• Journal of the Korea Institute of Information Security & Cryptology
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• v.14 no.6
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• pp.57-68
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• 2004

Recently, Radio Frequency Identification (RFID) systems stands in the spotlight of industry as a common and useful tool in manufacturing, supply chain management (SCM) and stock management. In the near future, low-cost RFID Electronic Product Code; (EPC) or smart-labels may be a practical replacement for optical barcodes on consumer items. However, manufacturing cheap and small RFID tags, and developing secure RFID authentication Protocols are problems which need to be solved. In spite of advances in semiconductor technology, computation and storage ability of the tag are so limited that it is difficult and too expensive to apply existing crypto-systems to RFID tags. Thus it is necessary to create a new protocol which would require less storage space and lower computation costs and that is secure in the RFID system's environments. In this paper, we propose a RFID authentication protocol that is secure against location tracking and spoofing attacks. Our protocol can be used as a practical solution for privacy protection because it requires less computations in database than the previous RFID authentication protocol.

• Journal of Sensor Science and Technology
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• v.30 no.6
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• pp.388-394
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• 2021

The conventional microelectromechanical system (MEMS) process has been used to fabricate sensors with high costs and high-volume productions. Emerging 3D printing can utilize various materials and quickly fabricate a product using low-cost equipment rather than traditional manufacturing processes. 3D printing also can produce the sensor using various materials and design its sensing structure with freely optimized shapes. Hence, 3D printing is expected to be a new technology that can produce sensors on-site and respond to on-demand demand by combining it with open platform technology. Therefore, this paper reviews three standard 3D printing technologies, such as Fused Deposition Modeling (FDM), Direct Ink Writing (DIW), and Digital Light Processing (DLP), which can apply to the sensor fabrication process. The review focuses on strain/load sensors having both sensing material features and structural features as well. NCPC (Nano Carbon Piezoresistive Composite) is also introduced as a promising 3D material due to its favorable sensing characteristics.

• Journal of Powder Materials
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• v.29 no.2
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• pp.159-165
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• 2022

Rare earth elements, which are important components of motors, are in high demand and thus constantly get more expensive. This tendency is driven by the growth of the electric vehicle market, as well as environmental issues associated with rare-earth metal manufacturing. TC 298 of the ISO manages standardization in the areas of rare-earth recycling, measurement, and sustainability. Korea, a resource-poor country, is working on international standardization projects that focus on recycling and encouraging the domestic adoption of international standards. ITU-T has previously issued recommendations regarding the recycling of rare-earth metals from e-waste. ISO TC 298 expands on the previous recommendations and standards for promoting the recycling industry. Recycling-related rare earth standards and drafts covered by ISO TC 298, as well as Korea's strategies, are reviewed and discussed in this article.

• Asia-pacific Journal of Multimedia Services Convergent with Art, Humanities, and Sociology
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• v.7 no.9
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• pp.259-269
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• 2017

As emerging the '4th Industrial Revolution' by increasing the necessity of the intelligent system recently, 'Autonomic Control System' also has been the important issue. It is necessary to develop the system collecting data of machines and sensors for the autonomic control system to monitor the target system. But it is difficult to collect data because data formats of machines and sensors of the existing factories differ between each manufacturer. Therefore, this paper presents and implements data collecting and processing system that comprise 3 steps including 'ParseBuffer', 'ProcessData' and 'AddToBuffer' by using 'MTConnect' that is standard manufacturing facility data collecting middleware. Through the suggested system, we can get data in a common format usable in an autonomous control system. As a case study, we experimented with the generation and collection of AGV (Automated Guided Vehicle) data, which is an unattended transportation system in the factory. To accomplish this, we defined the data type in accordance with the MTConnect standard and confirmed the data collected through the proposed system.

• Composites Research
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• v.28 no.4
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• pp.155-161
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• 2015

A composite structure was fabricated with embedded impact detection capabilities for applications in Structural Health Monitoring (SHM). By embedding sensor functionality in the composite, the structure can successfully perform impact localization in real time. Smart resin, composed of $Pb(Ni_{1/3}Nb_{2/3})O_3-Pb(Zr,\;Ti)O_2$ (PNN-PZT) powder and epoxy resin with 1:30 wt%, was used instead of conventional epoxy resin in order to activate the sensor function in the composite structure. The embedded impact sensor in the composite was fabricated using Hand Lay-up and Vacuum Assisted Resin Transfer Molding(VARTM) methods to inject the smart resin into the glass-fiber fabric. The electrodes were fabricated using silver paste on both the upper and bottom sides of the specimen, then poling treatment was conducted to activate the sensor function using a high voltage amplifier at 4 kV/mm for 30 min at room temperature. The composite's piezoelectric sensitivity was measured to be 35.13 mV/N by comparing the impact force signals from an impact hammer with the corresponding output voltage from the sensor. Because impact sensor functionality was successfully embedded in the composite structure, various applications of this technique in the SHM industry are anticipated. In particular, impact localization on large-scale composite structures with complex geometries is feasible using this composite embedded impact sensor.

