• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.59-60
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• 2006

The slurry stability and removal rate during recycling of slurry in silicon wafer polishing was studied. Average abrasive size of slurry was not changed with recycling time, however, large particles appeared as recycling time increased. Large particles were related foreign substances from pad or abraded silicon flakes during polishing. The removal rate as well as pH of slurry was decreased as recycling time increased. It suggests that the consumption of OH ions during recycling is the main cause of decrease of removal rate. Therefore, it is important to control pH of slurry to obtain optimum removal rate during polishing.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.382-385
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• 2003

Chemical mechanical polishing(CMP) is an essential process in the production of copper-based chips. On this work, the stability of Hydrogen Peroxide($H_2O_2$) as oxidizer of Cu CMP slurry has been investigated. $H_2O_2$ is known as the most common oxidizer in Cu CMP slurry. Copper slowly dissolves in $H_2O_2$ solutions and the interaction of $H_2O_2$ with copper surface had been studied in the literature. Because hydrogen peroxide is a weak acid in aqueous solutions, a passivation-type slurry chemistry could be achieved only with pH buffered solution.[1] Moreover, $H_2O_2$ is so unstable that its stabilization is needed using as oxidizer. As adding KOH as pH buffering agent, stability of $H_2O_2$ decreased. However, stability went up with putting in small amount of BTA as film forming agent. There was no difference of $H_2O_2$ stability between KOH and TMAH at same pH. On the other hand, $H_2O_2$ dispersion of TMAH is lower than that of KOH. Furthermore, adding $H_2O_2$ in slurry in advance of bead milling lead to better stability than adding after bead milling. Generally, various solutions of phosphoric acids result in a higher stability. Using Alumina C as abrasive was good at stabilizing for $H_2O_2$; moreover, better stability was gotten by adding $H_3PO_4$.

• Journal of Korean Tunnelling and Underground Space Association
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• v.15 no.4
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• pp.401-413
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• 2013

Slurry shield tunnelling ensures stability by pressurizing the tunnel face with the slurry contained in the chamber. It resists water and earth pressure in order to prevent the failure in the tunnel face during tunnel excavation. If the ground is relatively coarse, slurry can not clog the tunnel face and excessive slurry infiltration will occur. In this case chemical compounds or additives should be added to the slurry in order to improve the clogging phenomena at the tunnel face. In this study, the effect of the carbon dioxide gas as an additive to the slurry instead of chemical compounds on the capability of enhancing the clogging in the tunnel face is investigated. Bubbles arising from the carbonate-added slurry are trapped in the soil voids enhancing the clogging capability. This effect is studied in this paper by performing laboratory model tests simulating in-situ conditions, and by adopting the fine particle clogging theory. Tunnel face stability analysis was also performed and it was found that the effective size ($D_{10}$) of soils which can guarantee tunnel stability utilizing the carbonate-added slurry increased from 1.0 mm up to 2.6 mm. Moreover, Stability analysis showed that the tunnel face is stable if the ${\lambda}$(deposition coefficient) value is greater than $0.007sec^{-1}$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05c
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• pp.166-169
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• 2003

In this study, we evaluated the characteristics by the addition of 3 different kinds of nonionic surfactant to improve the dispersion stability of slurries. Slurry stability is an issue in any industry in which settling of particles can result in poor performance. So we observed the variation of particle size and settling rate when the concentration and addition time of surfactant are changed. When the surfactant is added after milling process, the particle size and pH became low. It is supposed that the particle agglomeration was disturbed by adsorption of surfactant on alumina abrasive. The settling rate was relatively stable when nonionic surfactant is added about 0.1~1.0 wt%. When molecular weight(MW) is too small like Brij 35, it was appeared low effect on dispersion stability. Because it can't prevent coagulation and subsequent settling with too small MW. The proper quality of MW for slurry stability was presented about 500,000. Consequently, the addition of nonionic surfactant to alumina slurry has been shown to have very good effect on slurry stabilization. If we apply this results to copper CMP process, it is thought that we will be able to obtain better yield.

• Proceedings of the Korean Geotechical Society Conference
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• 2008.03a
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• pp.1100-1105
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• 2008

In most drilled shafts construction sites, it is common, depending on the site condition, to use either water or slurry as fluids for maintaining stability of the holes, however, there are yet no design manuals by hole stability fluids. In this paper, in order to evaluate load transfer characteristics of the drilled shafts by hole stability fluids, two test piles are constructed over the soft ground of the lower Busan Bay based on the Bi-directional Pile Load Test. The test results showed that no ultimate states has found under the condition of applied loads with fresh water and slurry as hole fluids for drilled shafts. Then, the load transfer behavior were estimated with the data measured in fields and the effect of hole stability fluids were compared. All these results are presented in the paper.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.50-50
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• 2007

