• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.16 no.8
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• pp.728-740
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• 2004

Heat sink has extended surface area for enhanced heat transfer. The enhanced convection heat transfer has been used widely, such as cooling electronic chips in the electronics industry. Heat sink usually requires an increase in the heat transfer and a decrease in the pressure drop, and must improve the performance in the flow field of industrial plants. In this study, wing fin heat sink was studied and tests were conducted in a rectangular cross sectional channel with wing fin heat sinks. The leading and trailing ends of a wing fin have a sharp edge, simulating the airfoil feature. Empirical correlations have been developed for wing fin heat sink types. And wing fin heat sinks have better cooling performance than elliptic fin and square fin types.

• Korean Journal of Materials Research
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• v.15 no.12
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• pp.829-832
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• 2005

Thermal analysis of new designed heat-sink models was carried out according to the natural ana the forced convection using computational fluid dynamics(CFD). Heat resistance of wave type, top vented wave type and plate type of heat sink was compared with each other As the direction of fin and air flow are vertical(z-axis), it is shown that radiant heat performance of all of heat sinks was superior than other experimental conditions. Especially, the heat resistance of top vented wave heat sink was $0.17^{\circ}C/W$(forced convection) and $0.48^{\circ}C/W$(natural convection). The radiant heat performance of heat sink was increased with increasing the height of fin and the width of fin pitch.

• Journal of Power System Engineering
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• v.10 no.4
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• pp.65-70
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• 2006

This study is to experimentally evaluate the cooling performance of the Bonding type and Injection type of heat sink using three different kinds of industrial Peltier module by digital LabViewTM measurement. Injection type of heat sink could be more efficient for the heat transfer than Bonding type, even with 30% more radiating surface area. In addition, the experimental results revealed that the sufficient power supplied was able to show the better cooling performance of Peltier module. In order to verify the optimal cooling performance of the cooling device, two Peltier module, HMN 6040 and HMN 1550 with Bonding and Injection type of heat sink were used. The cooling performance with injection type of heat sink was 2.11% and 6.24% better than that with bonding type of heat sink under the HMN 6040 and HMN 1550, respectively.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.13 no.2
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• pp.73-79
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• 2001

Experiment were carried out to investigate the heat transfer characteristics of an aluminum foam block as a porous heat sink on a heat source by a vertical air jet impingement that can be applied for electronics cooling. The performance of the aluminum foam heat sink was evaluated by the convective heat transfer coefficient on the heat source. At a fixed porosity, pore density ($\beta$) of the foam and Reynolds number Re were varied in the range of $\beta$a=10, 20, 40 PPI(Pore Per Inch) and $850\leqRe\leq25000$. A nozzle diameter and the nozzle-to-plate spacing were also varied. It was found that the convective heat transfer was enhanced by the aluminum foam heat sink with lower pore density due to relatively intensified flow through the foam block. The aluminum foam block with much reduced weight shows slightly better performance with larger Nusselt number, compared with the convectional heat sink.

• KIPS Transactions on Computer and Communication Systems
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• v.6 no.1
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• pp.1-8
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• 2017

Communications for mobile sink groups such as rescue teams or platoons bring about a new challenging issue for handling mobility in wireless sensor networks. To do this, many studies have been proposed to support mobile sink groups. When closely looking at mobile sink groups, they can be divided into (multiple) small groups according to the property of applications. For example, a platoon can be divided into multiple squads to carry out its mission in the battle field. However, the previous studies cannot efficiently support the division of mobile sink groups because they do not address three challenging issues engendered by the mobile sink group division. The first issue is to select a leader sink for a new small mobile sink group. The efficient data delivery from a source to small mobile sink groups is the second issue. Last, the third issue is to share data between leader sinks of small mobile sink groups. Thus, this paper proposes a routing protocol to efficiently support the division of mobile sink groups by solving the three challenging issues. For the first issue, the proposed protocol selects a leader sink of a new small mobile sink group which provide a minimum summation of the distance between the new leader sink and the previous leader sink and the distance from the new leader sink to all of its member sinks. For the efficient data delivery from a source to small mobile sink groups in the second issue, the proposed protocol determines the path to minimize the data dissemination distance from source to small mobile sink group by calculating with the location information of both the source and the leader sinks. With regard to the third issue, the proposed protocol exploits member sinks located among leader sinks to provide efficient data sharing among leaders sinks by considering the location information of member sinks. Simulation results verified that the proposed protocol is superior to the previous protocol in terms of the energy consumption.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.9
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• pp.1-6
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• 2009

