• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 2003.10a
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• pp.96-98
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• 2003

Many of research efforts have been focused on the improvement of critical current density Jc of silver-sheathed Bi-2223 tapes for practical applications of material. Bi-2223 superconducting wires with 55 filaments were fabricated by stacking, drawing process with different heat-treatment histories. After rolling process, Bi-2223 tapes were heat-treatment at 780~826$^{\circ}C$ with variable mass flow rate of mixed gas. In this study, the effect of changes in the variable mass flow rate of mixed gas during the heat treatment of Bi-2223/Ag tapes has been investigated. Distinct differences were observed in the Bi-2223 phase and critical current as flow rate of mixed gas. We could achieve proper conditions of mass flow rate of mixed gas for Ag-alloy clad Bi-2223 superconducting tapes.

• Journal of Welding and Joining
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• v.34 no.4
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• pp.9-16
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• 2016

Metal parts are produced by conventional methods such as casting, forging and cutting, extrusion, etc. However, nowadays, with additive manufacturing (AM), it is possible to directly commercialize by means of stacking of equipment to the 3D drawing and use of high precision tools such as laser source. Thus, drawing of materials is an important aspect in delivering good products. AM deals with production of lighter aircraft parts and few more three-dimensional molds, it wish to manufacture special medical parts and want to steadily expand the new market area. The cost of related equipment and materials are still expensive and difficult to obtain on a mass production. However, the ability to make changes and lead the innovation in the paradigm of traditional manufacturing process is still effective. In this paper, we introduce metal AM and the principles of the related devices, metal powder production process, and their application.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.17 no.5
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• pp.143-148
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• 2018

3D printing has been expanding beyond the bio/nano field to the automobile and aviation industries. 3D-printing technology has to overcome real problems to have economic value compared to its unlimited usability. Typically, the difference in mechanical strength along the lamination direction requires sufficient research to ensure reliability. In this paper, we study the anisotropic properties of ABS based on the stacking method of FDM 3D printing. Specifically, the mechanical properties of ABS material are determined through a tensile test and 3-point bending test, and the in-plane orthotropic properties are ascertained.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.20 no.6
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• pp.51-58
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• 2021

The notion of leisure has changed with industrial development and improvement in life quality. Bicycling is a healthy sport; it is an exercise performed while enjoying nature. There have been many changes in the materials that are used to manufacture the bicycle frame. Iron and aluminum have been mainly used in bicycle frames. However, carbon-based materials are lighter and stronger than metal frames. The bicycles made of carbon composite changes frame rigidity depending on the direction of the carbon sheet sacking angle. We study the direction of composite material and how they affect the stiffness of frames based on the stacking angle.

• Journal of the Korean Society for Precision Engineering
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• v.12 no.8
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• pp.27-38
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• 1995

For solving troubles happened during the drilling process with carbon fiber epoxy composite materials(CFRP) by using HSS drill, a few types of diamond gift electroplated drills are manufactured, and machinability of these drills is experimented with a variety of cutting speed and feed rate. These drills have some advantages of good wear resistant and the conception of grinding process. As a result, using of these drills improves both troubles being caused by tool wear and damage of exit surface depending on fiber stacking angle. It is desirable that cutting conditions for the cutting thickness per revolution must be set under 0.01mm when the size of a diamond grit is # 60 .approx. 80.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.17-24
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• 2020

As an interconnect scaling faces a technical bottleneck, the device stacking technologies have been developed for miniaturization, low cost and high performance. To manufacture a stacked device structure, a vertical interconnect becomes a key process to enable signal and power integrities. Most bonding materials used in stacked structures are currently solder or Cu pillar with Sn cap, but copper is emerging as the most important bonding material due to fine-pitch patternability and high electrical performance. Copper bonding has advantages such as CMOS compatible process, high electrical and thermal conductivities, and excellent mechanical integrity, but it has major disadvantages of high bonding temperature, quick oxidation, and planarization requirement. There are many copper bonding processes such as dielectric bonding, copper direct bonding, copper-oxide hybrid bonding, copper-polymer hybrid bonding, etc.. As copper bonding evolves, copper-oxide hybrid bonding is considered as the most promising bonding process for vertically stacked device structure. This paper reviews current research trends of copper bonding focusing on the key process of Cu-SiO₂ hybrid bonding.

