• 제목/요약/키워드: stacking process

검색결과 256건 처리시간 0.026초

Research on Reconstruction Technology of Biofilm Surface Based on Image Stacking

  • Zhao, Yuyang;Tao, Xueheng;Lee, Eung-Joo
    • 한국멀티미디어학회논문지
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    • 제24권11호
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    • pp.1472-1480
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    • 2021
  • Image stacking technique is one of the key techniques for complex surface reconstruction. The process includes sample collection, image processing, algorithm editing, surface reconstruction, and finally reaching reliable conclusions. Since this experiment is based on laser scanning confocal microscope to collect the original contour information of the sample, it is necessary to briefly introduce the relevant principle and operation method of laser scanning confocal microscope. After that, the original image is collected and processed, and the data is expanded by interpolation method. Meanwhile, several methods of surface reconstruction are listed. After comparing the advantages and disadvantages of each method, one-dimensional interpolation and volume rendering are finally used to reconstruct the 3D model. The experimental results show that the final 3d surface modeling is more consistent with the appearance information of the original samples. At the same time, the algorithm is simple and easy to understand, strong operability, and can meet the requirements of surface reconstruction of different types of samples.

Optimal stacking sequence design of laminate composite structures using tabu embedded simulated annealing

  • Rama Mohan Rao, A.;Arvind, N.
    • Structural Engineering and Mechanics
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    • 제25권2호
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    • pp.239-268
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    • 2007
  • This paper deals with optimal stacking sequence design of laminate composite structures. The stacking sequence optimisation of laminate composites is formulated as a combinatorial problem and is solved using Simulated Annealing (SA), an algorithm devised based on inspiration of physical process of annealing of solids. The combinatorial constraints are handled using a correction strategy. The SA algorithm is strengthened by embedding Tabu search in order to prevent recycling of recently visited solutions and the resulting algorithm is referred to as tabu embedded simulated Annealing (TSA) algorithm. Computational performance of the proposed TSA algorithm is enhanced through cache-fetch implementation. Numerical experiments have been conducted by considering rectangular composite panels and composite cylindrical shell with different ply numbers and orientations. Numerical studies indicate that the TSA algorithm is quite effective in providing practical designs for lay-up sequence optimisation of laminate composites. The effect of various neighbourhood search algorithms on the convergence characteristics of TSA algorithm is investigated. The sensitiveness of the proposed optimisation algorithm for various parameter settings in simulated annealing is explored through parametric studies. Later, the TSA algorithm is employed for multi-criteria optimisation of hybrid composite cylinders for simultaneously optimising cost as well as weight with constraint on buckling load. The two objectives are initially considered individually and later collectively to solve as a multi-criteria optimisation problem. Finally, the computational efficiency of the TSA based stacking sequence optimisation algorithm has been compared with the genetic algorithm and found to be superior in performance.

탄소섬유/에폭시 복합재료-알루미늄 양면겹치기 동시경화 조인트의 최적설계 (Optimal design of the co-cured aluminum/composite double lap joint)

  • 박상욱;김학성;이대길
    • 한국복합재료학회:학술대회논문집
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    • 한국복합재료학회 2004년도 추계학술발표대회 논문집
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    • pp.78-82
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    • 2004
  • The co-cured joint has been widely used in joining process of composite structures due to its simple and easy manufacturing process. In this paper, the effect of stacking sequence of the carbon epoxy prepreg, bonding length and thickness of the aluminum plate on the static tensile load capability of the co-cured aluminum-composite double lap joint were experimentally investigated. From experimental results, the optimum EA ratios with respect to stacking sequence and bonding length of the co-cured joint were obtained, which may be useful for the joining of hybrid structures.

