• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 춘계학술대회 논문집 방전 플라즈마 유기절연재료 초전도 자성체연구회
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• pp.11-14
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• 2004

In this paper, the effect of adhesion properties of semiconductive-insulating interface layer of silicone rubber on electrical properties was investigated. The modifications produced on the silicone surface by oxygen plasma were accessed using ATR-FTIR, contact angle and AFM. Adhesion was obtained from T-peel tests of semiconductive layer having different treatment durations. In addition, ac breakdown test was carried out for elucidating the change of electrical property with duration of plasma treatment. From the results, the treatment in the oxygen plasma produced a noticeable increase in surface energy, which can be mainly ascribed to the the creation of O-H and C=O. It is observed that adhesion performance was determined by not surface energy but roughness level of silicone surface. It is found that ac dielectric strength was increased with improving the adhesion between the semiconductive and insulating interface.

• 한국재료학회지
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• 제27권6호
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• pp.318-324
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• 2017

In this study, two Fe-30Mn-0.2C-(1.5Al) high-manganese steels with different surface conditions were hydrogen-charged under high temperature and pressure; then, tensile testing was performed at room temperature in air. The yield strength of the 30Mn-0.2C specimen increased with decreasing surface roughness(achieved via polishing), but that of the 30Mn-0.2C-1.5Al specimen was hardly affected by the surface conditions. On the other hand, the tendency of hydrogen embrittlement of the two high-manganese steels was not sensitive to hydrogen charging or surface conditions from the standpoints of elongation and fracture behavior. Based on the EBSD analysis results, the small decrease in elongation of the charged specimens for the Fe-30Mn-0.2C-(1.5Al) high-manganese steels was attributed to the enhanced dislocation pile-up around grain boundaries, caused by hydrogen.

• Geomechanics and Engineering
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• 제24권4호
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• pp.307-321
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• 2021

In an earlier publication (Serrano et al. 2014), the theoretical basis for evaluating the shear strength in rock joints was presented and used to derive an equation that governs the relationship between tangential and normal stresses on the joint during slippage between the joint faces. In this paper, the theoretical equation is applied to two non-linear failure criteria by using non-associated flow laws, including the modified Hoek and Brown and modified Mohr-Coulomb equations. The theoretical model considers the geometric dilatancy, the instantaneous friction angle, and a parameter that considers joint surface roughness as dependent variables. This model uses a similar equation structure to the empirical law that was proposed by Barton in 1973. However, a good correlation with the empirical values and, therefore, Barton's equation is necessary to incorporate a non-associated flow law that governs breakage processes in rock masses and becomes more significant in highly fractured media, which can be induced in a rock joint. A linear law of dilatancy is used to assess the importance of the non-associated flow to obtain very close values for different roughness states, so the best results are obtained for null material dilatancy, which considers significant changes that correspond to soft rock masses or altered zones of weakness.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1999년도 하계학술대회 논문집 D
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• pp.1645-1647
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• 1999

Epoxy compound has been used as insulation material in electrical equipment because of its properties 1) Nowadays, becoming higher voltage system, the properties of interface between epoxy and its metal insert become more important. In this paper, we suggest two types semiconducting paste. One is epoxy type and the other is olephine type. After sprayed the semiconducting paste on metal insert sanded, we procedure the test one is the adhesion strength test, the other is electrical breakdown strength test. So we knew that the epoxy type paste became more higher adhesion strength than olephine type paste because of its homogeneity at the interfaces. And at the breakdown strength test, olephine type paste became less higher than epoxy type paste because of its volatility. So in this study, we suggest the optimum interface condition by adjusting the semiconducting paste and surface roughness.

• Geomechanics and Engineering
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• 제11권3호
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• pp.361-372
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• 2016

The soil-concrete interface shear strength, although has been extensively studied, is still difficult to predict as a result of the dependence on many factors such as normal stresses, surface roughness, particle sizes, moisture contents, dilation angles of soils, etc. In this study, a well-known rigorous statistical learning approach, namely the least squares support vector machine (LS-SVM) realized in a ubiquitous spreadsheet platform is firstly used in estimating the soil-structure interface shear strength. Instead of studying the complicated mechanism, LS-SVM enables to explore the possible link between the fundamental factors and the interface shear strengths, via a sophisticated statistic approach. As a preliminary investigation, the authors study the expansive soils that are found extensively in most countries. To reduce the complexity, three major influential factors, e.g., initial moisture contents, initial dry densities and normal stresses of soils are taken into account in developing the LS-SVM models for the soil-concrete interface shear strengths. The predicted results by LS-SVM show reasonably good agreement with experimental data from direct shear tests.

