• 제목/요약/키워드: simple module

검색결과 522건 처리시간 0.024초

ON A CLASS OF PERFECT RINGS

  • Olgun, Arzu;Turkmen, Ergul
    • 호남수학학술지
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    • 제42권3호
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    • pp.591-600
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    • 2020
  • A module M is called ss-semilocal if every submodule U of M has a weak supplement V in M such that U∩V is semisimple. In this paper, we provide the basic properties of ss-semilocal modules. In particular, it is proved that, for a ring R, RR is ss-semilocal if and only if every left R-module is ss-semilocal if and only if R is semilocal and Rad(R) ⊆ Soc(RR). We define projective ss-covers and prove the rings with the property that every (simple) module has a projective ss-cover are ss-semilocal.

이동 통신 단말용 센서 시스템을 위한 신호 잠금 방식의 검출 회로 (Signal lock-in detection circuit for mobile device sensor systems)

  • 정인일;손호현;최영환
    • 한국정보통신설비학회:학술대회논문집
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    • 한국정보통신설비학회 2008년도 정보통신설비 학술대회
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    • pp.559-562
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    • 2008
  • In this paper we propose a lock-in detection method for portable sensor systems and demonstrate with the portable detection module that has high sensitivity and robustness against the noise. The simple portable sensor module is manufactured using MCU(Micro Contorl Unit), OPAMP, MOSFET and a pair of infrared sensor. Manufactured sensor module is testified in the noisy environment caused by an external light and an white noise source. Without any type of band pass filters, we recover a signal of 33 $mV_{p-p}$ in 80 $mV_{p-p}$ white noise and get the DR(Dynamic Reserve) of 14 dB.

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복합 사이클 코드 지령 방식의 다중곡면 가공을 위한 실시간 곡면 보간기 (Real-Time Surface Interpolator for Multiple Surface Machining Based on a Surface Cycle Command)

  • 구태훈;지성철
    • 한국정밀공학회지
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    • 제24권8호통권197호
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    • pp.97-107
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    • 2007
  • The present CNC machining system if without any CAM software has been limited to 2D or 2.5D plane cut using lines, arcs and curves. If the CNC is equipped with a surface interpolation module and a surface reorganizing module inside it, we can easily try 3D surface machining without aid of CAM software. The existing NURBS surface interpolator is simple and direct to use for a unit surface. However, it enables only machining of each reference surface individually even when machining a simple composite surface. In this paper, we propose a method which can unify and reorganize various reference surfaces with a newly defined NURBS surface cycle command: a multi-repetitive cycle command such as in a CNC turning center. We also introduce a reorganizing rule for reference surfaces using NURBS properties. The usefulness of the proposed method is verified through computer simulation.

A Low-Crosstalk Design of 1.25 Gbps Optical Triplexer Module for FTTH Systems

  • Kim, Sung-Il;Park, Sun-Tak;Moon, Jong-Tae;Lee, Hai-Young
    • ETRI Journal
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    • 제28권1호
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    • pp.9-16
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    • 2006
  • In this paper, we analyzed and measured the electrical crosstalk characteristics of a 1.25 Gbps triplexer module for Ethernet passive optical networks to realize fiber-tothe-home services. Electrical crosstalk characteristic of the 1.25 Gbps optical triplexer module on a resistive silicon substrate should be more serious than on a dielectric substrate. Consequently, using the finite element method, we analyze the electrical crosstalk phenomena and propose a silicon substrate structure with a dummy ground line that is the simplest low-crosstalk layout configuration in the 1.25 Gbps optical triplexer module. The triplexer module consists of a laser diode as a transmitter, a digital photodetector as a digital data receiver, and an analog photodetector as a cable television signal receiver. According to IEEE 802.3ah and ITU-T G.983.3, the digital receiver and analog receiver sensitivities have to meet -24 dBm at $BER=10^{-12}$ and -7.7 dBm at 44 dB SNR. The electrical crosstalk levels have to maintain less than -86 dB from DC to 3 GHz. From analysis and measurement results, the proposed silicon substrate structure that contains the dummy line with $100\;{\mu}m$ space from the signal lines and 4 mm separations among the devices satisfies the electrical crosstalk level compared to a simple structure. This proposed structure can be easily implemented with design convenience and greatly reduce the silicon substrate size by about 50 %.

