• BMB Reports
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• v.55 no.12
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• pp.577-586
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• 2022

Stress granules (SGs) are stress-induced subcellular compartments, which carry out a particular function to cope with stress. These granules protect cells from stress-related damage and cell death through dynamic sequestration of numerous ribonucleoproteins (RNPs) and signaling proteins, thereby promoting cell survival under both physiological and pathological condition. During tumorigenesis, cancer cells are repeatedly exposed to diverse stress stimuli from the tumor microenvironment, and the dynamics of SGs is often modulated due to the alteration of gene expression patterns in cancer cells, leading to tumor progression as well as resistance to anticancer treatment. In this mini review, we provide a brief discussion about our current understanding of the fundamental roles of SGs during physiological stress and the effect of dysregulated SGs on cancer cell fitness and cancer therapy.

• Journal of the Korean GEO-environmental Society
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• v.8 no.6
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• pp.69-76
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• 2007

The sands which use for soil improvement of soft ground at coastal area contain more or less amount of shells. In this research the effects of shell contents on the liquefaction resistance of the shelly sand were studied. NGI cyclic simple shear tests were performed for the shell-sands with shell contents of 0%, 5%, 10%, 20%, 30% under the effective vertical stress of 50kPa, 100kPa and 150kPa for 40% and 55% of relative density, respectively. Cyclic simple shear test results showed that for the low effective vertical stress, the liquefaction resistance increased rapidly with increase of shell contents in both 40% and 55% relative density. On the other hand, for the high effective vertical stress, the liquefaction resistance increased slightly in 40% relative density and was almost same in 55% relative density. Liquefaction resistance decreased with increasing effective vertical stress for both 40% and 55% relative density. In the same effective vertical stress and shell contents, liquefaction resistance increased with the increase of relative density.

• Korean Journal of Materials Research
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• v.3 no.2
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• pp.166-174
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• 1993

Abstract The crack resistance of PSG(Phosphosilicate Glass) and PE-SiN(Plasma Enhanced CVD S${i_2}{N_4}$)films deposited on aluminium thin films on Si substrate was analyzed in this study. PSG was deposited by AP-CVD and PE- SiN by PE-CVD. All the films underwent repeated heat cycles at 45$0^{\circ}C$for 30 min. Crack formation and development were examined between each heat cycle. The crack behavior was found to be closely related to the stresses in the films. The stress induced by the difference in thermal expansion behavior between the passivation layers and underlying aluminum film may cause the crack. Crack resistance decreases as the thickness of PSG films increases due to the high tensile stress of the films. Phosphorus in the PSG films releases tensile stress and consequently the stress of the films tends to show compressive stress. As a result, crack resistance increased as the concentratin of P in the PSG films increased. Crack resistance in the PE-SiN films also increased with compressive stress. An experimental model to predict crack generation in the PSG and PE-SiN films during heat cycle was suggested.

• Bulletin of the Society of Naval Architects of Korea
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• v.9 no.1
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• pp.15-20
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• 1972

As the technique of resistance spot welding became more and more advanced the factors hitherto considered secondary become more and more important. Among these factors the distribution of heat and temperature during resistance spot welding is particularly important in conjunction with thermal stress, strain and residual stress, strain problems. The analytical investigations upon the transient temperature due to resistance spot welding were made for the carbon steel plate and aluminum alloy plate. The numerical values obtained by the analytical investigation are nearly identical with the temperature distribution which obtained by D.J. Sullivan and some other experimental data. It was thought therefore useful to estimate the heat effect upon the material such as a residual stress and strain, metalurgical change, change in physical properties and etc.

• Journal of Welding and Joining
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• v.16 no.2
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• pp.73-83
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• 1998

This study investigated the relationships between the microstructure and the wear resistance of hardfaced iron/chromium alloys to examine the low stress abrasive wear mechanism. The effects of volume fraction of reinforcing phases(chromium carbide and eutectic phase) were studied. The alloys were deposited once or twice on a mild steel plate using a self-shielding flux cored arc welding process. The low stress abrasion resistance of he alloys against dry sands was measured by the Dry Sand/Ruber Wheel Abrasion Tester (RWAT). The wear resistance of hypoeutectic alloys, below 0.36 volume fraction of chromium-carbide phase (VFC), behaved as Equal Pressure Mode (EPM) for the inverse rule of mixture whereas the wear resistance of hypereutectic alloys, above 0.36 VFC, represented Equal Wear Mode (EWM) for the linear rule of mixture.

