shielding effect is strongly dependent on the frequency through the skin-depth. To minimize the loop size for the fluctuating thermal noise current, we changed the thermal shield material into insulated thin Cu mesh. The magnetic noise of the SQUID system became flat down to 0.1 Hz with a white noise of 0.3 $fT/{\surd}Hz$, including the other noise contributions such as SQUID electronics and magnetically shielded room, etc, which is acceptable for low-noise ${\mu}T$-NMR experiments.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.2
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• pp.154-161
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• 1998

The effects of melting temperature and holding time on the critical current density($J_c$) of $YBa_2Cu_3O_x$ based superconducting bulk fabricated by MPMG process were investigated. The amount of the formed $Y_2BaCuO_5$ phases increased with the melting temperature. However, the value of critical current density was highest at 1120 $^{\circ}C$. With this proper melting temperature, the effect of holding time on the critical characteristics was also investigated. In the case of Ag addition, the volume of the formed $Y_2BaCuO_5$ phase when the amount of Ag addition was 10 wt% and 20 wt% was observed to be highest at 20 minute and 40 minute respectively. But in the specimen without Ag, volume of $Y_2BaCuO_5$ phase increased as the holding time increased. The proper melting temperature and the holding time obtained were 1120 $^{\circ}C$ and 20 minute. The long holding time was not effective for the $J_c$ improvement as well as the formation of $Y_2BaCuO_5$.

• Proceedings of the KSME Conference
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• 2001.06a
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• pp.413-418
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• 2001

Fundamental failure mode in a laminated composite pinned-joint is proposed to assess damage resulting from stress concentration in the plate. The joint area is a region with stress concentrations thus a complicated stress state exists. The modeling of damage in a laminated composite pinned-joint presents many difficulties because of the complexity of the failure process. In order to model progressive from initial to final, finite element methods are used rather than closed form stress analyses. Failure analysis must be a logical combination of suitable failure criteria and appropriate material properties degradation rules. In this study, the material properties which were obtained in previous study, the preparing process of the bearing strength test for a pinned joint CFRP composite plate subjected to in-plane loading at low temperature, and the FEM result of progressive damage model using ANSYS program are summarized to assess the structural safety of CFRP plate used in the magnetic supporting post of KSTAR(Korea Superconducting Tokamak Advanced Research).

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.165-166
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• 2005

In this paper, we investigated the quench generation of HTSC elements in fault types according to inductance variation in the integrated three-phase flux-lock type SFCL. The integrated three-phase flux-lock type SFCL was the upgrade version of the single-phase flux-lock type SFCL. The structure of the integrated three-phase flux-lock type SFCL consisted of three-phase flux-lock reactor wound on an iron core with the ratio of the same turn between coil 1 and coil 2 in each phase. When the SFCL is operated under the normal condition, the flux generated in the iron core is zero because the flux generated between two coils of each single phase is canceled out. Therefore, the SFCL's impedance is zero, and the SFCL has negligible influence on the power system. However, if a fault occurs in any single-phase among three phases, the flux generated in the iron core is not zero any more. The flux makes HTSC elements of all phases quench irrespective of the fault type, which reduces the current of fault phase as well as the current of sound phase. It was observed that the fault current limiting characteristics of the suggested SFCL were dependent on the quench characteristics of HTSC elements in all three phases.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05a
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• pp.65-68
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• 2003

Interconnected power system operation has given rise to the problem of increased fault levels and leads to over stressing of all the components. Use have been made of recently developed high Tc superconductor in devising a superconducting fault current limiter (SFCL) that promises optimum performance in terms of capital cost, size, auto sensing, operational losses, response time and reliability. Recently, research about the application of the SFCL is actively progressing in Korea. To be applied for SFCL practically, the electrical insulation design of SFCL must be developed. Therefore, this paper presents the result of an investigation of the dielectric characteristics of turn-to-turn insulation for SFCL in liquid nitrogen. The dielectric characteristics of turn-to-turn insulation models of SFCL were investigated. We obtained following results. The breakdown voltages increased as the spacer thickness and length increased. And the breakdown voltages of turn-to-turn model without spacer were higher than the breakdown voltages of turn-to-turn model with spacer under impulse as well as AC voltages. The information gathered in this test series should be helpful in the design of liquid nitrogen filled SFCL.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.11
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• pp.1241-1245
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• 2004

Continuous physical vapor deposition (PVD) method is one of many processes to fabricate long length coated conductor which is required for successful large-scale application of superconducting power devices. Three film deposition systems (pulsed laser deposition, sputtering, and evaporation) equipped with reel-to-reel(R2R) metal tape moving apparatus were installed and used to deposit multi-layer oxide thin films. Both RABiTS and IBAD texture templates are used. IBAD template consists of CeO$_2$(PLD)/YSZ(IBAD) on stainless steel(SS) metal tape, and RABiTS template has the structure of CeO$_2$/YSZ/Y$_2$O$_3$ which was continuously deposited on Ni-alloy tape using R$_2$R evaporation and DC reactive sputtering in a deposition system designed to do both processes. 0.4 m-long coated conductor with Ic(77 K) of 34 A/cm was fabricated using RABiTS template. 0.5 m and 1.1 m-long coated conductor with Ic(77 K) of 41 A/cm and 26 A/cm were fabricated using IBAD template.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.531-534
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• 2004

초전도 coated conductor는 보호층/초전도층/완충층/금속기판의 구조를 가지며 완충층은 다층산화물 박막으로 이루어져 있다. 본 연구에서는 니켈 기판의 원자가 초전도층으로 확산 침투하는 것을 방지하는 YSZ(Yttria Stabilized Zirconia) 박막의 증착방법 및 최적조건에 대하여 소개하고자 한다. 금속타겟을 사용하며 산화반응가스로서 수증기를 사용하는 것을 특징으로 하는 DC reactive sputtering을 이용하여 YSZ를 증착하였으며 기판 온도는 $850^{\circ}C$ 이며 증착시 수증기 분압은 1mTorr이었다. YSZ의 최적두께를 알아보기 위하여 $CeO_2(12.2nm)/Ni$ 상부에 130nm, 260nm, 390nm, 650nm로 두께를 달리하여 YSZ층을 증착하고 SEM으로 박막 표면상태를 관찰한 결과 columnar grain growth를 하며 두께가 두꺼워 질수록 표면조도가 증가함을 알 수 있었다. 4개의 각 시료위에 thermal evaporation 증착법을 이용하여 $CeO_2$를 18.3nm의 두께로 증착한 후 PLD를 이용하여 YBCO 초전도 박막을 300nm 두께로 증착하였고 77K, 0T에서 임계전류가 각각 0, 6A, 7.5A, 5A로 측정되었다. 이는 YSZ층의 두께가 두꺼워질수록 기판 구성원자의 확산방지역할을 충실히 하는 반면에 표면조도는 증가함을 알 수 있었다.