• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2007년도 추계학술대회 논문집
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• pp.364-367
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• 2007

In nano-imprint lithography (NIL) process, which has shown to be a good method to fabricate polymeric patterns, several kinds of pattern defects due to thermal effects during polymer flow and mold release operation have been reported. A typical defect in NIL process with high aspect ratio and low resist thickness pattern is a resist fracture during the mold release operation. It seems due to interfacial adhesion between polymer and mold. However, in the present investigation, FEM simulation of NIL molding process was carried out to predict the defects of the polymer pattern and to optimize the process by FEA. The embossing operation in NIL process was investigated in detail by FEM. From the analytical results, it was found that the lateral flow of polymer resin and the applied pressure in the embossing operation induce the weld line and the drastic lateral strain at the edge of pattern. It was also shown that the low polymer-thickness result in the delamination of polymer from the substrate. It seems that the above phenomena cause the defects of the final polymer pattern. To reduce the defect, it is important to check the initial resin thickness.

• 한국전기전자재료학회논문지
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• 제26권7호
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• pp.510-514
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• 2013

In order to prevent heat loss that occurs through the glass, low-emissivity (Low-E) coating methods with good insulating properties and high transmittance were used. InGaZnO/Ag/InGaZnO (IGZO/Ag/IGZO) multilayer thin films have been deposited on XG glass substrate by RF magnetron sputtering. Depending on the different thickness of Ag in multilayer films, the structural and optical properties of Low-E multilayer films were analyzed. By XRD analysis results, the multilayer thin films were observed to be amorphous structure regardless of Ag thickness. According to the AFM results, surface morphology of the multilayer films was observed and compared. Using UV-VIS spectroscopy, low emissivity property has been observed clearly with the transmittance of higher than 85% at visible range and lower than 30% at IR range.

• 한국초전도ㆍ저온공학회논문지
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• 제23권2호
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• pp.14-18
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• 2021

We investigated the structural suitability of GdFeO₃ (GdFO) as a buffer layer for the GdBa₂xCu₃O_7-x (GdBCO) superconducting films. GdFO films with different thicknesses and GdBCO thin films were all prepared by using a pulsed laser deposition technique. The analyses of X-ray diffraction and EXAFS data indicates that the c-axis parameter increases and the Fe-O bond length decreases with the GdFO thickness due to the compressive stain induced by the lattice mismatch between GdFO and STO substrate and as a result, the Debye-Waller factor, an index of disorder in the local structure near the Fe-O bond, increases with the GdFO thickness. However, for the GdBCO/GdFO bilayer structure, the Debye-Waller factor decreases as the GdFO thickness increases indicating a diminished disorder by the structural coupling between GdFO and GdBCO. These results indicate that an appropriate thickness of GdFO is required to be utilized as a magnetic buffer layer for the GdBCO superconducting films.

• 한국세라믹학회지
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• 제41권10호
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• pp.728-734
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• 2004

평균입자크기가 서로 다른 WC-Co계 모재위에 고온 열처리법과 화학적 에칭방법을 이용하여 다이아몬드 막을 코팅하고 압흔법을 통해 그 접착력(adhesion strength)을 평가하였다. $1450^{\circ}C$의 고온 열처리 방법에 의해 준비된 WC-Co 시편표면에서는 WC 입자가 성장하였으며, 그 결과 20$\mu$m 이상의 다이아몬드 막이 증착된 경우에도 100kg의 하중에서도 우수한 접착력이 얻어졌다. 그러나, 모재 표면입자의 과도한 입성장으로 시편 인선부에는 변형이 발생하였으며, 증착된 다이아몬드 막은 거친 표면조도를 보였다. 이와 비교하여, 화학적 부식의 경우에는 submicron 크기의 WC 입자를 제외하고, 2$\mu$m 이상의 WC 입자를 가지는 모재를 이용하여 10$\mu$m의 다이아몬드 코팅막을 증착시킨 경우에는, 60kg의 하중에서도 양호한 접착력이 유지되었다 특히, WC 입자가 클수록 접착력의 신뢰성이 대폭 향상되었다. 이는 수 $\mu$m 이내의 비교적 얇은 두께의 다이아몬드 막을 증착하는 경우 화학적 에칭방법이 시편 형상의 변형을 방지하고, 양호한 표면조도를 얻을 수 있어 고온 열처리 방식에 비해 효과적임을 의미한다.

