• Journal of the Korean Ceramic Society
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• v.52 no.6
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• pp.403-409
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• 2015

Porous alumina ceramics are involved in many industrial applications due to the exceptional properties of these products. This study addresses the preparation of porous alumina ceramics using hollow microspheres as a pore-forming agent and slip casting as a green-body-forming technique. A uniform distribution of pores is a basic requirement of a porous material. This study investigates three different slurry systems, i.e., as-prepared alumina slurry, alumina slurry electrostatically dispersed by hydrochloric acid (HCl), and slurry dispersed by the commercial dispersant 'Darvan C-N'. At a low viscosity, the hollow microspheres in the slurry tend to float, which causes a non-uniform pore distribution. To avoid this phenomenon, the viscosity of the slurry was increased to the extent that the movement of hollow microspheres ceased in the slurry. As a result, a uniform pore distribution was achieved.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.10a
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• pp.24.2-24.2
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• 2011

Ru is used as a bottom electrode capacitor in dynamic random access memories (DRAMs) and ferroelectric random access memories (FRAMs). The surface of the Ru needs to be planarized which is usually done by chemical mechanical polishing (CMP). Ru CMP process requires chemical slurry consisting of abrasive particles and oxidizer. A slurry containing NaIO4 and alumina particles is already proposed for Ru CMP process. However, the stability of the slurry is critical in the CMP process since if the particles in the slurry get agglomerated it would leave scratches on the surface being planarized. Thus, in the present work, the stability behavior of the slurry using a suitable anionic polyelectrolyte is investigated. The parameters such as slurry pH, polyelectrolyte concentration, adsorption time and the sequence of addition of chemicals are optimized. The results show that the slurry is stable for longer time at an optimized condition. The polishing behavior of the Ru using the optimized slurry is also investigated.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.11a
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• pp.39-42
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• 2002

Recently, CMP (chemical mechanical polishing) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, COO (cost of ownership) and COC (cost of consumables) were relatively increased because of expensive slurry. In this paper, we have studied the possibility of recycle of reused silica slurry in order to reduce the costs of CMP slurry. The post-CMP thickness and within-wafer non-uniformity(WIWNU) were measured as a function of different slurry composition. As a experimental result, the performance of reused slurry with annealed silica abrasive of 2 wt% contents was showed high removal rate and low non-uniformity. Therefore, we propose two-step CMP process as follows In the first-step CMP, we can polish the thick and rough film surface using remaked slurry, and then, in the second-step CMP, we can polish the thin film and fine pattern using original slurry. In summary, we can expect the saving of high costs of slurry.

• Geotechnical Engineering
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• v.13 no.2
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• pp.9-16
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• 1997

Cut-off methods of controlling leachate migration from waste landfills and contaminated sites are studied. Permeability and chemical compatibility tests are prrforlned on slurry wall materials including soil-bentonite, cement-bentonite, cement / fly ash-bentonite, plastic concrete. Hydraulic conductivity of soil-bentonite mixture is the lowest of these four bacuill materials. The leachate from municipal solid waste has little influence on the permeability of the backfill materials. The bentonite slurry becomes flocculated and aggregated when exposed to the leachate. The results of the permeability test showed that the hydraulic conductivities of the backfill materials are in the order soil-beiltonite, Plastic concrete, cement-bentonite. And the result c: the compatibility test showed increase in permeability due to the effects of leachate. Thus, in designing the slurry wall it is essential to check the behaviour of the bentonite slurry and backfill materials on the compatibility with the contaminants.

• Korean Journal of Materials Research
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• v.16 no.5
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• pp.308-311
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• 2006

The purpose of this study is to investigate the difference of the wafer nanotopography impact on the oxide-film thickness variation between the STI CMP using ceria slurry and STI CMP using fumed silica slurry. The nanotopography impact on the oxide-film thickness variation after STI CMP using ceria slurry is 2.8 times higher than that after STI CMP using fumed silica slurry. It is attributed that the STI CMP using ceria slurry follows non-Prestonian polishing behavior while that using fumed silica slurry follows Prestonian polishing behavior.

• Proceedings of the Materials Research Society of Korea Conference
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• 2007.11a
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• pp.7.2-7.2
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• 2007

• Proceedings of the Materials Research Society of Korea Conference
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• 1992.05a
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• pp.95-96
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• 1992

• Proceedings of the Materials Research Society of Korea Conference
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• 1997.10a
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• pp.77-77
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• 1997

• Proceedings of the Materials Research Society of Korea Conference
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• 1998.11a
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• pp.40-40
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• 1998

• Proceedings of the Materials Research Society of Korea Conference
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• 2002.11a
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• pp.56-56
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• 2002