최근 DRAM 소자 내에서 Ruthenium (Ru) 은 높은 화학적 안정성, 누설전류에 대한 높은 저항성, 고유전체와의 높은 안정성등과 같은 특성으로 인해 금속층-유전막(insulator)-금속층 캐패시터에 대한 하부전극으로 각광받고 있다. 일반적으로 Ru은 화학적으로 매우 안정하여 습식 식각으로 제거하기 어려우며, 이로인해 건식 식각을 이용하여 Ru을 제거하는 것이 널리 통용되고 있다. 하지만 칵 캐패시터의 분리를 위해 Ru을 건식 식각할 경우, 유독한 $Ru0_4$ 가스가 발생할 수 있으며 Ru 하부전극의 탈균일한 표면과 몰드 산화막의 손실을 유발할 수 있다. 이로인해 각 캐패시터간의 분리와 평탄화를 위해 CMP 공정이 도입되게 되었다. 이러한 CMP 공정에 공급되는 슬러리에는 부식액, pH 적정제, 연마입자등이 첨가되는데 이때 연마입자가 응집하여 슬러리의 분산 안정성 저하에 영향을 줄 수 있다. 그리하여 본 연구에서는 Ru CMP Slurry에서의 surfactant와 같은 첨가제에 따른 zeta potential, particle size, sedimentation의 분석을 통해 slurry 안정성에 대란 영향을 살펴보았다. 또한 선택된 surfactant가 첨가된 Ru CMP Slurry를 제조하여 Ru의 removal rate와 TEOS에 대한 selectivity를 측정해 보았다.

• Journal of the Korean Ceramic Society
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• v.36 no.7
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• pp.705-710
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• 1999

Stability and chemical durability for aqueous casting of BaTiO3 slurry with polycarylic acid(PAA) were studied. PAA was well chemisorbed on surface of BaTiO3 powder at neutral pH but did not chemically adsorbed at low pH. The amount of Ba dissolution in aqueous BaTiO3 slurry was abruptly increased at strong acid pH2 and also at high amount of PAA. Protection of Ba dissolution and stability of slurry could be obtained through the optimization of slurry conditions such as pH amount of surfactant and solid content.

• Journal of Powder Materials
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• v.21 no.3
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• pp.191-195
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• 2014

This study reports a simple way of fabricating the porous Cu with unidirectional pore channels by freeze drying camphene slurry with Cu oxide coated Cu powders. The coated powders were prepared by calcination of ball-milled powder mixture of Cu and Cu-nitrate. Improved dispersion stability of camphene slurry could be achieved using the Cu oxide coated Cu powders instead of pure Cu powders. Pores in the frozen specimen at $-25^{\circ}C$ were generated by sublimation of the camphene during drying in air, and the green bodies were sintered at $750^{\circ}C$ for 1 h in $H_2$ atmosphere. XRD analysis revealed that the coated layer of Cu oxide was completely converted to Cu phase without any reaction phases by hydrogen heat treatment. The porous Cu specimen prepared from pure Cu powders showed partly large pores with unidirectional pore channels, but most of pores were randomly distributed. In contrast, large and aligned parallel pores to the camphene growth direction were clearly observed in the sample using Cu oxide coated Cu powders. Pore formation behavior depending on the initial powders was discussed based on the degree of powder rearrangement and dispersion stability in slurry.

• Transactions on Semiconductor Engineering
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• v.2 no.2
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• pp.1-9
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• 2024

CMP (Chemical Mechanical Polishing) processes have become essential for creating multilayered component structures in semiconductor manufacturing. Typically, the slurry composition in CMP processes involves a balance of three components such as ceria, dispersant, and deionized water. In this study, we conducted research on the stability of ceria slurries using an amphoteric surfactant with controlled concentrations of AMP (2-Amino-2-methyl-1-propanol). The results indicated pH stabilization influenced by carboxylic (-COOH) groups depending on the AMP concentration. Additionally, there was no occurrence of aggregation in the ceria slurry, confirming the absence of dispersion stability issues.

• Journal of Korean Tunnelling and Underground Space Association
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• v.24 no.5
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• pp.375-393
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• 2022

This study was deal with blow-out and buoyancy stability evaluation method for slurry shield TBM. When applying a slurry shield TBM for the construction of a shallow tunnel under river or sea, the stability of slurry blow-out and segment lining buoyancy should be evaluated. However, there is a problem in that the currently applied theoretical formula is somewhat complicated, making it inconvenient to calculate in practice. In this study, some simple charts were proposed to easily evaluate the stability of slurry blow-out and segment lining buoyancy. In addition, the buoyancy safety factor of segment lining using the strength reduction method was evaluated and compared with the buoyancy safety factor based on the theoretical formula. The buoyancy safety factor by the theoretical formula was evaluated to be rather small, and it was confirmed that it was on the safe side. The simplified charts for the evaluation of slurry blow-out and buoyancy stability presented in this study are expected to be usefully utilized in the planning and design of undersea tunnels.