• Title/Summary/Keyword: strain plane

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Measurement of Material Deformation Using Laser Speckle (레이저 스페클을 이용한 재료 변형 측정)

  • 전문창;강기주
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2002.05a
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    • pp.688-694
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    • 2002
  • As a tool for strain measurement to work with screw driven or hydraulic material test systems, in which mechanical vibration is inherent, SSDG(Speckle Strain/Displacement Gage), ESP(Electronic Speckle Photography) and its 3-dimension version SDSP are investigated for the theory and practical appliance. Through tension test of steel strips, their validity and shortcomings are examined. As the results, it has been shown that, although SSDG and ESP provide direct measurement of in-plane strain in one direction, they are so sensitive to the out-plane displacement. On the other hand, SDSP which is aided with DIC (Digital Image Correlation) technique to trace the movement of the speckles provides not only in-plane 2-dimensional displacement field, but also out-of-plane displacement simultaneously. However, because the DIC is time-consuming, not automated yet and it needs post-processing to evaluate strain from the displacement field, SDSP appears to be not adequate as a real time sensor.

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Improvement of Sensitivity to In-plane Strain/Deformation Measurement by Micro-ESPI Technique (마이크로 ESPI 기법에 의한 면내 변형 측정 민감도 향상)

  • Kim D.I.;Huh Y.H.;Kee C.D.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.06a
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    • pp.1442-1445
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    • 2005
  • Several test methods, including micro strain/deformation measurement techniques, have been studied to more reliably measure the micro properties in micro/nano materials. Therefore, in this study, the continuous measurement of in-plane tensile strain in micro-sized specimens of thin film materials was introduced using the micro-ESPI technique. TiN and Au thin films 1 and $0.47\;\mu{m}$ thick, respectively, were deposited on the silicon wafer and fabricated into the micro-sized tensile specimens using the electromachining process. The micro-tensile loading system and micro-ESPI system were developed to measure the tensile strain during micro-tensile test. The micro-tensile stress-strain for these materials was determined using the algorithm for continuous strain measurement. Furthermore, algorithm for enhancing the sensitivity to measurement of in-plane tensile strain was suggested. According to the algorithm for enhancement of sensitivity, micro-tensile strain data between interfringe were calculated. It is shown that the algorithm for enhancement of the sensitivity suggested in this study makes the sensitivity to the in-plane tensile strain increase.

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Investigation of Plane Strain Fatigue Crack Growth Behavior by Using Side-Grooved Specimens (측면홈 시험편을 이용한 평면 변형률 피로 균열 진전에 관한 연구)

  • 김종한;송지호
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.16 no.1
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    • pp.63-69
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    • 1992
  • Plane-strain fatigue crack growth behavior of 7075-76 aluminium alloy was investigated by using side-grooved through-thickness center cracked tension(CCT) specimens. The effect of side-groove on the stress intensity factor value was examined. The effective thickness expression of $B_{e}$= $B_{o}$-( $B_{o}$-( $B_{ o-B_{n}^{2}}$ $B_{o}$ is the most appropriate to evaluate the stress intensity factor of side-grooved CCT specimen for fatigue testing. Fatigue crack growth rates can be well described by the effective stress intensity factor range based on closure measurements, for both side-grooved and uniform thickness specimens. Provided that the thickness of specimen meets the requirements for valid plane-strain fracture toughness, uniform thickness specimen data may be assumed to approximately represent the plane strain through-thickness crack growth behavior.ehavior.r.

Study on In-plane Strains of Electro-Active Paper (생체 모방 종이 작동기의 면내 변형에 관한 연구)

  • Jung, Woo-Chul;Kim, Jae-Hwan;Lee, Sun-Kon;Bae, Seung-Hun
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2005.11a
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    • pp.727-730
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    • 2005
  • Cellulose based Electro-Active Papers (EAPap) is very promising material due to its merits in terms of large bending deformation, low actuation voltage, ultra-lightweight, and biodegradability. These advantages make it possible to utilize applications, such as artificial muscles and achieving flapping wings, micro-insect robots and smart wall papers. This paper investigates the in-plane strains of EAPap under electric fields, which are useful for a contractile actuator application The preparation of EAPap samples and the in-plane strain measurement system are explained, and the test results are shown in terms of electric field, frequency and the oriental ions of the samples. The power consumption and the strain energy of EAPap samples are discussed. Although there are still unknown facts in EAPap material, this in-plane strain may be useful for artificial muscle applications.

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Evaluation of Displacement Measurement Technique Using Laser Speckle and Digital Image Correlation Method (레이저 스페클과 디지털 화상관련법을 이용한 변위 측정방법의 평가)

  • 강기주;이정현;전문창
    • Journal of the Korean Society for Precision Engineering
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    • v.20 no.6
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    • pp.47-54
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    • 2003
  • As a tool for strain measurement to work with screw driven or hydraulic material test systems, in which mechanical vibration is inherent, SSDG (Speckle Strain/Displacement Gage), ESP (Electronic Speckle Photography) and its 3-dimension version SDSP are evaluated for the theory and practical appliance. Through tension test of steel strips, their validity and shortcomings are examined. As the results, it has been shown that, although SSDG and ESP provide direct measurement of in-plane strain in one direction, they are so sensitive to the out-plane displacement. On the other hand, SDSP which is aided with DIC (Digital Image Correlation) technique to trace the movement of the speckles provides not only in-plane 2-dimensional displacement field, but also out-of-plane displacement simultaneously. However, because the DIC is time-consuming, not automated yet and it needs post-processing to evaluate strain from the displacement field, SDSP appears to be not adequate as a real time sensor.

