• Title/Summary/Keyword: slide roll ratio

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Molecular Dynamics Simulations Study on Surface Polishing by Spherical Abrasive (구형 연마재에 의한 표면 연마에 관한 분자동역학 시뮬레이션 연구)

  • Park, Byung-Heung;Kang, Jeong-Won
    • Journal of the Semiconductor & Display Technology
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    • v.10 no.4
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    • pp.47-51
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    • 2011
  • We investigated the substrate surface polishing by the spherical rigid abrasive under the compression using classical molecular dynamics modeling. We performed three-dimensional molecular dynamic simulations using the Morse potential functions for the various slide-to-roll ratios, from 0 to 1, and then, the compressive forces acting on the spherical rigid abrasive were calculated as functions of the time and the slide-to-roll ratio. The friction coefficients obtained from the classical molecular dynamics simulations were compared to those obtained from the experiments; and found that the molecular dynamic simulation results with the slide-to-roll ratio of 0 value were in good agreement with the experimental results.

Elastohydrodynamic Lubrication of Line Contacts Incorporating Bair & Winer's Limiting Shear Stress Rheological Model (한계전단응력형태의 Bair & Winer 리올로지 모델을 사용한 선접촉 탄성유체윤활해석)

  • 이희성;양진승
    • Tribology and Lubricants
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    • v.14 no.1
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    • pp.85-93
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    • 1998
  • The Bair & Winer's limiting shear stress rheological model is incorporated into the Reynolds equation to successfully predict the traction and film thickness for an isothermal line contact using the primary rheological properties. The modified WLF viscosity model and Barus viscosity model are also adapted for the realistic prediction of EHD tractional behavior. The influences of the limiting shear stress and slide-roll ratio on the pressure spike, film thickness, distribution of shear stress and nonlinear variation of traction are examined. A good agreement between the disc machine experiments and numerical traction prediction has been established. The film thickness due to non-Newtonian effects does not deviate significantly from the fdm thicknesss with Newtonian lubricant.

Molecular Dynamics Study on Property Change of CMP Process by Pad Hardness (CMP 공정에서 연마패드 경도에 따른 연마 특성 변화 분자동력학 연구)

  • Kwon, Oh Kuen;Choi, Tae Ho;Lee, Jun Ha
    • Journal of the Semiconductor & Display Technology
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    • v.12 no.1
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    • pp.61-65
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    • 2013
  • We investigated the wearable dynamics of diamond spherical abrasive during the substrate surface polishing under the pad compression via classical molecular dynamics modeling. We performed three-dimensional molecular dynamics simulations using the Morse potential functions for the copper substrate and the Tersoff potential function for the diamond abrasive. The pad hardness had a big impact on the wearable dynamics of the abrasive. The moving speed of the abrasive decreased with increasing hardness of the pad. As the hardness decreased, the abrasive was indented into the pad and then the sliding motion of the abrasive was increased. So the pad hardness was greatly influenced on the slide-to-roll ratio as well as the wearable rate.