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동하중을 받는 복합재의 파동전파에 관한 연구 (Wave Propagation of Composite Materials Subjected to Dynamic Load)

  • 안국찬;정인조;정대식
    • 한국기계가공학회지
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    • 제11권4호
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    • pp.138-146
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    • 2012
  • This research is to analyze the wave propagation characteristics of anisotropic materials subjected to the low-velocity impact. For this purpose, a higher-order finite element program is used to simulate the dynamic behaviors according to the changes of material property, stacking sequence and dimension etc.. Materials for simulation are composed of $[0^{\circ}]_{10s}$, $[45^{\circ}/-45^{\circ}]_{5s}$ and $[90^{\circ}]_{10s}$ stacking sequences. Finally, the results of this simulation are compared with those of wave propagation theory and then the impact responses and wave propagation phenomena are investigated.

3차원 실장을 위한 Non-PR 직접범핑법 (Non-PR direct bumping for 3D wafer stacking)

  • 전지헌;홍성준;이기주;이희열;정재필
    • 대한용접접합학회:학술대회논문집
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    • 대한용접접합학회 2007년 추계학술발표대회 개요집
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    • pp.229-231
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    • 2007
  • Recently, 3D-electronic packaging by TSV is in interest. TSV(Through Silicon Via) is a interconnection hole on Si-wafer filled with conducting metal such as Copper. In this research, chips with TSV are connected by electroplated Sn bump without PR. Then chips with TSV are put together and stacked by the methode of Reflow soldering. The stacking was successfully done and had no noticeable defects. By eliminating PR process, entire process can be reduced and makes it easier to apply on commercial production.

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정전척 표면의 세라믹물질 적층 순서에 따른 온도 특성에 관한 연구 (A Study on Temperature Characteristics according to Ceramic Material Stacking Sequence of Electrostatic Chuck Surface)

  • 장경민;김광선
    • 반도체디스플레이기술학회지
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    • 제16권3호
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    • pp.116-120
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    • 2017
  • Temperature uniformity of a wafer in a semiconductor process is a very important factor that determines the overall yield. Therefore, it is very important to confirm the temperature characteristics of the chuck surface on which the wafer is lifted. The temperature characteristics of the chuck depend on the external heat source, the shape of the cooling channel inside the chuck, the material on the chuck surface, and so on. In this study, CFD confirms the change of temperature characteristics according to the stacking order of ceramic materials on the chuck surface, and suggests the best lamination method.

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비정질 실리콘 박막에서 결정상 실리콘의 입자성장에 관한 고분해능 투과전자현미경에 의한 연구 (A High-Resolution Transmission Electron Microscopy Study of the Grain Growth of the Crystalline Silicon in Amorphous Silicon Thin Films)

  • 김진혁;이정용;남기수
    • 전자공학회논문지A
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    • 제31A권7호
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    • pp.85-94
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    • 1994
  • A high-resolution transmission electron microscopy study of the solid phase crystallization of the amorphous silicon thin films, deposited on SiOS12T at 52$0^{\circ}C$ by low pressure chemical vapor deposition and annealed at 55$0^{\circ}C$ in a dry N$_{2}$ ambient was carried out so that the arrangement of atoms in the crystalline silicon and at the amorphous/crystalline interface of the growing grains could be understood on an atomic level. Results show that circular crystalline silicon nuclei have formed and then the grains grow to an elliptical or dendritic shape. In the interior of all the grains many twins whose{111} coherent boundaries are parallel to the long axes of the grains are observed. From this result, it is concluded that the twins enhance the preferential grain growth in the <112> direction along {111} twin planes. In addition to the twins. many defect such as intrinsic stacking faults, extrinsic stacking faults, and Shockley partial dislocations, which can be formed by the errors in the stacking sequence or by the dissociation of the perfect dislocation are found in the silicon grain. But neither frank partial dislocations which can be formed by the condensation of excess silicon atoms or vacancies and can form stacking fault nor perfect dislocations which can be formed by the plastic deformation are observed. So it is concluded that most defects in the silicon grain are formed by the errors in the stacking sequence during the crystallization process of the amorphous silicon thin films.