• The Journal of the Korea institute of electronic communication sciences
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• v.16 no.5
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• pp.931-940
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• 2021

As information security(IS) is recognized as a critical success factor for organizational growth, organizations are increasing their investment in adopting and operating strict IS policies and technologies. However, when strict IS technology is adopted, IS-related techno-stress may occur in the employees who apply IS technology to their tasks. This study proposes the effect of IS-related techno-stress formed in individuals on IS policy resistance through IS strain and proves that task-technology fit mitigates the negative effect of techno-stress. Research models and hypotheses were presented through previous studies, and the secured samples were used, and structural equation modeling was applied to verify hypothesis. As a result of the study, it was confirmed that IS-related techno-stress (overload, complexity) affected IS policy resistance through IS strain (anxiety, fatigue), and that task-technology fit moderated the relationship between techno-stress and strain. This study suggests a strategic direction for improving the level of internal IS from the viewpoint of suggesting ways to mitigate the stress of employees that may occur when IS policies and technologies are adopted.

• Toxicological Research
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• v.33 no.1
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• pp.1-5
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• 2017

Nuclear factor E2-related factor 2 (Nrf2), a transcription factor, controls the expression of genes encoding cytoprotective proteins, including antioxidant enzymes that combat oxidative and electrophilic stress to maintain redox homeostasis. However, recent studies demonstrated that, in cancer, aberrant activation of Nrf2 by epigenetic alterations promotes high expression of cytoprotective proteins, which can decrease the efficacy of anticancer drugs used for chemotherapy. In this review, we summarize recent findings regarding the relationship between oxidative stress, Nrf2, epigenetic modification, and anticancer drug resistance, which should aid in development of new strategies to improve chemotherapeutic efficacy.

• New & Renewable Energy
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• v.6 no.1
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• pp.38-45
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• 2010

Abstract Under the physical stress on photovoltaic (PV) module, it will be warped according to elongation of the front glass and then micro-crack will be occurred in the thermally sealed solar cell. This micro-crack leads to drop of short circuit current of the PV module. This is because of increase of resistance component by micro-crack. Micro-crack at specific solar cell in the module lessens the durability of PV module with reduced output, hot-spot caused by solar cell output mismatch and increased resistance component. This study shows the relation between electrical characteristics and micro- cracks due to mechanical stress on PV module.

• Journal of the Korean Society of Safety
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• v.23 no.4
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• pp.25-29
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• 2008

Recently, new functionally graded material(FGM) that has a spatial variation in composition and properties is developed because of its good quality. This material yields the demands for resistance to corrosion and high temperature in turbine blade, wear resistance as in gears and high strength machine parts. Especially coating treatment in FGM surface brings forth a mechanical weak at the interface due to discontinuous stress resulting from a steep material change. It often, leads cracks or spallation in a coating area around an interface. The behavior of propagation cracks in FGMs was here investigated. The interface stresses were reduced because of graded material properties. Also graded material parameter with exponential equation was founded to influence the stress intensity factor. And the resistance curve with FGM coating was slightly increased.

• Korean Journal of Metals and Materials
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• v.46 no.9
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• pp.585-592
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• 2008

Flip-chip bonding using Cu-Sn mushroom bumps composed of Cu pillar and Sn cap was accomplished, and the contact resistance and the thermal cycling reliability of the Cu-Sn mushroom bump joints were compared with those of the Sn planar bump joints. With flip-chip process at a same bonding stress, both the Cu-Sn mushroom bump joints and the Sn planar bump joints exhibited an almost identical average contact resistance. With increasing a bonding stress from 32 MPa to 44MPa, the average contact resistances of the Cu-Sn mushroom bump joints and the Sn planar bump joints became reduced from $30m{\Omega}/bump$ to $25m{\Omega}/bump$ due to heavier plastic deformation of the bumps. The Cu-Sn mushroom bump joints exhibited a superior thermal cycling reliability to that of the Sn planar bump joints at a bonding stress of 32 MPa. While the contact resistance characteristics of the Cu-Sn mushroom bump joints were not deteriorated even after 1000 thermal cycles ranging between $-40^{\circ}C$ and $80^{\circ}C$, the contact resistance of the Sn planar bump joints substantially increased with thermal cycling.