• Title/Summary/Keyword: stacking structure

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Molecular Design for the Formation of Two-dimensional Molecular Networks: STM Study of ${\gamma}$-phenylalanine on Au(111)

  • Jeon, A-Ram;Youn, Young-Sang;Lee, Hee-Seung;Kim, Se-Hun
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.08a
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    • pp.205-205
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    • 2011
  • The self-assembly of ${\gamma}$-phenylalanine on Au(111) at 150 K was investigated using scanning tunneling microscopy (STM). Phenylalanine can potentially form two-dimensional (2D) molecular networks through hydrogen bonding (through the carboxyl and amino groups) and ${\pi}-{\pi}$ stacking interactions (via aromatic rings). We found that ${\gamma}$-phenylalanine molecules self-assembled on Au(111) surfaces into well-ordered structures such as ring-shaped clusters (at low and intermediate coverages) and 2D molecular domains (intermediate and monolayer coverages), whereas ${\alpha}$-phenylalanine molecules formed less-ordered structure on Au(111). The self-assembly of ${\gamma}$- but not ${\alpha}$-phenylalanine may be related to the flexibility of the carboxyl and amino groups in the molecule. Moreover, as expected, the 2D molecular network of ${\gamma}$-phenylalanine on Au(111) was mediated by a combination of hydrogen bonding and ${\pi}-{\pi}$ stacking interactions.

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Growth and dielectric Properties or $BaTiO_3/SrTiO_3$ oxide artificial superlattice deposited by pulsed laser deposition (PLD) (Pulsed laser depostion (PLD)법으로 증착된 $BaTiO_3/SrTiO_3$ 산화물 초격자의 성장 및 유전특성)

  • 김주호;김이준;정동근;김용성;이재찬
    • Journal of the Korean Vacuum Society
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    • v.11 no.3
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    • pp.166-170
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    • 2002
  • Artificial $BaTiO_3$(BTO)/$SrTiO_3$(STO) oxide superlattice have been deposited on MgO (100) single crystal substrate by pulsed laser deposition(PLD) method. The stacking periodicity of BTO/STO superlattice structure was varied from $BTO_{1\;unit\; cell}/STO_{1\;unit\; cell}$ to $BTO_{125\;unit\; cell}/STO_{125 \;unit \;cell}$ thickness with the total thickness of 100 nm. The result of X-ray diffraction showed the characteristics of superlattice in the BTO/STO multilayer structure. we have also confirmed that there was no interdiffusion at the interface between BTO and STO layers by high resolution transmission electron microscopy(HRTEM). The dielectric constant of superlattice increased with decreasing stacking periodicity of the BTO/STO superlattice within the critical thickness. The dielectric constant of the BTO/STO superlattice reached a maximum i.e., 1230 at a stacking perioicity of $BTO_{2\;unit\; cell}/STO_{2\;unit\; cell}$ .

Parametric Study on Design of Composite-Foam Sandwich Structures for Micro EDM Machine tool structures (미세 방전가공 기계 구조를 위한 복합재료-포움 샌드위치 구조 설계에 관한 파라메트릭 연구)

  • Kim Dae-Il;Chang Seung-Hwan
    • Composites Research
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    • v.19 no.2
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    • pp.13-19
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    • 2006
  • In this paper, parametric study was carried out to design sandwich structures for EDM machines controlling stacking sequence, stacking thickness of composites and rib configuration. Sandwich structures which are dealt with in this paper are composed of fibre reinforced composite for skin material and foam or resin concrete for core materials. The sandwich column has cruciform rib to enhance bending stiffness of the structure and the bed has several vertical ribs to resist the normal forces and vibration. The design parameters such as rib thickness and stacking sequence were controlled to enhance the system robustness. Finite element analysis was also carried out to verify the variation of static and dynamic stiffness of the structures according to the variation of the parameters. Vibration tests were performed to verify the natural frequencies and damping ratios of the manufactured composite structures. The appropriate shape and configuration conditions for micro-EDM machine structures are proposed.

Ti/Cu CMP process for wafer level 3D integration (웨이퍼 레벨 3D Integration을 위한 Ti/Cu CMP 공정 연구)

  • Kim, Eunsol;Lee, Minjae;Kim, Sungdong;Kim, Sarah Eunkyung
    • Journal of the Microelectronics and Packaging Society
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    • v.19 no.3
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    • pp.37-41
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    • 2012
  • The wafer level stacking with Cu-to-Cu bonding becomes an important technology for high density DRAM stacking, high performance logic stacking, or heterogeneous chip stacking. Cu CMP becomes one of key processes to be developed for optimized Cu bonding process. For the ultra low-k dielectrics used in the advanced logic applications, Ti barrier has been preferred due to its good compatibility with porous ultra low-K dielectrics. But since Ti is electrochemically reactive to Cu CMP slurries, it leads to a new challenge to Cu CMP. In this study Ti barrier/Cu interconnection structure has been investigated for the wafer level 3D integration. Cu CMP wafers have been fabricated by a damascene process and two types of slurry were compared. The slurry selectivity to $SiO_2$ and Ti and removal rate were measured. The effect of metal line width and metal density were evaluated.

