• Title/Summary/Keyword: singular thermal stress

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Relaxation of Singular Stress in Adhesively Bonded Joint at High Temperature

  • Lee, Sang Soon
    • Journal of the Semiconductor & Display Technology
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    • v.17 no.1
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    • pp.35-39
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    • 2018
  • This paper deals with the relaxation of singular stresses developed in an epoxy adhesive at high temperature. The interface stresses are analyzed using BEM. The adhesive employed in this study is an epoxy which can be cured at room temperature. The adhesive is assumed to be linearly viscoelastic. First, the distribution of the interface stresses developed in the adhesive layer under the uniform tensile stress has been calculated. The singular stress has been observed near the interface corner. Such singular stresses near the interface corner may cause epoxy layer separated from adherent. Second, the interfacial thermal stress has been investigated. The uniform temperature rise can relieve the stress level developed in the adhesive layer under the external loading, which can be viewed as an advantage of thermal loading. It is also obvious that temperature rise reduces the bonding strength of the adhesive layer. Experimental evaluation is required to assess a trade-off between the advantageous and deleterious effects of temperature.

Singular Stress Field Analysis and Strength Evaluation in Ceramic/Metal Joints (세라믹/금속접합제의 응력특이장 해석 및 강도평가)

  • 박영철;한근조;허선철;강재욱
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1997.04a
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    • pp.470-474
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    • 1997
  • Since the ceramic/metal joints is joined at high temperature, the residual stress will develop during when cooled from bonding temperature due to remarkable difference of thermal expansion coefficient between creamic and metal. Moreover, the edge of jointed interface makes singular stress field in the ceramic/metal joints and this singular stress field much influences on the strength of joints. In this study, The influence of residual stress, mechanical load and repeat thermal sysle was estimated in the ceramic/metal joints. According to this influence, the change of singular stress field was analyed and then strength test, X-ray measurement are performed.

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Boundary element analysis of singular thermal stresses in a unidirectional laminate

  • Lee, Sang Soon;Kim, Beom Shig
    • Structural Engineering and Mechanics
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    • v.5 no.6
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    • pp.705-713
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    • 1997
  • The residual thermal stresses at the interface corner between the elastic fiber and the viscoelastic matrix of a two-dimensional unidirectional laminate due to cooling from cure temperature down to room temperature were studied. The matrix material was assumed to be thermorheologically simple. The time-domain boundary element method was employed to investigate the nature of stresses on the interface. Numerical results show that very large stress gradients are present at the interface corner and this stress singularity might lead to local yielding or fiber-matrix debonding.

Boundary Element Analysis of Singular Residual Thermal Stresses in A Fiber-Reinforced Unifirectional Viscoelastic Laminate (섬유가 보강된 단일방향 점탄성 복합재료에 발생하는 특이 잔류 열응력의 경계요소해석)

  • 이상순;박준수
    • Computational Structural Engineering
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    • v.9 no.4
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    • pp.181-187
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    • 1996
  • This paper concerns the singular thermal stresses at the interface corner between the elastic fiber and the viscoelastic matrix of a two-dimensional unidirectional laminate model induced during cooling from cure temperature down to room temperature. Time-domain boundary element method is employed to investigate the nature of residual thermal stresses at the interface. Numerical results show that very large stress gradients are present at the interface corner and such stress singularity might lead to local yielding or fiber-matrix debonding.

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Thermal Stresses in a Laminated Fiber-Reinforced Composite Containing an Interlaminar Crack Under a Uniform Heat Flow (층간균열이 존재하는 균일 열유동하의 섬유강화 적층복합재료의 열응력해석)

  • 최형집;오준성;이강용
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.18 no.4
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    • pp.887-902
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    • 1994
  • Within the framework of anisotropic thermoelasticity, the problem of an interlaminar crack in a laminated fiber-reinforced composite subjected to a uniform heat flow is investigated. Under a state of generalized plane deformation, dissimilar anisotropic half-spaces with different fiber orientations are considered to be bound together by a matrix interlayer containing the crack. The interlayer models the matrix-rich interlaminar region of the fibrous composite laminate. Based on the flexibility/stiffness matrix approach, formulation of the current crack problem results in having to solve two sets of singular integral equations for temperature and thermal stress analyses. Numerical results are obtained, illustrating the parametric effects of laminate stacking sequence, relative crack size, crack location, crack surface partial insulation, and fiber volume fraction on the values of mixed mode thermal stress intensity factors.