• KIPS Transactions on Software and Data Engineering
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• v.11 no.5
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• pp.211-220
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• 2022

Recently, research on smart factories triggered by the 4th industrial revolution is being actively conducted. Accordingly, the manufacturing industry is conducting various studies to improve productivity and quality based on deep learning technology with robust performance. This paper is a study on the method of detecting tire surface defects in the visual inspection stage of the tire manufacturing process, and introduces a tire surface defect detection method using a depth image acquired through a 3D camera. The tire surface depth image dealt with in this study has the problem of low contrast caused by the shallow depth of the tire surface and the difference in the reference depth value due to the data acquisition environment. And due to the nature of the manufacturing industry, algorithms with performance that can be processed in real time along with detection performance is required. Therefore, in this paper, we studied a method to normalize the depth image through relatively simple methods so that the tire surface defect detection algorithm does not consist of a complex algorithm pipeline. and conducted a comparative experiment between the general normalization method and the normalization method suggested in this paper using YOLO V3, which could satisfy both detection performance and speed. As a result of the experiment, it is confirmed that the normalization method proposed in this paper improved performance by about 7% based on mAP 0.5, and the method proposed in this paper is effective.

• The Bulletin of The Korean Astronomical Society
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• v.40 no.1
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• pp.82.3-83
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• 2015

비축 반사경의 DTM (Diamond Turning Machine) 가공을 하기 전에는 시간 및 비용의 절감을 위해 CNC(Computerized Numerically Controlled Machine Tools)를 이용하여 비축면의 곡률반경과 가장 유사한 형태의 구면으로 1차 가공 후 3축 이상을 제어할 수 있는 MC (Machining Center)를 이용하여 근사한 비축면을 먼저 가공한다. 이후 DTM으로 광학계에서 요구하는 형상 정밀도 및 표면 조도를 만족하는 비축면을 완성한다. 하지만 비축면을 가공하는 경우, 일반적인 축 대칭 광학계와 달리 가공장비에 장착된 기상계측기를 사용할 수 없기 때문에 외부 장비를 이용하여 반사경 표면을 측정해야한다. 이때 측정과 가공 단계 사이에서 정렬오차가 발생하여 반사경의 형상 정밀도 향상을 위한 보상가공에 어려움이 있다. 본 연구에서는 비축면 반사경의 가공과 측정 과정 사이에 발생하는 정렬오차를 최소화 할 수 있는 DTM 가공용 지그를 설계 및 제작하였다. 또, DTM으로 가공한 반사경의 측정값과 설계값을 비교하여 알루미늄 반사경의 광학 성능을 평가하였다. 이러한 성능 평가 결과는 비축면 반사경의 형상 보상가공을 위한 모델링 방법을 고안하는데에 있어 핵심 자료가 될 것이다.

• ETRI Journal
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• v.25 no.2
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• pp.65-72
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• 2003

To achieve cost and size reductions, we developed a low cost manufacturing technology for RF substrates and a high performance passive process technology for RF integrated passive devices (IPDs). The fabricated substrate is a conventional 6" Si wafer with a 25${\mu}m$ thick $SiO_2$ surface. This substrate showed a very good insertion loss of 0.03 dB/mm at 4 GHz, including the conductive metal loss, with a 50 ${\Omega}$ coplanar transmission line (W=50${\mu}m$, G=20${\mu}m$). Using benzo cyclo butene (BCB) interlayers and a 10 ${\mu}m$ Cu plating process, we made high Q rectangular and circular spiral inductors on Si that had record maximum quality factors of more than 100. The fabricated inductor library showed a maximum quality factor range of 30-120, depending on geometrical parameters and inductance values of 0.35-35 nH. We also fabricated small RF IPDs on a thick oxide Si substrate for use in handheld phone applications, such as antenna switch modules or front end modules, and high-speed wireless LAN applications. The chip sizes of the wafer-level-packaged RF IPDs and wire-bondable RF IPDs were 1.0-1.5$mm^2$ and 0.8-1.0$mm^2$, respectively. They showed very good insertion loss and RF performances. These substrate and passive process technologies will be widely utilized in hand-held RF modules and systems requiring low cost solutions and strict volumetric efficiencies.

• International Journal of Internet, Broadcasting and Communication
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• v.12 no.4
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• pp.55-60
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• 2020

This study aims to apply Arduino and 3D printing technology considered as a key subject in the age of 4th industrial revolution which is a step 1 for customizing and applying the process of production by chemical molding companies producing environment-friendly biodegradable packaging materials to the 3D printing teaching in universities. Step 3 is applied to IoT for Arduino application, and 3D printing technology is also used on the basis of teaching creative integrated human resource. Integration of Arduino with 3D printers is based on the assumption that middle- and high-school students can learn it step by step to higher levels and university students majoring or not majoring in computing science can also have computing skills for solving 3D printing-based problems. For IoT application in this study, the 3D printing technology is applied to the external shape of products for producing an Arduino-based lighting fixture. The applied 3D printing technology is further extended to teaching modeling of producing packaging materials by chemical product molding companies in the age of 4th industrial revolution.

• International Journal of Internet, Broadcasting and Communication
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• v.12 no.4
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• pp.128-136
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• 2020

In this paper, we presented a simple hologram recording set for learners to broaden their program choices and experience holographic techniques with lifelong education programs. In order to obtain quality 3D images, the quality of light sources and recording mediums, which are the main elements of hologram recording, must be good. In addition, due to the characteristics of the hologram, the ambient vibrations shall be minimized for accurate interference pattern recording. The simple hologram recording set presented in this paper has not significantly restricted in space and location, and anyone can easily experience it at a reasonable price compared to the existing hologram production method. Also, it can make two different type of hologram (transmission and reflection) for providing easy access to recording and reconstruction of the hologram. Experiments have shown that holographic manufacturing practices are a very useful way to educate the public on optics and photonics technologies.