• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.72-72
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• 2010

The PV module company use variable process step and type. Especially soldering process is important, because crystalline cell can be bow by beating temperature. Most PV module company use hot air soldering type in the tabbing & string process. Although hot air type is used widely but this type is bound to influence on cell damage. So recently new way is introducing like a high current way. In this paper, we compare with characteristics of each soldering type and then conform a method to minimize solar cell deformation. Actually solar cell deformation show many difference by fix position and cooling time after soldering step.

• Current Photovoltaic Research
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• v.4 no.2
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• pp.59-63
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• 2016

A key point of a soldering process for photovoltaic (PV) modules is to increase an adhesive strength leading a low resistivity between ribbon and cell. In this study, we intended to optimize a heating condition for the soldering process and characterize the soldered joint via physical and chemical analysis methods. For the purpose, the heating conditions were adjusted by IR lamp power, heating time and hot plate temperature for preheating a cell. Since then the peel test for the ribbon and cell was conducted, consequently the peel strength data shows that there is some optimum soldering condition. In here, we observed that the peel strength was modified by increasing the heating condition. Such a soldering property is affected by a various factors of which the soldered joint, flux and bus bar of the cell are changed on the heating condition. Therefore, we tried to reveal causes determining the soldering property through analyzing the soldered interface.

• Journal of Welding and Joining
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• v.22 no.1
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• pp.65-70
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• 2004

A soldering process with longitudinal ultrasonic is conducted in this work using the Au bump and substrate. Localized heating of the solder is achieved and the stirring action due to the ultrasonic is found to influence the bond strength and microstructure of the eutectic solder The acceptable bonding condition is determined from the tensile strength. Since the multiple bonds can be formed simultaneously with localized heating, the proposed ultrasonic soldering method appears to be applicable to the high-density electronic package.

• International Journal of Clinical Preventive Dentistry
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• v.14 no.4
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• pp.247-255
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• 2018

Objective: Osseointegration is essential process for successful implants and effects to implant in long term, therefore, passive fitness of good prosthesis is necessary. To make a good prosthesis, at first it should be done a sectioned casting and then joined method of sectioned casting body is recommended. Methods: In this study, to provide the fundamental data on stable connection method for successful implants, the author tested fitness of casting body, and compared difference between gas soldering technique and laser welding technique. Results: In fitness test of 2 abutment (test A, C), gas soldering group's fitness in the opposite part of connection was worse than laser welding group. In fitness test of 3 abutment (test B, D), gap distance was increased both in gas soldering technique and laser welding technique. Gap distance at the connecting part and the opposite part of the abutment in gas soldering technique was worse than laser welding technique and the more additional abutment, the worse gap distance in gas soldering technique. In fitness test of 3 abutment (test B, D), there's little variation in No. 2 abutment when connecting soldering process was done and there's little influence on already soldered connection part when the additional soldering connection was done. Conclusion: On weak loading condition and the part which is needed an accuracy, laser welding technique is more effective and on long-span prosthesis and frequent chewing loading part, laser welding technique is recommended first and applying additional gas soldering technique would be better for making much more successful prosthesis.

• Journal of Welding and Joining
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• v.21 no.5
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• pp.534-539
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• 2003

An efficient soldering process using the longitudinal ultrasonic vibration is introduced in this work for electronic packaging. The effects of the process parameters such as the ultrasonic frequency, amplitude, dimension of the metal bump and solder are analyzed through a viscoelastic lumped model. The viscoelastic properties of the eutectic solder were measured for calculation and evaluation of heat generation capability of the solder. Experiments were conducted to verify the possibility of the proposed ultrasonic soldering method by inserting the Cu and Au bumps into the solder block. Localized heating due to ultrasonic vibration melts the solder near the metal bump, which demonstrates the applicability of the ultrasonic soldering method to the high-density electronic packaging.