Some Studies on Stress field in Dissimilar Materials

  • Katsuhiko Watanabe
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1996.11a
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    • pp.631-635
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    • 1996
  • Stress singularities appear at the interface edge in dissimilar materials also under thermal loading. First, these singularities then an interface meets a free side surface with an arbitrary angle are studied for a two-dimensional problem. The singular properties under thermal loading are made clear and the concrete singular field are obtained. Secondly, the dependence of stress field on elastic constants in axisymmetric dissimilar materials are. discussed. That is, it is shown that three elastic constants mutually independent are necessary, in general, to characterize the stress field of axisymmetric dissimilar materials, although Dunders' parameters defined for two-dimensional dissimilar materials have been often applied correspondingly also to axisymmetric problems.

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Stress distribution of near the interface on high temperature fatigue in ceramic/metal bonded joints (세라믹/금속접합재의 고온피로에 따른 접합계면의 응력분포)

  • 박영철;허선철;윤두표;김광영
    • Journal of Ocean Engineering and Technology
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    • v.10 no.2
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    • pp.106-119
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    • 1996
  • The ceramic has various high mechanical properties such as heat, abrasion, corrosion resistance and high temperature strength compared with metal. It also has low speciffic weight, low thermal expansibillity, low thermal conductivity. However, it could not be used as structural material since it is brittle and difficult for the machining. Therefore, there have been many researches to attempt to join ceramic with metal which is full of ductillity in order to compensate the weakness of ceramic.The problem is that residual stress develops around the joint area while the ceramic/metal joint material is cooled from high joining temperature to room temperature due to remarkable difference of thermal expansion coefficients between ceramic and metal. Especially, the residual stress at both edges of the specimen reduces the strngth of joint to a large amount by forming a singular stress field. In this study, two dimensional finite element method is attempted for the thermal elastic analysis. The joint residual stress of ceramic/metal developed in the cooling process is investigated and the change of joint residual stress resulted from the repetitive heat cycle is also examined. In addition, it is attempted to clarify the joint stress distribution of the case of tensile load and of the case of superposition of residual stress and actual loading stress.

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Study on the Behavior of a Center Crack under Thermal Impact by the Dislocation Theory (전위이론에 의한 열충격하의 균열거동에 관한 연구)

  • Cho, Chong-Du;Ahn, Soo-Ick
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.20 no.10
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    • pp.3408-3414
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    • 1996
  • This paper investigated plane strain stress intensity factors caused by thermal impact on a center-crack strip. The crack was aligned perpendicularly to the strip boundary. The problem was analysed by determining the dislocation density function in the singular integral equations formulated by the dislocation theory. Under the abrupt temperature change along the edge, the center crack behaved as a mode I crack due to the symmetric geometry. The value of maximum stress intensity factor monotonically increased until the ratio of dimensionless crack length approached to about 0.3, followed by gradual decrease. As a result, a critical corresponding crack length was determined.

Analysis of Thermal Stresses Induced in Polymeric Thin Layer Due to Temperature Change (온도변화로 인해 고분자 박막에 발생하는 열응력 해석)

  • 이상순
    • Proceedings of the Computational Structural Engineering Institute Conference
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    • 2002.10a
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    • pp.146-152
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    • 2002
  • In this study, the singular thermal stresses induced during cooling down from high temperature to room temperature have been analyzed for the viscoelastic thin layer. The time domain boundary element method has been employed to investigate the behavor of stresses for the whole interface. Within the context of a linear viscoelastic theory, a stress singularity exists at the point where the interface between the elastic substrate and the viscoelastic thin layer intersects the free surface.

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Multi-Crack Problems for Non-homogeneous Material Subjected to Unsteady Thermal Load (비정상 열 하중을 받는 이질재료의 다중 크랙 문제)

  • Kim, Kui-Seob
    • Journal of the Korean Society for Aviation and Aeronautics
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    • v.19 no.1
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    • pp.15-23
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    • 2011
  • The purpose of this paper is to investigate the time behavior of a multiple crack problems. It is assumed that the medium contains cracks perpendicular to the crack surfaces, that the thermo-mechanical properties are continuous functions of the thickness coordinate. we use the laminated composite plate model to simulate the material non-homogeneity. By utilizing the Laplace transform and Fourier transform techniques, the multiple crack problems in the non-homogeneous medium is formulated. Singular integral equations are derived and solved to investigate the multiple crack problems. As a numerical illustration, transient thermal stress intensity factors(TSIFs) for a functionally graded material plate subjected to sudden heating on its boundary are provided. The variation in the TSIFs due to the change in material gradient and the crack position is studied.