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Molecular Dynamics Study on Property Change of CMP Process by Pad Hardness  

Kwon, Oh Kuen (Department of Electronic Engineering, Semyung University)
Choi, Tae Ho (Department of Computer Information Telecommunication Engineering, Sangmyung University)
Lee, Jun Ha (Department of Computer System Engineering, Sangmyung University)
Publication Information
Journal of the Semiconductor & Display Technology / v.12, no.1, 2013 , pp. 61-65 More about this Journal
Abstract
We investigated the wearable dynamics of diamond spherical abrasive during the substrate surface polishing under the pad compression via classical molecular dynamics modeling. We performed three-dimensional molecular dynamics simulations using the Morse potential functions for the copper substrate and the Tersoff potential function for the diamond abrasive. The pad hardness had a big impact on the wearable dynamics of the abrasive. The moving speed of the abrasive decreased with increasing hardness of the pad. As the hardness decreased, the abrasive was indented into the pad and then the sliding motion of the abrasive was increased. So the pad hardness was greatly influenced on the slide-to-roll ratio as well as the wearable rate.
Keywords
Chemical Mechanical Polishing; Molecular Dynamics; Semiconductor Processes;
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