• 한국재료학회지
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• 제17권2호
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• pp.61-67
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• 2007

The magnetron reactive sputtering was adopted to deposit CuO buffer layers on the polyimide surfaces for increasing the adhesion strength between Cu thin films and polyimide, varying $O_2$ gas flow rate from 1 to 5 sccm. The CuO oxide was formed through all the $O_2$ gas flow rates of 1 to 5 sccm, showing the highest value at the 3 sccm $O_2$ gas flow rate. The XPS analysis revealed that the $Cu_2O$ oxide was also formed with a significant ratio during the reactive sputtering. The adhesion strength is mainly dependent on the amount of CuO in the buffer layers, which can react with C-O-C or C-N bonds on the polyimide surfaces. The adhesion strength of the multi-layered Cu/buffer layer/polyimide specimen decreased linearly as the heating temperature increased to $300^{\circ}C$, even though there showd no significant change in the chemical state at the polyimide interface. This result is attributed to the decrease in surface roughness of deposited copper oxide on the polyimide, when it is heated.

• 한국재료학회지
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• 제31권3호
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• pp.122-131
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• 2021

In the fabrication of joined materials between anodized aluminum alloy and polymer, the performance of the metal-polymer joining is greatly influenced by the chemical properties of the oxide film. In a previous study, the dependence of physical joining strength on the thickness, structure, pore formation, and surface roughness of films formed on aluminum alloys is investigated. In this study, we investigated the effect of silane coupling treatment on the joining strength and sealing performance between aluminum alloy and polymer. After a two-step anodization process with additional treatment by silane, the oxide film with chemically modified nanostructure is strongly bonded to the polymer through physical and chemical reactions. More specifically, after the two-step anodization with silane treatment, the oxide film has a three-dimensional (3D) nanostructure and the silane components are present in combination with hydroxyl groups up to a depth of 150 nm. Accordingly, the joining strength between the polymer and aluminum alloy increases from 29 to 35 MPa, and the helium leak performance increases from 10-2-10-4 to 10-8-10-9 Pa ㎥ s-1.

• 마이크로전자및패키징학회지
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• 제26권4호
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• pp.133-140
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• 2019

열 사이클 조건이 전해 Cr/Ni-P 이중도금 시편의 접합강도 및 균열성장거동에 미치는 영향을 분석하였다. 전해 Ni-P 도금층을 열처리를 통해 결정화 시킨 후 전해 Cr 도금 후 한번 더 열처리한 결과, Cr/Ni-P 계면에서 상호확산으로 인해 Cr-Ni 고용체 band layer가 관찰되었다. 열 사이클 전 접합강도는 25.6 MPa이였으나, 1,000사이클 후 Cr 도금층의 균열 밀도 및 표면 거칠기 증가로 인해 도금층과 접착제 사이의 기계적 고착효과가 향상되어 접착제와 Cr 도금층 사이에서 박리되었고, 접합강도는 47.6 MPa로 점차적으로 증가하였다.

• 한국해안·해양공학회논문집
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• 제30권6호
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• pp.298-305
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• 2018

본 연구에서는 해양 항만 콘크리트 구조물의 보수작업을 위한 수중코팅제의 부착 특성을 조사하기 위하여 실험적 연구를 수행하였다. 고려된 실험변수는 코팅제의 종류, 코팅대상 모재의 표면 거칠기, 도포 작업환경(육상 혹은 수중)으로 부착 강도는 Pull-off 방식으로 측정하였다. 코팅제의 부착 강도는 각 수중코팅제의 도포 작업 완료 24시간 후에 ASTM C1583 규정에 따라 측정하였다. 또한, 콘크리트 모재와 코팅제 간의 부착파괴 거동(코팅제, 계면, 콘크리트 모재)을 육안으로 관찰하였으며 측정된 부착 강도 수치에 근거하여 각 실험요인의 비교분석을 수행하였다. 실험결과, 수중에서 도포한 코팅제의 부착 강도가 육상의 경우에 비해 감소하는 경향을 보였으며 수중환경에서는 부착 강도에 미치는 모재 표면 거칠기의 영향이 육상의 경우에 비하여 미비하였다. 마지막으로 수중코팅제의 선정, 사용 시에 유의할 점에 대하여 설명하였다.

• Tribology and Lubricants
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• 제36권2호
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• pp.55-63
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• 2020

Recently, graphene has attracted considerable attention owing to its unique electrical, optical, thermal, and mechanical properties. The broad spectrum of applications from optics, sensors, and electronics to biodevice have been proposed based on these properties. In particular, graphene has been proposed as a protective coating layer and solid lubricant for microdevices and nanodevices because of its high mechanical strength, chemical inertness, and low friction characteristics. During the past decade, extensive efforts have been made to explore the tribological characteristics of graphene under various conditions and to expand its applicability. In addition to the experimental approaches, the molecular simulations performed provide fundamental insights into the friction and wear characteristics of graphene resulting from molecular interactions. This work is a review of the studies conducted over the past decade on the tribological characteristics of graphene using molecular simulation. These studies demonstrate the principal mechanisms of the superlubricity of graphene and help clarify the influences of surface conditions on tribological behavior. In particular, the investigation of the effects of the number of layers, strength of adhesion to the substrate, surface roughness, and commensurability provides deeper insights into the tribological characteristics of graphene. These fundamental understandings can help elucidate the feasibility of graphene as a protective coating layer and solid lubricant for microdevices and nanodevices.