• 한국정보디스플레이학회:학술대회논문집
• /
• 2009.10a
• /
• pp.466-469
• /
• 2009

The life time of AMOLED displays has been dependent on OLED materials up to this point. In particular, image sticking (burn-in) has been one of the most critical issues for AMOLEDs. This paper proposes image sticking compensation AMOLED pixel circuits to address the problem without requiring process or material improvements to the OLED itself. We verified the performance of those circuits by simulation and actual panel implementation.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
• /
• 2002.11a
• /
• pp.123-126
• /
• 2002

For the mold die sticking mechanism, the major explanation is that EMC filler of silica wears die surface roughened, which results in increase of adhesion strength. As big differences in experimental results from semiconductor manufacturers are dependent on EMC models, however, chemisorptions or acid-base interaction is apt to be also functioning as major mechanisms. In this investigation, the plasma source ion implantation (PSII) using $O_2$, $N_2$, and $CF_4$ modifies sample surface to form a new dense layer and improve surface hardness, and change metal surface condition from hydrophilic to hydrophobic and vice versa. Through surface energy quantification by measuring contact angle and surface ion coupling state analysis by Auger, major governing mechanism for sticking issue was figured out to be a complex of mechanical and chemical factors.

• Structural Engineering and Mechanics
• /
• v.58 no.4
• /
• pp.707-718
• /
• 2016

The main objective of the present paper is to investigate, by means of a boundary value problem permitting a semi-analytic solution, qualitative behaviour of solutions for two pressure-dependent yield criteria used for plastically incompressible polymers. The study mainly focuses on the regime of friction (sticking and sliding). It is shown that the existence of the solution satisfying the regime of sticking depends on other boundary conditions. In particular, there is such a class of boundary conditions depending on the yield criterion adopted that the regime of sliding is required for the existence of the solution independently of the friction law.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2001.11a
• /
• pp.300-303
• /
• 2001

BSCCO thin films are fabricated via a co-deposition process by an ion beam sputtering with an ultra-low growth rate, and sticking coefficients of the respective elements are evaluated. The sticking coefficient of Bi element exhibits a characteristic temperature dependence : almost a constant value of 0.49 below 730$^{\circ}C$ and decreases linearly with temperature over 730$^{\circ}C$. This temperature dependence can be elucidated from the evaporation and sublimation rates of bismuth oxide, Bi$_2$O$_3$, from the film surface. It is considered that the liquid phase of the bismuth oxide plays an important role in the Bi 2212 phase formation in the co-deposition process.

• Proceedings of the KIEE Conference
• /
• 2003.07c
• /
• pp.1680-1682
• /
• 2003

In this study, we examine the effects of auxiliary pulse on the image sticking in ac PDP. A relatively low voltage square pulse applied to the address electrode before and after erasing period is found to be quite effective in reducing the line image sticking in the boundary between off and on block of full white pattern.

• Journal of the Korean Vacuum Society
• /
• v.14 no.4
• /
• pp.171-179
• /
• 2005

The influence of the surface roughness and the porosity on the apparent sticking coefficient of the getter was determined quantitatively by Monte Carlo simulation. The sorption characteristics of the getter was investigated by solving numerically the particle balance equation depending on the sticking probability and diffusivity.

• Journal of the Korean Vacuum Society
• /
• v.5 no.3
• /
• pp.175-180
• /
• 1996

Double conductance method is proposed as an effectvie way to measure real outgassing rates of materials regardless of their adsorbing power. The real outgassing rate and the sticking coefficient of the CFC (carbon fiber composite) which is used widely as the material for armor plates infusion experiment devices were obtained by adopting this method. At $40^{\circ}C$ the real ougassing rate was $Pa, m^3/s.m^2$(in $N_2$ equivalent), which was higher than 5 times the measured one, and the sticking coefficient was about 0.018($H_2O\; and \;H_2$ were the main residual gases).

• Journal of the Semiconductor & Display Technology
• /
• v.12 no.4
• /
• pp.55-59
• /
• 2013

Mold die sticking arises from silica filler abrasion to the cavity surface. Ni-P electroplating was examined to substitute conventional hard Cr plating. More than 4% of Phosphorus in the electroplated film produces nano crystal structure and annealing makes $Ni_3P$ precipitated to get hardness values equivalent to hard Cr.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2007.08a
• /
• pp.867-870
• /
• 2007

In order to solve image sticking phenomena, the gas-phase and liquid-phase interfacial reactions of photosensitive polyimide can annihilate photoreactive carbon-carbon double bonds, which remain after photo-alignment process. The annihilation processes dramatically affect residual DC and photochemical reorientation of photoactive functional groups.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.6 no.2
• /
• pp.3-8
• /
• 2007

Nonlinear property and contact matter are analyzed about the pipe applied with internal pressure through this study. The weakest part and its safety can be examined. Maximum equivalent stress is shown at the contact surface between bolt and nut. The value of contact stress with the pressure of 12MPa is increased 1.4 times as large as that with no pressure. The maximum contact pressure is shown at the clamp corner of the external surface on pipe. The value of contact pressure with the pressure of 12MPa is increased 1.4 times as large as that with no pressure. The radial deformation with no pressure is also increased greatly at the middle part of internal surface on pipe. But this maximum deformation on pipe with the pressure of 12MPa is shown at the part far away the support of pipe. This value is increased 5.7 times as large as that value with no pressure. As contact status, the sticking occurs most at the external surface of pipe. It also tends to occur at the contact surface between bolt and nut. At the external surface of pipe, the sticking in case of the pressure of 12MPa occurs more than that in case of no pressure.