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Ant colony optimization for dynamic stability of laminated composite plates

  • Shafei, Erfan;Shirzad, Akbar
    • Steel and Composite Structures
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    • 제25권1호
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    • pp.105-116
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    • 2017
  • This paper presents the dynamic stability study of laminated composite plates with different force combinations and aspect ratios. Optimum non-diverging stacking is obtained for certain loading combination and aspect ratio. In addition, the stability force is maximized for a definite operating frequency. A dynamic version of the principle of virtual work for laminated composites is used to obtain force-frequency relation. Since dynamic stiffness governs the divergence or flutter, an efficient optimization method is necessary for the response functional and the relevant constraints. In this way, a model based on the ant colony optimization (ACO) algorithm is proposed to search for the proper stacking. The ACO algorithm is used since it treats with large number of dynamic stability parameters. Governing equations are formulated using classic laminate theory (CLT) and von-Karman plate technique. Load-frequency relations are explicitly obtained for fundamental and secondary flutter modes of simply supported composite plate with arbitrary aspect ratio, stacking and boundary load, which are used in optimization process. Obtained results are compared with the finite element method results for validity and accuracy convince. Results revealed that the optimum stacking with stable dynamic response and maximum critical load is in angle-ply mode with almost near-unidirectional fiber orientations for fundamental flutter mode. In addition, short plates behave better than long plates in combined axial-shear load case regarding stable oscillation. The interaction of uniaxial and shear forces intensifies the instability in long plates than short ones which needs low-angle layup orientations to provide required dynamic stiffness. However, a combination of angle-ply and cross-ply stacking with a near-square aspect ratio is appropriate for the composite plate regarding secondary flutter mode.

완전자동화된 단속적 재료 공급식 가변적층 쾌속조형공정 밀 장치 개발에 관한 연구 (Investigation Into the Development Of Automatic VLM-ST (VLM-STA) Process and Its Apparatus)

  • 양동열;안동규;이상호;김효찬;박승교
    • 한국정밀공학회지
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    • 제21권4호
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    • pp.109-119
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    • 2004
  • Rapid prototyping (RP) technologies have been widely used to reduce the lead-time and development cost of new products. $VLM-_{ST}$ process has been developed to overcome the currently developed RP technologies such as a large building time, a high building cost, an additional post-processing and a large apparatus cost. $VLM-_{ST}$ process requires an additional human interaction due to the manual stacking and bonding. Hence, building time, building cost and the part quality are dependent on the skill of labor. A novel RP process, fully automated $VLM-_{ST}$ process ($VLM-_{ST}$), has been developed to improve building efficiency of the process and the human dependency of the part. The objective of this work is to propose a $VLM-_{ST}$ process and to develop an apparatus for implementation of the process. $VLM-_{ST}$ process and its apparatus have various technical novelties such as two step cutting using a rotating table, an automatic stacking method using two pilot holes and two reference shapes, a concept of automatic unit shape layer (AUSL), and an automatic bonding using the bonding roller and building magazine. In order to examine the efficiency and the applicability of the proposed process, various three-dimensional shapes, such as a piston, a human head shape and a human bust shape, were fabricated on the apparatus.

강철재료와 탄소섬유/에폭시 복합재료를 이용한 동시경화 조인트의 인장하중 전달용량에 미치는 설계변수에 관한 연구 (Design parameters on the tensile load bearing capacity of a co-cured lap joint with steel and carbon fiber/epoxy composite adherends)

  • 신금철;이정주
    • 한국복합재료학회:학술대회논문집
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    • 한국복합재료학회 2001년도 춘계학술발표대회 논문집
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    • pp.172-175
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    • 2001
  • The co-cured Joining method, which is regarded as an adhesively bonded Joining method, is an efficient joining technique because both curing and bonding processes for the composite structures can be achieved simultaneously. It requires neither surface treatment onto the composite adherend nor an additional adhesive joining process because the excess resin, which is extracted from composite materials during consolidation, accomplishes the co-cured Joining process. Since the adhesive of the co-cured joint is the same material as the resin of the composite adherend, the analysis and design of the co-cured joint for composite structures are simpler than those of an adhesively bonded joint, which uses an additional adhesive. In this paper, effects of the manufacturing parameters, namely surface roughness, stacking sequence of the composite adherend, and manufacturing pressure in the autoclave during curing process, on the tensile load bearing capacity of the co-cured single lap joint will be experimentally investigated.

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