• 한국세라믹학회지
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• 제52권6호
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• pp.403-409
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• 2015

Porous alumina ceramics are involved in many industrial applications due to the exceptional properties of these products. This study addresses the preparation of porous alumina ceramics using hollow microspheres as a pore-forming agent and slip casting as a green-body-forming technique. A uniform distribution of pores is a basic requirement of a porous material. This study investigates three different slurry systems, i.e., as-prepared alumina slurry, alumina slurry electrostatically dispersed by hydrochloric acid (HCl), and slurry dispersed by the commercial dispersant 'Darvan C-N'. At a low viscosity, the hollow microspheres in the slurry tend to float, which causes a non-uniform pore distribution. To avoid this phenomenon, the viscosity of the slurry was increased to the extent that the movement of hollow microspheres ceased in the slurry. As a result, a uniform pore distribution was achieved.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2011년도 추계학술발표대회
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• pp.24.2-24.2
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• 2011

Ru is used as a bottom electrode capacitor in dynamic random access memories (DRAMs) and ferroelectric random access memories (FRAMs). The surface of the Ru needs to be planarized which is usually done by chemical mechanical polishing (CMP). Ru CMP process requires chemical slurry consisting of abrasive particles and oxidizer. A slurry containing NaIO4 and alumina particles is already proposed for Ru CMP process. However, the stability of the slurry is critical in the CMP process since if the particles in the slurry get agglomerated it would leave scratches on the surface being planarized. Thus, in the present work, the stability behavior of the slurry using a suitable anionic polyelectrolyte is investigated. The parameters such as slurry pH, polyelectrolyte concentration, adsorption time and the sequence of addition of chemicals are optimized. The results show that the slurry is stable for longer time at an optimized condition. The polishing behavior of the Ru using the optimized slurry is also investigated.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 추계학술대회 논문집 Vol.15
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• pp.39-42
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• 2002

Recently, CMP (chemical mechanical polishing) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, COO (cost of ownership) and COC (cost of consumables) were relatively increased because of expensive slurry. In this paper, we have studied the possibility of recycle of reused silica slurry in order to reduce the costs of CMP slurry. The post-CMP thickness and within-wafer non-uniformity(WIWNU) were measured as a function of different slurry composition. As a experimental result, the performance of reused slurry with annealed silica abrasive of 2 wt% contents was showed high removal rate and low non-uniformity. Therefore, we propose two-step CMP process as follows In the first-step CMP, we can polish the thick and rough film surface using remaked slurry, and then, in the second-step CMP, we can polish the thin film and fine pattern using original slurry. In summary, we can expect the saving of high costs of slurry.

• 한국지반공학회지:지반
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• 제13권2호
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• pp.9-16
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• 1997

본 논문은 오염지역 또는 폐기물 매립지의 오염 차단용으로 사용될 수 있는 연직차폐기술을 연구하였다. 이를 위하여 슬러리월 재료에 대한 투수 및 화학반응실험을 통하여 적절한 배합비를 갖은 흙-벤토나이트, 시멘트-벤토나이트, 시멘트l플라이애쉬-벤토나이트, 플라스틱 콘크리트 혼합재료를 제시하였다. 벤토나이트 슬러리의 침출수 반응성 실험결과, 화학물질의 영향에 의하여 벤토나이트 슬러리가 국부적으로 응집이 이루어지고, 슬러리 현탁액이 제대로 형성되지 않는 현상이 발생하였다. 뒤채움재의 투수시험 결과, 시멘트-벤토나이트. 플라스틱 콘크리트, 흙-벤토나이트 순으로 투수 계수가 작게 나타났으며, 침출수와의 반응실험결과, 투수성은 약간 증가하는 것으로 나타났으나 큰 영향은 없는 것으로 나타났다.

• 한국재료학회지
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• 제16권5호
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• pp.308-311
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• 2006

The purpose of this study is to investigate the difference of the wafer nanotopography impact on the oxide-film thickness variation between the STI CMP using ceria slurry and STI CMP using fumed silica slurry. The nanotopography impact on the oxide-film thickness variation after STI CMP using ceria slurry is 2.8 times higher than that after STI CMP using fumed silica slurry. It is attributed that the STI CMP using ceria slurry follows non-Prestonian polishing behavior while that using fumed silica slurry follows Prestonian polishing behavior.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2007년도 추계학술발표대회 및
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• pp.7.2-7.2
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• 2007

• 한국재료학회:학술대회논문집
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• 한국재료학회 1992년도 추계학술발표강연 및 논문개요집
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• pp.95-96
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• 1992

• 한국재료학회:학술대회논문집
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• 한국재료학회 1997년도 한국재료학회 추계학술발표회
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• pp.77-77
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• 1997

• 한국재료학회:학술대회논문집
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• 한국재료학회 1998년도 추계학술발표강연 및 논문개요집
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• pp.40-40
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• 1998

• 한국재료학회:학술대회논문집
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• 한국재료학회 2002년도 추계학술발표강연 및 논문개요집
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• pp.56-56
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• 2002