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밀폐공간 내에서 압전세라믹 냉각홴의 열성능에 대한 실험적 연구 (Experimental Study on the Thermal Performance of Piezoelectric Fan in an Enclosure)

  • 박상희;최문철
    • 대한기계학회논문집B
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    • 제30권12호
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    • pp.1173-1180
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    • 2006
  • This study deals with fluid flow and heat transfer around a module cooled by forced air flow generated by a piezoelectric(PZT) fan in an enclosure. The fluid flows were generated by a flexible PZT fan which deflects inside a fluid transport system of comparatively simple structure mounted on a PCB in an enclosure($270\times260\times90mm^3$). Input voltages of 30V and 40V, and a resonance frequency of 28Hz were used to vibrate the cooling fan. Input power to the module was 4W. The height in an enclosure was changed 23$\sim$43mm. The fluid flow around the module was visualized by using PIV system. The temperature distributions around a heated module were visualized by using liquid crystal film. As the height in an enclosure and the input voltage of PZT fan increased, the cooling effect of module using a PZT fan increased. We found that the flow type was T- or Y-shape and the cooling effect was increased by the wake generated by a PZT fan.

압전세라믹 냉각홴에 의한 강제 공랭 모듈 주위의 열전달특성 (Heat Transfer Characteristics Around a Surface-Mounted Module Cooled by Piezoelectric Fan)

  • 박상희;박규진;최성대
    • 대한기계학회논문집B
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    • 제28권7호
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    • pp.780-788
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    • 2004
  • This paper reports the fluid flow and heat transfer around a module cooled by forced air flow generated by a piezoelectric(PZT) cooling fan. The fluids are locally accelerated by a flexible PZT fan which deflects inside a fluid transport system of comparatively simple structure mounted on a PCB in a parallel-plate channel(450${\times}$80${\times}$700㎣). Input voltages of 20-100V and a resonance frequency of 23㎐ were used to vibrate the cooling fan. Input power to the module was 4W. The fluid flow around the module was visualized by using PIV system. The temperature distributions around a heated module were visualized by using liquid crystal film(LCF). The cooling effect using a PZT fan was independent of the vent area ratios at the channel inlet and was similar to the forced convection cooling. We found that the flow type was Y-shape and the cooling effect was increased by the wake generated by a piezoelectric cooling fan.

고속 네트워크 시스템의 이중화 회로 구현 (Implementation of High Speed Router's Redundancy Architecture)

  • 강덕기;이상우;이준철;이형섭;이영천
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2000년도 추계종합학술대회 논문집(1)
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    • pp.267-270
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    • 2000
  • In this paper, we consider the simple redundant structures with the function of hardware based active/standby control. The system includes two switch modules. The switch module is connected to a data bus, but only the active switch module has control of the data bus. The standby unit takes over the function of the active unit when the active unit failure or mode command are asserted. And this paper illustrate the high-speed router system and the overall redundant system architecture. The proposed redundant architecture for 80G Router system is verified and implemented with experiment.

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ON THE EXTENSION DIMENSION OF MODULE CATEGORIES

  • Peng, Yeyang;Zhao, Tiwei
    • 대한수학회지
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    • 제57권6호
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    • pp.1389-1406
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    • 2020
  • Let Λ be an Artin algebra and mod Λ the category of finitely generated right Λ-modules. We prove that the radical layer length of Λ is an upper bound for the radical layer length of mod Λ. We give an upper bound for the extension dimension of mod Λ in terms of the injective dimension of a certain class of simple right Λ-modules and the radical layer length of DΛ.

반도체 제조 장비를 위한 개방형 제어기 플랫폼 설계 (A Design of an Open Architectural Controller Platform for Semiconductor Manufacturing Equipment)

  • 장성진;김홍록;서일홍
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 2000년도 제15차 학술회의논문집
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    • pp.290-290
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    • 2000
  • This paper presents some ideas about an open architectural controller platform for semiconductor manufacturing equipment First, we proposed modular-typed software architecture. Each module is composed of commands and status sets. Second, common bus protocol is suggested in order to communicate with other modules. It is designed with visual c++ programming. Finally, job program is consisted of simple commands and status. Consequently, Controllers are easily developed with some required modular assembling.

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