We fabricated Gunn diodes with a double heat sink which has anode heat sink as well as cathode heat sink for efficient heat dissipation. We compared the DC characteristics of a double heat sink diode with a conventional cathode heat sink Gunn diode. It was shown that the Gunn diode with a single heat sink has the threshold voltage of 3 V, the peak current of 744 mA and the breakdown voltage of 4.8 V. Also, the Gunn diode with a double heat sink showed the threshold voltage of 2.5 V, the peak current of 778 mA and the breakdown voltage over 5 V.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.41 no.11
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• pp.1431-1439
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• 2016

In this paper, we propose a new location service and location-based routing for data dissemination from a source to a mobile group sink in less energy consumption of the sensor node. Unlike the existing protocols, the proposed protocol uses a leader sink instead of a group area as the location information to represent a mobile sink group. The proposed protocol also uses grid leaders on virtual grid structure to support sink mobility in location service. By using a leader sink as a representative and grid leaders for mobility supporting, the proposed protocol can exploit an efficient hierarchical location service and data dissemination method without using flooding. Accordingly, the proposed protocol carries out upper layer location services and data dissemination between a leader sink and a source and lower layer location services and data dissemination between the leader sink and member sinks. Simulation results demonstrate that the proposed protocol achieves energy-efficiency.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.4
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• pp.61-68
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• 2013

As an advance study for the development of a heat sink for special purpose high power illumination, an investigation was made to find feasibility for the application of copper plated EP to a heat sink of small LED light of less than 10W installed in commercial product. In this study, the plated heat sink with EP copper was fabricated for the conventional LED light. It was used actually for finding heat radiation property and effectiveness of the heat sink accompanied with measurement of luminous intensity. The heat is radiated by transfer and dissipation only through the copper plated surface due to extremely low heat conductivity of EP in case of EP heat sink; however the total area of the plate plays the function of heat transfer as well as heat radiation in case of the aluminum heat sink. It seems that the volume difference of heat radiating material is so big that the temperature $P_1$ is 9.0~12.3% higher in 3W and 42.7~54.0% higher in case of 6W volume difference of heat radiating material is so big that the temperature $P_1$ is 9.0~12.3% higher in 3W and 42.7~54.0% higher in case of 6W even though heat transfer rate of copper is approximately 1.9 times higher than that of aluminum. It was thought that this is useful to utilize for heat sink for low power LED light with the low heating rate. Also, the illumination could be greatly influenced by the surrounding temperature of the place where it is installed. Therefore, it seems that the illumination installation environment must be taken into consideration when selecting illumination. Further study was expected on order to aims at development of an exterior surface itself made into heat radiation plate by application of this technology in future.

• Smart Structures and Systems
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• v.11 no.3
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• pp.261-282
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• 2013

Structural health monitoring (SHM) is an application area of Wireless Sensor Networks (WSNs) which usually needs high data communication rate to transfer a large amount of monitoring data. Traditional sink node can only process data from one communication channel at the same time because of the single radio chip structure. The sink node constitutes a bottleneck for constructing a high data rate SHM application giving rise to a long data transfer time. Multi-channel communication has been proved to be an efficient method to improve the data throughput by enabling parallel transmissions among different frequency channels. This paper proposes an 8-radio integrated sink node design method based on Field Programmable Gate Array (FPGA) and the time synchronization mechanism for the multi-channel network based on the proposed sink node. Three experiments have been performed to evaluate the data transfer ability of the developed multi-radio sink node and the performance of the time synchronization mechanism. A high data throughput of 1020Kbps of the developed sink node has been proved by experiments using IEEE.805.15.4.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.5
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• pp.2002-2008
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• 2012

In recent years, while the importance of thermal management has been emphasized due to smaller electronic products, various materials have been used as heat sink. In this study, porous ceramic heat sink was developed with SiC, successfully separated from the slurry of SiC occurring in solar energy materials industry and the thermal performance of porous SiC heat sink has been compared with those of aluminum heat sink and pure SiC heat sink through experiment. From the experimental results, it was verified that porous recycled SiC heat sink has better thermal performance than aluminum heat sink since its micropores increase the heat transfer area. In addition, the effect of the micropores on thermal performance has been quantified by increasing convective heat transfer coefficient with numerical analysis.