• 한국재료학회지
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• 제11권4호
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• pp.319-323
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• 2001

펄스레이저 증착법 (PLD)으로 (0001)면 사파이어 기판 위에 성장시킨 ZnO 박막의 두게 변화가 표면형상, 결정성 및 전기/광학적 특성에 미치는 효과에 대하여 조사하였다. SEM 및 XRD 분석을 통해 약 4000 의 두께에서 3차원 island들이 생성되며, 박막의 두께가 증가함에 따라 결정립의 크기가 증가하고, 결정성이 향상되었음을 알 수 있었다 상온에서의 PL 측정을 통해 두께가 증가함에 따라 ultraviolet(UV) 및 deep level emission peak의 강도가 급격히 증가함을 알 수 있었다. Hall측정 결과, 모든 박막들이 H형 전도도를 보였고, 운반자농도가 $10^{19}$ $cm^{-3}$ 이상이었으며, 두께가 증가할수록 운반자농도가 감소하여 약 4000 에서 포화되는 경향을 보였다. 따라서, 사파이어 기판 위에 증착시킨 ZnO 박막은 약 4000 의 두께에서 bulk ZnO의 특성을 나타내었다.

• Tribology and Lubricants
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• 제38권5호
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• pp.199-204
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• 2022

This paper presents a numerical investigation of the influence of water molecule thickness on frictional behavior at the nanoscale using molecular dynamics simulation. Three different models, comprising water thin films of various thicknesses, were built, and indentation and sliding simulations were performed using the models. Various normal loads were applied by indenting the Si tip on the water film for the sliding simulation to evaluate the interplay between the water thin film thickness and the normal load. The results of the simulations showed that the friction force generally increased with respect to the normal load and thickness of the water thin film. The friction coefficient varied with respect to the normal load and the water film thickness. The friction coefficient was the smallest under a moderate normal force and increased with decreasing or increasing normal loads. As the water film became thicker, the contact area between the tip and water film became larger. Under well-lubricated conditions, the friction force was proportional to the contact area regardless of the water film thickness. As the normal force increased above a critical condition, the water molecules beneath the Si tip spread out; thus, the film could not provide lubrication. Consequently, the substrate was permanently deformed by direct contact with the Si tip, while the friction force and friction coefficient significantly increased. The results suggest that a thin water film can effectively reduce friction under relatively low normal load and contact pressure conditions. In addition, the contact area between the contacting surfaces dominates the friction force.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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• pp.155.2-155.2
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• 2013

Strain-relaxed SiGe layer on Si substrate has numerous potential applications for electronic and opto- electronic devices. SiGe layer must have a high degree of strain relaxation and a low dislocation density. Conventionally, strain-relaxed SiGe on Si has been manufactured using compositionally graded buffers, in which very thick SiGe buffers of several micrometers are grown on a Si substrate with Ge composition increasing from the Si substrate to the surface. In this study, a new plasma process, i.e., the combination of PIII&D and HiPIMS, was adopted to implant Ge ions into Si wafer for direct formation of SiGe layer on Si substrate. Due to the high peak power density applied the Ge sputtering target during HiPIMS operation, a large fraction of sputtered Ge atoms is ionized. If the negative high voltage pulse applied to the sample stage in PIII&D system is synchronized with the pulsed Ge plasma, the ion implantation of Ge ions can be successfully accomplished. The PIII&D system for Ge ion implantation on Si (100) substrate was equipped with 3'-magnetron sputtering guns with Ge and Si target, which were operated with a HiPIMS pulsed-DC power supply. The sample stage with Si substrate was pulse-biased using a separate hard-tube pulser. During the implantation operation, HiPIMS pulse and substrate's negative bias pulse were synchronized at the same frequency of 50 Hz. The pulse voltage applied to the Ge sputtering target was -1200 V and the pulse width was 80 usec. While operating the Ge sputtering gun in HiPIMS mode, a pulse bias of -50 kV was applied to the Si substrate. The pulse width was 50 usec with a 30 usec delay time with respect to the HiPIMS pulse. Ge ion implantation process was performed for 30 min. to achieve approximately 20 % of Ge concentration in Si substrate. Right after Ge ion implantation, ~50 nm thick Si capping layer was deposited to prevent oxidation during subsequent RTA process at $1000^{\circ}C$ in N2 environment. The Ge-implanted Si samples were analyzed using Auger electron spectroscopy, High-resolution X-ray diffractometer, Raman spectroscopy, and Transmission electron microscopy to investigate the depth distribution, the degree of strain relaxation, and the crystalline structure, respectively. The analysis results showed that a strain-relaxed SiGe layer of ~100 nm thickness could be effectively formed on Si substrate by direct Ge ion implantation using the newly-developed PIII&D process for non-gaseous elements.

