• Journal of Information Display
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• v.10 no.3
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• pp.117-120
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• 2009

A new crystallization method for amorphous silicon, called selective area heating (SAH), was proposed. The purpose of SAH is to improve the reliability of amorphous silicon films with extremely low thermal budgets to the glass substrate. The crystallization time shortened from that of the conventional solid-phase crystallization method. An isolated thin heater for SAH was fabricated on a quartz substrate with a Pt layer. To investigate the crystalline properties, Raman scattering spectra were used. The crystalline transverse optic phonon peak was at about 519 $cm^{-1}$, which shows that the films were crystallized. The effect of the crystallization time on the varying thickness of the $SiO_2$ films was investigated. The crystallization area in the 400nm-thick $SiO_2$ film was larger than those of the $SiO_2$ films with other thicknesses after SAH at 16 W for 2 min. The results show that a $SiO_2$ capping layer acts as storage layer for thermal energy. SAH is thus suggested as a new crystallization method for large-area electronic device applications.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2001.11a
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• pp.68-68
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• 2001

Thin films of polycrystalline silicon (poly-Si) is a promising material for use in large-area electronic devices. Especially, the poly-Si can be used in high resolution and integrated active-matrix liquid-crystal displays (AMLCDs) and active matrix organic light-emitting diodes (AMOLEDs) because of its high mobility compared to hydrogenated _amorphous silicon (a-Si:H). A number of techniques have been proposed during the past several years to achieve poly-Si on large-area glass substrate. However, the conventional method for fabrication of poly-Si could not apply for glass instead of wafer or quartz substrate. Because the conventional method, low pressure chemical vapor deposition (LPCVD) has a high deposition temperature ($600^{\circ}C-1000^{\circ}C$) and solid phase crystallization (SPC) has a high annealing temperature ($600^{\circ}C-700^{\circ}C$). And also these are required time-consuming processes, which are too long to prevent the thermal damage of corning glass such as bending and fracture. The deposition of silicon thin films on low-cost foreign substrates has recently become a major objective in the search for processes having energy consumption and reaching a better cost evaluation. Hence, combining inexpensive deposition techniques with the growth of crystalline silicon seems to be a straightforward way of ensuring reduced production costs of large-area electronic devices. We have deposited crystalline poly-Si thin films on soda -lime glass and SiOz glass substrate as deposited by PVD at low substrate temperature using high power, magnetron sputtering method. The epitaxial orientation, microstructual characteristics and surface properties of the films were analyzed by TEM, XRD, and AFM. For the electrical characterization of these films, its properties were obtained from the Hall effect measurement by the Van der Pauw measurement.

• Particle and aerosol research
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• v.5 no.2
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• pp.83-90
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• 2009

This paper describes a condensation-evaporation method (CEM) to produce size-controlled spherical silver nanoparticles by perturbing coagulation and coalescence processes in the gas phase. Polydisperse silver nanoparticles generated by the CEM were first introduced into a differential mobility analyzer (DMA) to select a group of silver nanoparticles with same electrical mobility, which also enables to make a group of nanoparticles with elongated structures and same projected area. These silver nanoparticles selected by the DMA were then in-situ sintered at ${\sim}600^{\circ}C$, and then they were observed to turn into spherical shaped nanoparticles by the rapid coalescence process. With the assistance of modified converging-typed quartz reactor, we can also produce the 10 times higher number concentration of silver nanoparticles compared with a general quartz reactor with uniform diameter. Finally, the spherical silver nanoparticles with 30 nm were electrostatically deposited on the surface of silicon substrate with the coverage rate of ~4%/hr. This useful preparation method of size-controlled monodisperse silver nanoparticles developed in this work can be applied to the various studies for characterizing the physical, chemical, optical, and biological properties of nanoparticles as a function of their size.

• Resources Recycling
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• v.15 no.5 s.73
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• pp.11-16
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• 2006

A novel microwave-induced pyrolysis was used for the recovery of valuable products from waste polystyrene in motor oil. Quartz tube was introduced as microwave reactor and silicon carbide was used as the microwave absorbent. In the experiments, different pyrolysis conditions were applied, such as time range from 30 minutes to 1 hour and microwave input power range from 180 to 250W. The distillate products from pyrolysis were analyzed with GC/MS. Styrene, 1-methyl styrene, toluene, ethyl benzene were the four main products. Styrene recovery rate from polystyrene was around 50%. Temperature for the complete pyrolysis using microwave was around $300^{\circ}C$ which is much lower than that of conventional thermal pyrolysis.

• Korean Journal of Crystallography
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• v.7 no.1
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• pp.81-87
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• 1996

The mechanism of silicon incorporation has been analyzed for the boat-grown GaAs crystals on the basis of phase equilibrium in the Ga and As system. Comparison was made between silicon concentrations calculated from the thermodynamics of incorporation reaction and carrier concentrations measured from van der Pauw method. For the 1-T HB(single temperature zone horizontal Bridgman) crystals, calculated concentrations were 5.3 ×10 15 (atoms/cm3), measured as 9.8 ×10 15(/cm3) at the seed part. They were calculated to be 1.1 ×10 16(atoms/cm3) and measured as 1.5 ×10 16(/cm3) for the 2-T(double temperature zone) HB crystals. On the other hand, it was found to be closer between the calculated and measured silicon concentrations for the VGF(vertical gradient freeze) crystals, which were grown within half the run time compared with 1-T or 2-T HB method.

