• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2001.11b
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• pp.866-870
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• 2001

Measurement techniques for in-duct acoustic source parameters can be classified into the direct method and the load method, according to whether it utilizes an extra external source or not. It is reported that the load methods yield the negative source resistance and the purpose of this paper is to clarify that the time-varying nature of the source is the main cause of this physically implausible result. For this purpose, the direct and load methods for measuring the source characteristics of a simplified fluid machine are simulated using the time domain numerical analysis. In the numerical simulations, the method of characteristics is employed and the source characteristics are calculated from the resultant data. It is shown that the load method results in negative source resistance for some frequencies, whereas the direct method yields positive values for all frequencies considered. It is found that the result of load method is quite sensitive to the change of cylinder pressure or valve profile in contrast to the direct method.

• Journal of the Korean Solar Energy Society
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• v.29 no.5
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• pp.20-27
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• 2009

The effect of borehole thermal resistance on the borehole length is studied. In performing this work a new concept BLRR(borehole length reduction rate) is developed based on the line source model. The solution of line source model is shown to be valid through the comparison with the data of thermal response test. It is shown that BLRR is a function of soil thermal conductivity(k) and borehole thermal resistance($R_b$). The value of BLRR increases with increasing k, which means reducing $R_b$ is more effective when k is high. The reduction of borehole length with change of $R_b$ is easily estimated with BLRR. The validity of BLRR is also examined with EED analysis.

• Electrical & Electronic Materials
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• v.8 no.5
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• pp.626-632
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• 1995

In this paper, The effect of the impedances in SNOSFET's memory devices has been developed. The effect of source and drain impedances measured by means of two bias resistances - field effect bias resistance by inner region, external bias resistance. The effect of the impedances by source and drain resistance shows the dependence of the function of voltages applied to the gate. It shows the differences of change in source drain voltage by means of low conductance state and high conductance state. It shows the delay of threshold voltages. The delay time of low conductance state and high conductance state by the impedances effect shows 3[.mu.sec] and 1[.mu.sec] respectively.

• JSTS:Journal of Semiconductor Technology and Science
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• v.12 no.1
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• pp.46-52
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• 2012

Separate extraction of source ($R_S$) and drain ($R_D$) resistances caused by process, layout variations and long term degradation is very important in modeling and characterization of MOSFETs. In this work, we propose "Avalanche Hot-Source Method (AHSM)" for simple separated extraction of $R_S$ and $R_D$ in a single device. In AHSM, the high field region near the drain works as a new source for abundant carriers governing the current-voltage relationship in the MOSFET at high drain bias. We applied AHSM to n-channel MOSFETs as single-finger type with different channel width/length (W/L) combinations and verified its usefulness in the extraction of $R_S$ and $R_D$. We also confirmed that there is a negligible drift in the threshold voltage ($V_T$) and the subthreshold slope (SSW) even after application of the method to devices under practical conditions.

• Proceedings of the IEEK Conference
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• 1998.10a
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• pp.533-536
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• 1998

The electrical characteristics of NMOSFETs with asymmetrical source/drain regions have been expermentally investigated using test devices fabricated by $0.35\mu\textrm{m}$ CMOS technology. The performance degradation for asymmetric transistor and its causes are analyzed. The parasitic resistances, such as series resistance of active regions and silicide junction contact resistance, are distributed in parallel along the channel. Depending on source/drain geometry, the array of those resistances is changed, that results the various electrical properties.

• Proceedings of the KIEE Conference
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• 1998.11a
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• pp.144-146
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• 1998

In this study Dead time equivalent resistance of Voltage source power converter is very important in current controller design. And Non-linear Modeling method can be applied in Power converter analysis. Using Describing Function method and Non-linear Resistance Modeling. Voltage Source Power Converter Bode diagram and Current controller analysis method are more reality.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.2
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• pp.162-168
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• 2011

In this research, nitrogen plasma source ion implantation(PSII) of non-coated tungsten carbide endmill tools was conducted with low heat treatment for increasing wear resistance. After the low heat treatment of PSIIed tools to give a homogeneity of wear resistance, the surface modification of tools was analyzed by hardness test, surface roughness and cutting forces. As for the resultant cutting forces, low heat treatment in temperature of $400^{\circ}C$ and $500^{\circ}C$ is stable because of low cutting resistance. The 20-minutes heat treated tool at spindle speed 25000rpm has superiority of surface roughness, Ra of $0.420{\mu}m$ and was found to have good wear resistance. The higher hardness value was obtained by increasing temperature from $300^{\circ}C$ to $600^{\circ}C$ for PSIIed tools with low heat treatment. As the PSIIed tools under 10minutes at temperature of $600^{\circ}C$ have the highest hardness as Hv of 2349.8, It was analyzed that temperature processing give much influences on hardness.

• Journal of the Korean Solar Energy Society
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• v.30 no.4
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• pp.71-78
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• 2010

Investigation of the effective soil thermal conductivity(k) is the first step in designing the ground loop heat exchanger(borehole) of a geothermal heat pump system. The line source method is required by New and Renewable Energy Center of Korea Energy Management Corporation in analyzing data obtained from thermal response tests. Another important factor in designing the ground loop heat exchanger is the borehole thermal resistance($R_b$). There are two methods to evaluate $R_b$ : one is to use a line source method, and the other is to use a shape factor of the borehole. In this study, we demonstrated that the line source method produces better results than the shape factor method in evaluating $R_b$. This is because the borehole thermal resistance evaluated with the line source method characteristically reduces the temperature differences between an actual and a theoretical thermal behaviors of the borehole. Evaluation of $R_b$ requires soil volumetric heat capacity. However, the effect of the soil volumetric heat capacity on the borehole thermal resistance is very small. Therefore, it is possible to use a generally accepted average value of soil volumetric heat capacity($=2MJ/m^3{\cdot}K$) in the analysis. In this work, it is also shown that an acceptable range of the initial ignoring time should be in the range of 8~16hrs. Thus, a mean value of 12 hrs is recommended.

• Journal of the Institute of Electronics and Information Engineers
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• v.53 no.8
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• pp.39-48
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• 2016

In this paper, we propose thermal resistance compact model of FinFET structure that has hexagon shaped source/drain. The heating effect and thermal properties were increased by reduced size of the device, and thermal resistance is an important factor to analyze the effect and the properties. The heat source and each contact that is moved heat out were set up in transistor, and domain is divided by the heat source and the four parts of contacts : source, drain, gate, substrate. Each contact thermal resistance model is subdivided as a easily interpretable structure by analyzing the temperature and heat flow of the TCAD simulation results. The domains are modeled based on an integration or conformal mapping method through the structure parameters according to its structure. First modeled by analyzing the thermal resistance to a single fin, and applying the change in the parameter of the channel increases to improve the accuracy of the thermal resistance model of the multi-fin/ finger. The proposed thermal resistance model was compared to the thermal resistance by analyzing results of the 3D Technology CAD simulations, and the proposed total thermal resistance model has an error of 3 % less in single and multi-finl. The proposed thermal resistance model can predict the thermal resistance due to the increase of the fin / finger, and the circuit characteristics can be improved by calculating the self-heating effect and thermal characterization.

• Journal of the Society of Naval Architects of Korea
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• v.53 no.4
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• pp.329-335
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• 2016

In the present paper, Computational fluid dynamics (CFD) uncertainty analysis proposed by ITTC was investigated and applied to ship resistance performance using open source libraries, called OpenFOAM. Uncertainties for grid size, time step and iteration number were studied. Wave patterns and hull wave profile were compared for various uncertainty parameters. From results, grid size uncertainty was mainly contributed to simulation numerical uncertainty.