• Carbon letters
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• v.15 no.2
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• pp.125-128
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• 2014

In this study, the effect of stacking sequence on the flexural and fracture properties of carbon/basalt/epoxy hybrid composites was investigated. Two types of carbon/basalt/epoxy hybrid composites with a sandwich form were fabricated: basalt skin-carbon core (BSCC) composites and carbon skin-basalt core (CSBC) composites. Fracture tests were conducted and the fracture surfaces of the carbon/basalt/epoxy hybrid composites were then examined using scanning electron microscopy (SEM). The results showed that the flexural strength and flexural modulus of the CSBC specimen respectively were ~32% and ~245% greater than those of the BSCC specimen. However, the interlaminar fracture toughness of the CSBC specimen was ~10% smaller than that of the BSCC specimen. SEM results on the fracture surface showed that matrix cracking is a dominant fracture mechanism for the CSBC specimen while interfacial debonding between fibers and epoxy resin is a dominant fracture process for the BSCC specimen.

• Journal of the Korean Ceramic Society
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• v.50 no.6
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• pp.378-383
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• 2013

Continuous fiber-reinforced ceramic matrix composites (CFCCs) have a complex distribution of porosity, consisting of interfiber micro pores and interbundle/interply macro pores. Owing to the complex geometry of the pores and fiber architecture, it is difficult to obtain representative microstructural features throughout the specimen volume with conventional, destructive ceramographic approaches. In this study, we introduce X-ray computed microtomography (X-ray ${\mu}CT$) to nondestructively analyze the microstructures of disk shaped and tubular $SiC_f$/SiC composites fabricated by the chemical vapor infiltration (CVI) method. The disk specimen made by stacking plain-woven SiC fabrics exhibited periodic, large fluctuation of porosity in the stacking direction but much less variation of porosity perpendicular to the fabric planes. The X-ray ${\mu}CT$ evaluation of the microstructure was also effectively utilized to improve the fabrication process of the triple-layered tubular SiC composite.

• Journal of Communications and Networks
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• v.13 no.1
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• pp.70-76
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• 2011

This paper presents the unified user equipment (UE) baseband modulation and demodulation (modem) hardware platform architecture to support multiple radio access technologies. In particular, this platform selectively supports two systems; one is HEDGE system, which is the combination of third generation partnership project (3GPP) Release 7 high speed packet access evolution (HSPA+) and global system for mobile communication (GSM)/general packet radio service (GPRS)/enhanced data rates for GSM evolution (EDGE), while the other is LEDGE system, which is the combination of 3GPP Release 8 long term evolution (LTE) and GSM/GPRS/EDGE. This is done by applying the flexible pin multiplexing scheme to a hardwired pin mapping process. On the other hand, to provide stable connection, high portability, and high debugging ability, the stacking structure is employed. Here, a layered board architecture grouped by functional classifications is applied instead of the conventional one flatten board. Based on this proposed configuration, we provide a framework for the verification step in wireless cellular communications. Also, modem function/scenario test and inter-operability test with various base station equipments are verified by system requirements and scenarios.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.3 no.2
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• pp.126-130
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• 2002

This paper presents the basic concept of new solid freeform fabrication system using rapid prototyping method. The system could fabricate an arbitrary ceramic form by laser cutting, transferring, stacking, and sintering of each slide. The system consists mainly of laser apparatus. X-Y table, a slide transferring system, and electric oven. The system could fabricate an object that has smooth surface with comparatively short period of time. The system is effective in terms of its direct fabrication capability without second mechanical process. The fabricated shape could directly be used as part of a whole assembly and therefore its method could be applied to various application areas.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.1-12
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• 2021

3D printing, which designs product in three dimensions, draws attention as a technology that will lead the future for it dramatically shortens time for production without assembly, no matter how complex the structure is. The paper studies the latest researches of 3D-printed electronics and introduces papers studied electronics components, power supply, circuit interconnection and 3D-printed PCBs' applications. 3D-printed electronics showed possibility to simplify facilities and personalize electric devices by providing one-stop printing process of electronic components, soldering, stacking, and even encapsulation.

