• 한국정밀공학회지
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• 제23권8호
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• pp.27-32
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• 2006

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 International Symposium
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• pp.165-172
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• 2003

Wafer-level packaging technology has become established with increase of demands for miniaturizing and realizing lightweight electronic devices evolution. This packaging technology enables the smallest footprint of packaged chip. Various structures and processes has been proposed and manufactured currently, and products taking advantages of wafer-level package come onto the market. The package enables mounting semiconductor chip on print circuit board as is a case with conventional die-level CSP's with BGA solder bumps. Bumping technology is also advancing in both lead-free solder alternative and wafer-level processing such as stencil printing using solder paste. It is known lead-free solder bump formation by stencil printing process tend to form voids in the re-flowed bump. From the result of FEM analysis, it has been found that the strain in solder joints with voids are not always larger than those of without voids. In this paper, characteristics of wafer-level package and effect of void in solder bump on its reliability will be discussed.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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• pp.456-462
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• 2002

In the present work, a low cost and fine pitch bumping process by electroless Ni/immersion Au UBM (under bump metallurgy) and stencil printing for the solder bump on the Al pad is discussed. The Chip used this experimental had an array of pad 14x14 and zincate catalyst treatment is applied as the pretreatment of Al bond pad, it was shown that the second zincating process produced a dense continuous zincating layer compared to first zincating. Ni UBM was analyzed using Scanning electron microscopy, Energy dispersive x-ray, Atomic force microscopy, and X-ray diffractometer. The electroless Ni-P had amorphous structures in as-plated condition. and crystallized at 321 C to Ni and Ni$_3$P. Solder bumps are formed on without bridge or missing bump by stencil print solder bump process.

• 한국인쇄학회지
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• 제10권1호
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• pp.81-90
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• 1992

The charater of standing box printing reguires a rich representation in a light and a shade of color and caues the modern photographs to be abundant of the ink and also shows the continuity of which any other printing is incapable because of its profound gradation. The clear printing in gravure can be said to be due to the good transfer of the ink - the completion of the transference of the ink into the stencil paper and the clear transference of the printing tone. The most inportant matter is the distance between the printing press and the doctor line. It is the matter of the structure and arrangement because of giving the most affect on the dryness of the ink in the cell. The glue of the ink in gravure changes by the kinds of the dye and the cellusolve used. To make the printing somoothly progressive from the high glue of the ink to the low glue of the ink will have to be used, which will be possible to choose the ester.ose the ester.

• 한국인쇄학회지
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• 제10권1호
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• pp.55-67
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• 1992

The character of standing box printing reguires a rich representation on a light and a shade of color and cause the modern photographs to be abundant of the ink and also show the continuity of which any other printing is incapable because of its profound gradation.The clear printing in gravure can be said to be due to the good transfer of the ink-the completion of the transference of the ink into the stencil paper and the clear transference of the printing tone.The most inportant matter is the distance between the printing press and the doctor line. It is the matter of the structure and arrangement because of giving the most affect on the dryness of the ink in the cell.The glue of the ink in gravure changes by the kinds of the dye and the cellusolve used.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2005년도 춘계학술발표대회 개요집
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• pp.40-42
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• 2005

• 한국염색가공학회지
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• 제31권4호
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• pp.233-240
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• 2019

Dyeing is an essential process for improving the value of textile products, but it is considered as one of industries causing pollution because of producing wastewater containing hazardous chemicals as well as using a large amount of water and energy. Global demand for greener technologies in textile field is getting much more attention and accordingly, the use of eco-friendly natural dyes is growing much larger. In textile printing, both dyes and pigments can be used. Pigment printing is more simple process and requires less water and less energy, compared to dye printing. In this study, the organic pigment was prepared from the marigold colorant. Samples were stencil printed, pressed(70℃, 3min) and then heat treated(150℃, 5min). The uptake of polyacrylic acid as a chemical binder was the lowest. In particular, marigold pigments were excellent in color and texture when Guar Gum and Sodium Alginate were used as binders. In addition, the light and washing fastness was rated very high as 4, 4/5 grades, and the rubbing fastness was also excellent as 3 and 4 grades.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2006년도 ISMP 2006
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• pp.179-212
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• 2006

1. $Welco^{(R)}$ Ultra fine solder powders are suitable for wafer bumping applications; mass production of ultra fine powders with high quality and high yield. - UFP based pastes for wafer bumping by stencil printing ($60-80{\mu}m$ pitch) are now available - Residue free solder flux was developed; meets voids specification of 20%. - F645 type 5 paste is suitable for components 01005

• 마이크로전자및패키징학회지
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• 제8권2호
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• pp.37-42
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• 2001

The BGA package has been the area array package of choice for several years. Recently, the transition has been to finer pitch configurations called Chip Scale Packages (CSP). Several of these package types are available at 0.5 mm pitch. requiring surface mount assemblers to evaluate and optimize various elements of the assembly process. This presentation describes the issues associated with making the transition from BGA to CSP assembly. Areas addressed will include the accuracy of pick and place equipment, printed wiring board lines and spaces, PWB vias, in-circuit test issues, solder paste printing, moisture related factors, rework and reliability. The transition to 0.5 mm pitch requires careful evaluation of the board design, solder paste selection, stencil design and component placement accuracy. At this pitch, ball and board pad diameters can be as small as 0.25 mm and 0.20 mm respectively. Drilled interstitial vias are no longer possible and higher ball count packages require micro-via board technology. The transition to CSP requires careful evaluation of these issues. Normal paste registration and BGA component tolerances can no longer achieve the required process levels and higher accuracy pick and place machines need to be implemented. This presentation will examine the optimization of these critical assembly operations, contrast the challenges at 0.5 mm and also look at the continuation of the process to incorporate smaller pitch flip chip devices.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.57-64
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology fur their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electrodes nickel, solder jetting, stud bumping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.