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Nano Crystalline Change by Heat Treatment  

Sun, Yong-Bin (Semiconductor-Display-Mechatronics Program, GS_CEI, Kyonggi University)
Publication Information
Journal of the Semiconductor & Display Technology / v.12, no.4, 2013 , pp. 55-59 More about this Journal
Abstract
Mold die sticking arises from silica filler abrasion to the cavity surface. Ni-P electroplating was examined to substitute conventional hard Cr plating. More than 4% of Phosphorus in the electroplated film produces nano crystal structure and annealing makes $Ni_3P$ precipitated to get hardness values equivalent to hard Cr.
Keywords
Nano crystal; Ni-P plating; Phosphorus acid; $Ni_3P$ precipitation; Sticking;
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