• Journal of Welding and Joining
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• v.21 no.6
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• pp.46-54
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• 2003

The thermal response of electronic assemblies during forced convection-infrared reflow soldering is studied. Soldering for attaching electronic components to printed circuit boards is performed in a process oven that is equipped with porous panel heaters, through which air is injected in order to dampen temperature fluctuations in the oven which can be established by thermal buoyancy forces. Forced convection-infrared reflow soldering process with air injection is simulated using a 2-dimensional numerical model. The multimode heat transfer within the reflow oven as well as within the electronic assembly is simulated. Parametric study is also performed to study the effects of various conditions such as conveyor speed, blowing velocity, and electronic assembly emissivity on the thermal response of electronic assemblies. The results of this study can be used in the process oven design and selecting the oven operating conditions to ensure proper solder melting and solidification.

• Corrosion Science and Technology
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• v.8 no.5
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• pp.184-187
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• 2009

The trend of the microjoining technology by the laser-soldering process has been reviewed. Among the production technologies, joining technology plays an important role in the fabrication of electronic components. This has led to an increasing attention towards the use of modern microjoining technology such as micro-resistance spot joining, micro-soldering, micro-friction stir joining and laser-soldering, etc. This review covers the recent technical trends of laser-soldering collected from the COMPENDEX DB analysis of published papers, research subject and research institutes.

• 한국태양에너지학회:학술대회논문집
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• 2011.11a
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• pp.303-306
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• 2011

Although PV module manufacturing and its structure are simple, the semi-permanent products can be used out doors for more than twenty years. Therefore it is need to choose proper materials and optimize manufacturing process. This paper suggest that factors of degradation need to be studied to achieve a more understanding of PV module Degradation rates and material failure. Nowadays durability of the PV Module is very important to sustain output safety for obtaining reliability. This paper is about the experiment that soldering uniformity of soldering process and to make least void from soldering process. From This study soldering flux residue and soldering method is main factor to form void blocked soldering uniformity and by using this.

• Journal of Surface Science and Engineering
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• v.36 no.5
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• pp.373-378
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• 2003

With increasing environmental concerns, application of lead-free solder and fluxless soldering process have been taken attention from the electronic packaging industry. Plasma treatment is one of the soldering methods for the fluxless soldering, and it can prevent environmental pollution cased by flux. On this study fluxless soldering process under $Ar-H_2$plasma using lead free solders such as Sn-3.5 wt%Ag, Sn-3.5 wt%Ag-0.7 wt%Cu and Sn-37%Pb for a reference was investigated. As the plasma reflow has higher soldering temperature than normal air reflow, the effects of UBM(Under Bump Metallization) thickness on the interfacial reaction and bonding strength can be critical. Experimental results showed in case of the thin UBM, Au(20 nm)/Cu(0.3 $\mu\textrm{m}$)/Ni(0.4 $\mu\textrm{m}$)/Al(0.4 $\mu\textrm{m}$), shear strength of the soldered joint was relatively low as 19-27㎫, and it's caused by the crack observed along the bonded interface. The crack was believed to be produced by the exhaustion of the thin UBM-layer due to the excessive reaction with solder under plasma. However, in case of thick UBM, Au(20 nm)/Cu(4 $\mu\textrm{m}$)/Ni(4 $\mu\textrm{m}$)/Al(0.4 $\mu\textrm{m}$), the bonded interface was sound without any crack and shear strength gives 32∼42㎫. Thus, by increasing UBM thickness in this study the shear strength can be improved to 50∼70%. Fluxed reflow soldering under hot air was also carried out for a reference, and the shear strength was 48∼52㎫. Consequently the fluxless soldering with plasma showed around 65∼80% as those of fluxed air reflow, and the possibility of the $Ar-H_2$ plasma reflow was evaluated.

• 제어로봇시스템학회:학술대회논문집
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• 1988.10a
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• pp.295-298
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• 1988

For the automation of the manual soldering process through robot technology, two main tasks have to be achieved: Control of various soldering parameters and realization of flexible tool movements like human hands. In this paper a method for attaining these tasks is presented and analyzed.