• 한국지반공학회:학술대회논문집
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• 한국지반공학회 2001년도 봄 학술발표회 논문집
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• pp.563-570
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• 2001

In this study, the charactersistics of horizontal drains used to stabilize the dredged fill are investigated experimentally by doing tensile strength test, discharge capacity test, and filter clogging test. The types of the drains selected for the study are filament type (Tyre-E), embossed type(Type-P) and heat bonded cubic type with the thickness 10mm(Type-010) and 5mm(Type-05). The results of tensile strength and discharge capacity test show that the performance of drain Type-O10 was better than the other drains. This is caused by the fact that the lattice shape core of drain Type-O10 has strong rigidity and minimizes the loss of the sectional area of discharge with increased confining pressure. Analyzing the compatibility of filters by the results of the strength characteristics test and clogging test, the filter of filament type drain produced with polyester clothed polyamide performed well.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2017년도 춘계학술대회 논문집
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• pp.51-63
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• 2017

The touch panel was developed decades ago and has become a popular input device in daily life. Because human-computer interaction is becoming more important, the next generation of touch panels require stretchability and bio-compatibility to allow integration with the human body. However, because most touch panels were developed based on stiff, brittle electrodes, electronic touch panels face difficulties to achieve such requirements. In this paper, for the first time, we demonstrate an ionic touch panel based on polyacrylamide hydrogel containing LiCl ions. The panel is soft and stretchable and thus, can sustain a large deformation. The panel can freely transmit light information through it because the hydrogel is transparent, with 99 % transmittance for visible light. A 1-dimensional touch strip was investigated to reveal the basic mechanism of sensing, and a 2-dimensional touch panel was developed to demonstrate its functionalities. The ionic touch panel was operated under high deformation with more than 1000% areal strain without sacrificing its functionalities. Furthermore, an epidermal touch panel on the skin was developed to demonstrate the mechanical and optical invisibility of the ionic touch panel through writing words, playing the piano and playing games.

• 한국농공학회논문집
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• 제52권3호
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• pp.105-111
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• 2010

It is very important to select carefully backfill materials and build for the structural integrity of abutment in bridge. In general, backfill materials of unbound crushed stones (SB-1) are used to provide the safety of abutment structure and to reduce differential settlement around abutment that is significantly related with performance of road pavement under working conditions. In this study, to evaluate the compatibility of backfill materials at abutment and to develop the abutment design program, i) basic properties of subgrade soils in Korea, ii) evaluation of deformational characteristics of backfill materials from RC/TS tests, cyclic TX tests and Creep tests were accomplished.

• KCI Concrete Journal
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• 제11권3호
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• pp.53-64
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• 1999

A theory is proposed to predict the response of the load-deformation relationship of the reinforced concrete structures under the service state after cracking. The crack direction and concrete strains through the loading history before failure can be estimated by this theory based on the rotating crack model, which considers equilibrium, compatibility conditions, and average stress-strain relationship. The proposed crack direction and deformation show good agreement with test results under service state. The behavior of a variety of concrete structures, such as shear walls, deep beams and the web of box girders, can be predicted by this proposed theory under service state.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part 1
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• pp.696-697
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• 2006

This paper presents the densification and microstructure evolution of bilayer components made from 316L stainless steel and M2 High speed steel during co-sintering process. The sintering was carried out at temperatures ranging from $1230-1320^{\circ}C$ in a reducing atmosphere. The addition of boron to 316L was examined in order to increase the densification rate and improve the sintering compatibility between the two layers. It was shown that the mismatch strain bettwen the two layers induces biaxial stresses during sintering, influencing the densification rate. The effect of boron addition was also found to be positive as it improves the bonding between the two layers.

• Earthquakes and Structures
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• 제3권3_4호
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• pp.473-494
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• 2012

The capacity of pipelines to resist collapse under external pressure and bending moment is a major aspect of deepwater pipeline design. Existing design codes present interaction equations that quantify pipeline capacities under such loadings, although reasonably accurate, are based on empirical data fitting of the bending strain, and assumed simplistic interaction with external pressure collapse. The rational model for collapse of deepwater pipelines, which are relatively thick with a diameter-to-thickness ratio less than 40, provides a unique theoretical basis since it is derived from first principles such as force equilibrium and compatibility equations. This paper presents the rational model methodology and compares predicted results and recently published full scale experimental data on the subject. Predictive capabilities of the rational model are shown to be excellent. The methodology is extended for the problem of pipeline collapse under point load, longitudinal bending and external pressure. Due to its rational derivation and excellent prediction capabilities, it is recommended that design codes adopt the rational model methodology.

• Computers and Concrete
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• 제7권2호
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• pp.145-158
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• 2010

In this work the implementation of a production-level port of the Microplane constitutive model for concrete into the EPIC code is described. The port follows guidelines outlined in the Material Model Module (MMM) standard used in EPIC to insure a seamless interface with the existing code. Certain features of the model were not implemented using the MMM interface due to compatibility reasons; for example, a separate module was developed to initialize, store and update internal state variables. Objective strain and deformation measures for use in the material model were also implemented into the code. Example calculations were performed and illustrate the veracity of this new implementation.

• 한국주조공학회지
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• 제40권5호
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• pp.129-133
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• 2020

The outcomes of solution annealing and stress corrosion cracking in cold-worked 316L austenitic stainless steel have been studied using x-ray diffraction (XRD) and the slow strain rate test (SSRT) technique. The good compatibility with a high-temperature water environment allows 316L austenitic stainless steel to be widely adopted as an internal structural material in light water reactors. However, stress corrosion cracking (SCC) has recently been highlighted in the stainless steels used in commercial pressurized water reactor (PWR) plants. In this paper, SCC and inter granular cracking (IGC) are discussed on the basis of solution annealing in a chloride environment. It was found that the martensitic contents of cold-worked 316L stainless steel decreased as the solution annealing time was increased at a high temperature. Moreover, mode of SCC was closely related to use of a chloride environment. The results here provide evidence of the vital role of a chloride environment during the SCC of cold-worked 316L.

• Steel and Composite Structures
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• 제38권3호
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• pp.257-270
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• 2021

This paper presents a displacement-based numerical methodology following the Euler-Bernoulli theory to simulate the 2 nonlinear behavior of steel structures. It is worth emphasizing the adoption of co-rotational finite element formulations considering large displacements and rotations and an inelastic material behavior. The numerical procedures proposed considers plasticity concentrated at the finite elements nodes, and the simulation of the steel nonlinear behavior is approached via the Strain Compatibility Method (SCM), where the material constitutive relation is used explicitly. The SCM is also applied in determining the sections bearing capacity. Moreover, the present numerical approach is not limited to a specific structural member cross-sectional typology, with the residual stress models introduced explicitly in subareas of steel cross-sections generated by a 2D discretization. Finally, results consistent with the literature and with low processing time are presented.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.