• Current Photovoltaic Research
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• v.9 no.4
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• pp.137-144
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• 2021

In this study, the microstructure of the CVD-fabricated Cu(In,Ga)Se₂ (CIGSe) absorber layer by simulating the stacking sequence used in a co-evaporation method, and changes solar cell performance were investigated. The absorber layer prepared by stacking CuSe and (In,Ga)Se between InSe is separated into Ga-free CuInSe₂ and Ga-rich CIGSe, and transformed to CIGSe by selenization heat treatment with slight improvement in the the solar cell efficiency. However, in CVD, since the supply of liquid Cu-Se is not as active as in the co-evaporation method, the nanoocrystalline layer containing a large amount of Ga remained independently in the absorption layer, which acted as a cause of the loss of J_SC and FF. Therefore, by using a precursor structure in which CuGa is sputter-deposited on a single layer of InSe deposited by CVD, performance parameters of V_OC, J_SC, and FF could be greatly improved.

• Korean Journal of Crystallography
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• v.3 no.1
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• pp.53-66
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• 1992

Extensive research has been perform성 on the property-microstructure-process condition relations of thin films. The various proposed models are mainly based on physical vapor deposition processes. Especially the study on the surface condition of substrates in Zone 1 with low surface mobility has not been sufficient. In this study, therefore, we discussed the mochological changes of TiN films deposited by plusma enhanced chemical vapor deposition process with substrates of different composition and micro-rorghness, and compared it with the Structure Zone Model. We could find out that the growth rate of films increased and micro-grain size decreased with the increase in micro-roughness, but it does not improve the mechanical properties because of many imperfections like voids, micro-cracks, stacking faults, etc. This means that, in these deposition conditions, the increase in shadowing diffect is more effective than the increase in nucleation sites on the growth of films due to the increase in substrate roughness.

• Journal of architectural history
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• v.32 no.3
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• pp.21-30
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• 2023

The Wolseong Wooden moat is a unique example. Which is a vertical wall made of wood. It shows a changing point how to make the wall by digging a hole and stacking stones vertically. This study tried to to make a assumption about the construction process of the wooden structure found in the Wolseong pit moat. I sorted out wooden elements and then analyzing these features and compared with the results of the excavation. After I made 3D modelling in the order to it was made. This moat is not only a function of digging up the ground to trap water, but also a technique of building structures to maintain walls. It is a valuable material that can show the woodworking engineering techniques of the Silla Dynasty.

• Korean Journal of Soil Science and Fertilizer
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• v.33 no.5
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• pp.361-368
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• 2000

This study was carried out to investigate the influence of artificial zeolite on the change of temperature, gas emission, water content and chemical properties during the composting process with the mixture of animal feces, broken bark and extruded rice hull. Artificial zeolite was added 0, 0.5, 1, 3 and 5% volume of the raw composting material, and proceeded 1.2m every day with mobile stacking escalator. Temperature was increased, and water content was decreased in the composting pile by addition of artificial zeolite. This caused to accelerate decomposition of organic matter during composting. $NH_3$ was emitted the highest at 6th day after stacking, then decreased gradually. And addition of artificial zeolite caused to decrease greatly in $NH_3$ emission from composting pile. As result of this, content of nitrogen in the compost was increased by addition of artificial zeolite. Emission of $CH_4$ was the highest at early stacking stage, and that was decreased drastically at 8th day. Emission of $CH_4$ was also decreased greatly by addition of artificial zeolite at 5th days after stacking. It may be resulted from adsorption of $CH_4$ into the molecular sieve structure of artificial zeolite and low water content by high temperature fermentation.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.71-74
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• 2013

In this study, the effects of wafer warpage on the misalignment during wafer stacking process were investigated. The wafer with $45{\mu}m$ bow height warpage was purposely fabricated by depositing Cu thin film on a silicon wafer and the bonding misalignment after bonding was observed to range from $6{\mu}m$ to $15{\mu}m$. This misalignment could be explained by a combination of $5{\mu}m$ radial expansion and $10{\mu}m$ linear slip. The wafer warpage seemed to be responsible for the slip-induced misalignment instead of radial expansion misalignment.