• 한국초전도ㆍ저온공학회논문지
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• 제13권1호
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• pp.1-5
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• 2011

[ $CeO_2$ ]has been widely used for single buffer layer of coated conductor because of superior chemical and structural compatibility with $ReBa_2Cu_3O_{7-{\delta}}$(Re=Y, Nd, Sm, Gd, Dy, Ho, etc.). But, the surface of $CeO_2$ layer showed cracks because of the large difference in thermal expansion coefficient between metal substrate and deposited $CeO_2$ layer, when thickness of $CeO_2$ layer exceeds 100 nm on the biaxially textured Ni-3%W substrate. The deposition rate has been limited to be less than 6 $\AA$/sec in order to get a good epitaxy. In this research, we deposited $CeO_2$ single buffer layers on biaxially textured Ni-3%W substrate with 2-step process such as thin nucleation layer(>10 nm) with low deposition rate(3 $\AA$/sec) and thick homo epitaxial layer(>240 nm) with high deposition rate(30 $\AA$/sec). Effect of deposition temperature on degree of texture development was tested. Thick homo epitaxial $CeO_2$ layer with good texture without crack was obtained at $600^{\circ}C$, which has ${\Delta}{\phi}$ value of $6.2^{\circ}$, ${\Delta}{\omega}$ value of $4.3^{\circ}$ and average surface roughness(Ra) of 7.2 nm within $10{\mu}m{\times}10{\mu}m$ area. This result shows the possibility of preparing advanced Ni substrate with simplified architecture of single $CeO_2$ layer for low cost coated conductor.

• 한국전기전자재료학회논문지
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• 제24권2호
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• pp.162-165
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• 2011

In this paper, $CuInSe_2$ thin film was prepared by use of the co-evaporation method with the variation of the substrate temperature in the range of $100^{\circ}C$ to $400^{\circ}C$. The film was annealed at $300^{\circ}C$ for an hour in a vacuum chamber at $3{\times}10-4$ Pa. After annealing, the thin film prepared at the substrate temperatures of $100^{\circ}C$ and $200^{\circ}C$ was observed. The XRD (x-ray diffraction) pattern of sample prepared at $100^{\circ}C$ showed the single phase formation of $CuInSe_2$. However, at $200^{\circ}C$, there was no apparent difference in the XRD pattern except a variation in the intensity of the peak. As the annealing treatment of substrate improved the crystal structure of the film, it affected to the increase of an electron mobility, resulted in an increase in conductivity and a decrease in resistance. As a results, when the substrate temperature was at $200^{\circ}C$ and $300^{\circ}C$, the sheet resistance was 1.534 $\Omega/\Box$ and 1.554 $\Omega/\Box$, respectively, and the resistivity was $1.76{\times}10-6\;{\Omega}{\cdot}cm$ and $1.7210-6\;{\Omega}{\cdot}cm$, respectively. From the absorption spectrum measurements, there was no variation between the before and after annealing conductions. And it means that the annealing step does not affect the thickness of the thin film.

• 한국전기전자재료학회논문지
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• 제24권7호
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• pp.537-542
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• 2011

Recently, n-InZnO/p-CuO oxide diode has attracted great attention due to possible application for selector device of 3-dimensional cross-point resistive memory structures. To investigate the detailed properties of InZnO (IZO), we have deposited IZO films on the fused quartz substrate using PLD (pulsed laser deposition) method at oxygen pressure of 1~100 mTorr and substrate temperature of RT$\sim600^{\circ}C$. The influence of oxygen pressure and substrate temperature on structural, optical and electrical of IZO films is analyzed using XRD (x-ray diffraction), SEM (scanning electron microscopy), UV-Vis spectrophotometry, spectroscopic ellipsometry (SE) and hall measurements. The XRD results shows that the deposited thin films are polycrystalline over $300^{\circ}C$ of substrate temperature independent of oxygen pressure. The resistivity of films was increased as oxygen pressure and substrate temperature decrease. The thickness and optical constants of the deposited films measured with UV-Vis spectrophotometer were also compared with those of broken SEM and SE results.