• Transactions of Materials Processing
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• v.27 no.5
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• pp.267-275
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• 2018

The clad sheet material is produced by a roll-bonding process of one or more materials with different properties. Good formability of clad sheet material is an essential property in to deform a clad metal sheet into a part or component. Performance of the clad sheet material largely depends on interfacial bond strength between different materials. In this study, interfacial bond strength of STS/Al clad sheet was analyzed by varying experimental parameters using a blanking process. Experimental parameters are the punching speed, clearance, and stacking order of plate materials. In addition, blanking test results were compared with bond strengths measured by the T-peel test, that analyzes interface bonding strength of the standard clad sheet. The blanking process was analyzed by the finite element method under the sticking condition of interface of different materials, and experimental results and analysis results were compared.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05a
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• pp.69-72
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• 2003

Bi-2223 superconducting wires were fabricated by stacking, drawing process with different precursor powders and different heat-treatment histories. The precursor powders were 2 kinds of Pb content. And a part of the tapes were experienced pre-annealing process which caused tetragonal structure of Bi-2212 phase to orthorhombic structure of it was during drawing process. We confirmed the transformation of Bi-2212 phase from tetragonal structure to orthorhombic structure and reduction of second phases. XRD and DC magnetization analysis were performed in order to investigate the fraction of Bi-2223 phase in Bi-2223/Ag HTS tape. We could achieve best Ic of 70 A class at the Bi-2223/Ag tape using low Pb content of precursor powder and experienced pre-annealing process. DC magnetization analysis was useful to investigate the fraction of Bi-2223 phase in the Bi-2223/Ag tape.

• Design & Manufacturing
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• v.18 no.2
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• pp.35-40
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• 2024

Injection molding is a process widely used across various industries for molding plastics, and it is the most commonly applied process in root industries utilizing molds. Among the different types of injection molding, insert injection molding, where busbars are used as inserts, is increasingly being applied in the electric vehicle industry. However, currently, the insert injection molding process is manually performed, with workers placing insert components by hand before injection molding. This results in issues related to productivity, safety, and quality. Additionally, there is a growing demand for automation of such production lines due to hazardous working conditions, economic difficulties in the manufacturing industry, and the decline in the labor force caused by an aging population. This study focuses on the application of an automated system for the insert injection molding process used in electric vehicles. The development of an automated system for the transport and insertion of insert components, as well as the inspection and stacking processes after injection, has resulted in over a 25% improvement in productivity and more than a 27% reduction in defect rates.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.102-102
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• 2018

Electronic industry had required the finer size and the higher performance of the device. Therefore, 3-D die stacking technology such as TSV (through silicon via) and micro-bump had been used. Moreover, by the development of the 3-D die stacking technology, 3-D structure such as chip to chip (c2c) and chip to wafer (c2w) had become practicable. These technologies led to the appearance of HBM (high bandwidth memory). HBM was type of the memory, which is composed of several stacked layers of the memory chips. Each memory chips were connected by TSV and micro-bump. Thus, HBM had lower RC delay and higher performance of data processing than the conventional memory. Moreover, due to the development of the IT industry such as, AI (artificial intelligence), IOT (internet of things), and VR (virtual reality), the lower pitch size and the higher density were required to micro-electronics. Particularly, to obtain the fine pitch, some of the method such as copper pillar, nickel diffusion barrier, and tin-silver or tin-silver-copper based bump had been utillized. TCB (thermal compression bonding) and reflow process (thermal aging) were conventional method to bond between tin-silver or tin-silver-copper caps in the temperature range of 200 to 300 degrees. However, because of tin overflow which caused by higher operating temperature than melting point of Tin ($232^{\circ}C$), there would be the danger of bump bridge failure in fine-pitch bonding. Furthermore, regulating the phase of IMC (intermetallic compound) which was located between nickel diffusion barrier and bump, had a lot of problems. For example, an excess of kirkendall void which provides site of brittle fracture occurs at IMC layer after reflow process. The essential solution to reduce the difficulty of bump bonding process is copper to copper direct bonding below $300^{\circ}C$. In this study, in order to improve the problem of bump bonding process, copper to copper direct bonding was performed below $300^{\circ}C$. The driving force of bonding was the self-annealing properties of electrodeposited Cu with high defect density. The self-annealing property originated in high defect density and non-equilibrium grain boundaries at the triple junction. The electrodeposited Cu at high current density and low bath temperature was fabricated by electroplating on copper deposited silicon wafer. The copper-copper bonding experiments was conducted using thermal pressing machine. The condition of investigation such as thermal parameter and pressure parameter were varied to acquire proper bonded specimens. The bonded interface was characterized by SEM (scanning electron microscope) and OM (optical microscope). The density of grain boundary and defects were examined by TEM (transmission electron microscopy).