Structural Characteristics on InAs Quantum Dots multi-stacked on GaAs(100) Substrates

  • Roh, Cheong-Hyun;Park, Young-Ju;Kim, Eun-Kyu;Shim, Kwang-Bo
    • Journal of the Microelectronics and Packaging Society
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    • v.7 no.1
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    • pp.25-28
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    • 2000
  • The InAs self-assembled quantun dots (SAQDS) were grown on a GaAs(100) substrate using a molecular beam epitaxy (MBE) technique. The InAs QDs were multi-stacked to have various layer structures of 1, 3, 6, 10, 15 and 20 layers, where the thickness of the GaAs spacer and InAs QD layer were 20 monolayers (MLs) and 2 MLs, respectively. The nanostructured feature was characterized by photoluminescence (PL) and scanning transmission electron microscopy (STEM). It was found that the highest PL intensity was obtained from the specimen with 6 stacking layers and the energy of the PL peak was split with increasing the number of stacking layers. The STEM investigation exhibited that the quantum dots in the 6 stacking layer structure were well aligned in vertical columns without any deflect generation, whereas the volcano-like deflects were formed vertically along the growth direction over 10 periods of InAs stacking layers.

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Convergence Study on Composite Material of Unidirectional CFRP and SM 45C Sandwich Type that Differs in Stacking Angle (적층각도가 다른 단방향 CFRP와 SM45C샌드위치형 복합재료에 관한 융합적 연구)

  • Park, Jae-Woong;Cho, Jae-Ung
    • Journal of the Korea Convergence Society
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    • v.8 no.7
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    • pp.231-236
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    • 2017
  • In this study, the inhomogeneous material composed of CFRP(carbon fiber reinforced plastic) and structural metal of SM45C is used for the light material. The finite element analysis on the basis of compact tension test was carried out by using the composite material for sandwich type bonded with the unidirectional CFRP that differs in fiber stacking angle at both sides with the core of SM 45C. CT test is the representative method to confirm the fracture behaviour due to crack in material under the load. The effect on crack and hole must be investigated in order to apply inhomogeneous material to mechanical structure. As the result of this study, the fracture behaviour by CT test of the composite material for sandwich was studied by simulation analysis. The sandwich composite of unidirectional CFRP with the stacking angle of [0/60/-60/0] has the superior strength and the maximum equivalent stress of about 182GPa.Also, the esthetic sense can be shown as the designed factor of shape with composite material is grafted onto the convergence technique.

Ballistic Analysis and Stacking Sequence of Laminate Plate for Enhancing Bulletproof Performance (방탄 성능 향상을 위한 적층 평판의 피탄 해석 및 적층 배열 연구)

  • Ki Hyun Kim;Min Kyu Kim;Min Je Kim;Myung Shin
    • Journal of the Computational Structural Engineering Institute of Korea
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    • v.36 no.5
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    • pp.331-338
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    • 2023
  • Modern bulletproof armor must be light and have excellent penetration resistance to ensure the mobility and safety of soldiers and military vehicles. The ballistic performance of heterogeneous structures of laminated flat plates as bulletproof armor depends on the arrangement of constituent materials for the same weight. In this study, we analyze bulletproof performance according to the stacking sequence of laminated bulletproof armor composed of Kevlar, ultra-high molecular weight polyethylene, and ethylene-vinyl-acetate foam. A ballistic analysis was performed by colliding a 7.62 × 51 mm NATO cartridge's M80 bullet at a speed of 856 m/s with six lamination arrangements with constituent materials thicknesses of 5 mm and 6.5 mm. To evaluate the bulletproof performance, the residual speed and residual energy of the projectile that penetrated the heterogeneous laminated flat plates were measured. Simulation results confirmed that the laminated structure with a stacking sequence of Kevlar, ultra-high molecular weight polyethylene, and ethylene-vinyl-acetate foam had the best bulletproof performance for the same weight.

Fracture Behavior of a Stacked Concrete Structure Based on the Fracture Mechanics (적층한 콘크리트 복합구조체의 파괴역학적 거동)

  • Kim, Sang-Chul;Kim, Yeon-Tae
    • Magazine of the Korea Concrete Institute
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    • v.11 no.1
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    • pp.119-127
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    • 1999
  • The objective of this study is to simulate the fracture behavior of composite structure bonded with more than 2 different cementitious materials. For this, concrete and cement were stacked and bonded in a direction perpendicular to loading and specimens were tested. Each constituent material of concrete and cement was fabricated independently also, and three point bending and indirect tensile tests were carried out for the acquisition of measured values applicable to the proposed model. As a result of comparing theoretical results and experimental ones, it was found that the proposed model derived from fictitious crack theory can be used to predict the fracture behavior of composite structures on the vases of well agreement with experimental results. It was also noted that the degree of improvement of fracture energies and strengths is greatly dependent on the stacking sequence of layers composing of a composite structure. Thus, it can be concluded that brittleness or ductility of a composite structure can be accomplished by a proper arrangement of layers on one's purpose throughout the proposed analysis.