• Proceedings of the KIEE Conference
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• 1991.11a
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• pp.299-303
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• 1991

A lamp heated LPCVD equipment has been made. Wafer is heated by an array of fifteen tungsten halogen lamps above the front side of a wafer and pyrometer views the back side of the wafer through $CaF_2$ window. Reactor which consisits of a quartz window and a water cooled-stainless steel plate can be evacuated to $5{\times}10^{-3}$ torr with a rotary vane pump. By pyrolysis of $SiH_4$ at about $600^{\circ}C$, polysilicon has been formed on the silicon dioxide film. The measured results show that thickness nonuniformity is 15% and temperature nonuniformity is 1.1%. Because activation energy of pyrolysis of $SiH_4$ is very high, about 1.8eV, small temperature variation will induce large thickness nonuniformity. The main cause of temperature nonuniformity is unsymmetry of lamp power and an unbalanced cooling structure. Charls & Evans' SIMS result shows that the oxygen content in the deposited polysilicon is comparable to that of silicon substrate but carbon content is ten times higher.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.80-80
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• 2018

실리콘 관통전극 (Through Silicon Via, TSV)는 메모리 칩을 적층하여 고밀도의 집적회로를 구현하는 기술로, 기존의 와이어 본딩 (Wire bonding) 기술보다 낮은 소비전력과 빠른 속도가 특징인 3차원 집적기술 중 하나이다. TSV는 일반적으로 도금 공정을 통하여 충전되는데, 고종횡비의 TSV에 결함 없이 구리를 충전하기 위해서 3종의 유기첨가제(억제제, 가속제, 평탄제)가 도금액에 첨가되어야 한다. 이러한 첨가제 중 결함 발생유무에 가장 큰 영향을 주는 첨가제는 평탄제이기 때문에, 본 연구에서는 이미다졸(imidazole) 계열, 이민(imine) 계열, 디아조늄(diazonium) 계열 및 피롤리돈(pyrrolidone) 계열과 같은 평탄제(leveler)의 작용기에 따라 TSV 충전 성능을 조사하였다. TSV 충전 시 관능기의 거동을 규명하기 위해 QCM (quartz crystal microbalance) 및 EQCM (electrochemical QCM)을 사용하여 흡착 정도를 측정하였다. 실험 결과, 디아조늄 계열의 평탄제는 TSV를 결함 없이 충전하였지만 다른 작용기를 갖는 평탄제는 TSV 내 결함이 발생하였다. QCM 분석에서 디아조늄 계열의 평탄제는 낮은 흡착률을 보이지만 EQCM 분석에서는 높은 흡착률을 나타내었다. 즉, 디아조늄 계열의 평탄제는 전기 도금 동안 전류밀도가 집중되는 TSV의 상부 모서리에서 국부적인 흡착을 선호하며 이로 인하여 무결함 충전이 달성된다고 추론할 수 있다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.32 no.4
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• pp.349-355
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• 2019

A fire, be it caused intentionally or unintentionally, leads to economic loss and physical damage, and requires digestion. The number of fires is increasing yearly, and electrical fires account for more than 30% among the main causes of fires. Electric wires that catch fire typically employ silicone coatings; silicone has organic as well as inorganic properties. Silicon is a natural, nonexistent, synthetic product with numerous applications. In this study, a silicon rubber for application in wires was prepared by high-temperature vulcanization (HTV) with a Shore A hardness of 70. We report results for the flame retardancy test and the fire safety characteristics via inorganic analysis. For this, a quartz inorganic material was added to the wire specimen, and 18% powdered extinguishing agent ammonium phosphate and expanded vermiculite respectively. Thus, expanded vermiculite showed the best flame retardancy and fire safety characteristics.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.10
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• pp.918-923
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• 1998

Poly-silicon thin film transistors were fabricated on quartz substrates by high temperature processes. Electrical characteristics were measured and compared for 3 transistor structures of Standard Inverted Gate(SIG), Lightly Doped Drain(LDD), and Dual Gate(DG). Leakage currents of DG and LDD TFT's were smaller that od SIG transistor, while ON-current of LDD transistor is much smaller than that of SIG and DG transistors. Temperature dependence of the leakage currents showed that SIG and DG TFT's had thermal generation current at small drian bias and Frenkel-Poole emission current at hight gate and drain biases, respectively. In case of LDD transistor, thermal generation was the dominant mechanism of leakage current at all bias conditions. It was found that the leakage current was closely related to the reduction of the electric field in the drain depletion region.

• Journal of Sensor Science and Technology
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• v.14 no.5
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• pp.343-349
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• 2005

Carbon nitride films were deposited on various substrates for humidity sensors with meshed electrode by reactive RF magnetron sputtering system. As the ratio of injected nitrogen was decreased, the sensitivity of sensor was increased. When the ratio of injected nitrogen was $50{\sim}70%$, the sample showed the best linearity. The sensor impedance changed from $95.4{\;}k{\Omega}$ to $2.1{\;}k{\Omega}$ in a relative humidity range of 5 % to 95 %. The humidity sensors based on silicon wafer revealed higher lineality and faster response than those of alumina or quartz substrates. The adsorption saturation time of the sample was about 80 sec, and its desorption time was about 90 sec.