Strain Analysis in the Slipline Field for Strip Drawing (판재인발 슬립라인장의 변형해석)

  • 구인회
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.13 no.4
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    • pp.660-669
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    • 1989
  • The strain distribution in a wide strip drawn through a wedge-shaped die is obtained from the numerical integration of strain increments along the flow path of material points in the slipline field for a non-hardening material under the plane strain condition. It is shown that the strain in the surface layer increases with friction and that the strain at the mid-plane is a function of area reduction only. The redundant deformation factor, obtained from the average strain in a drawn strip, increases with friction. For the workability analysis of a strip drawing process, the strain states along with hydrostatic stresses are needed for the evaluation of a damage function based on the hole-growth mechanism of ductile fracture. The critical maximum of the damage function is assumed to be a material constant. As a result, mid-plane cracking is likely to occur in a process at a small reduction, with a large die angle, and in poor lubrication. Distortions of an initially transverse line are also calculated.

Localized deformation in sands and glass beads subjected to plane strain compressions

  • Zhuang, Li;Nakata, Yukio;Lee, In-Mo
    • Geomechanics and Engineering
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    • v.5 no.6
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    • pp.499-517
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    • 2013
  • In order to investigate shear behavior of granular materials due to excavation and associated unloading actions, load-controlled plane strain compression tests under decreasing confining pressure were performed under drained conditions and the results were compared with the conventional plane strain compression tests. Four types of granular material consisting of two quartz sands and two glass beads were used to investigate particle shape effects. It is clarified that macro stress-strain behavior is more easily influenced by stress level and stress path in sands than in glass beads. Development of localized deformation was analyzed using photogrammetry method. It was found that shear bands are generated before peak strength and shear band patterns vary during the whole shearing process. Under the same test condition, shear band thickness in the two sands was smaller than that in one type of glass beads even if the materials have almost the same mean particle size. Shear band thickness also decreased with increase of confining pressure regardless of particle shape or size. Local maximum shear strain inside shear band grew approximately linearly with global axial strain from onset of shear band to the end of softening. The growth rate is found related to shear band thickness. The wider shear band, the relatively lower the growth rate. Finally, observed shear band inclination angles were compared with classical Coulomb and Roscoe solutions and different results were found for sands and glass beads.

Plane-Strain Analysis of Auto-Body Panel Using the Rigid-Plastic Finite Element Method (강소성 유한요소법을 이용한 자동차 판넬 성형공정의 평면 변형해석)

  • 양동열;정완진;송인섭;전기찬;유동진;이정우
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.15 no.1
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    • pp.169-178
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    • 1991
  • A plane-strain finite element analysis of sheet metal forming is carried out by using the rigid-plastic FEM based on the membrane theory. The sheet material is assumed to possess normal anisotropy and to obey Hill's new yield criterion and its associated flow rule. A formulation of initial guess generation for the displacement field is derived by using the nonlinear elastic FEM. A method of contact treatment is proposed in which the skew boundary condition for arbitrarily shaped tools is successively used during iteration. In order to verify the validity of the developed method, plane-strain drawing with tools in analytic expression and with arbitrarily shaped tools is analyzed and compared with the published results. The comparison shows that the present method can be effectively used in the analysis of plane-strain sheet metal forming and thus provides the basis of approximate sectional analysis of panel-like sheet forming.

Finite Element Analysis of Fatigue Crack Closure under Plane Strain State (평면변형률 상태 하에서 유한요소해석을 이용한 균열닫힘 거동 예측 및 평가)

  • Lee, Hak-Joo;Song, Ji-Ho;Kang, Jae-Youn
    • Proceedings of the KSME Conference
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    • 2004.11a
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    • pp.202-207
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    • 2004
  • An elastic-plastic finite element analysis of fatigue crack closure is performed for plane strain conditions. The stabilization behavior of crack opening level and the effect of mesh size on the crack opening stress are investigated. In order to obtain a stabilized crack opening level for plane strain conditions, the crack must be advanced through approximately four times the initial monotonic plastic zone. The crack opening load tends to increase with the decrease of mesh size. The mesh size nearly equal to the theoretical plane strain cyclic plastic zone size may provide reasonable numerical results comparable with experimental crack opening data. The crack opening behavior is influenced by the crack growth increment and discontinuous opening behavior is observed. A procedure to predict the most appropriate mesh size for different stress ratio is suggested. Crack opening loads predicted by the FE analysis based on the procedure suggested resulted in good agreement with experimental ones within the error of 5 %. Effect of the distance behind the crack tip on the crack opening load determined by the ASTM compliance offset method based on the load-displacement relation and by the rotational offset method based on the load-differential displacement relation is investigated. Optimal gage location and method to determine the crack opening load is suggested.

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