• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2009년도 추계학술대회 논문집
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• pp.183-184
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• 2009

• Bulletin of the Korean Chemical Society
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• 제34권5호
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• pp.1331-1332
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• 2013

• JSTS:Journal of Semiconductor Technology and Science
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• 제5권1호
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• pp.24-29
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• 2005

Silicon nitride cantilevers integrated with silicon heaters and piezoelectric sensors were developed for the scanning probe microscope (SPM) based data storage application. These nitride cantilevers are expected to have better mechanical stability and uniformity of initial bending than the previously developed silicon cantilevers. Data bits of 40 nm in diameter were recorded on PMMA film and the sensitivity of the piezoelectric sensor was 0.615 fC/nm, meaning that indentations less than 20 nm in depth can be detected. For high speed operation, $128{\times}128$ cantilever array was developed.

• 한국세라믹학회지
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• 제42권8호
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• pp.525-531
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• 2005

Tailoring the microstructure and the composition of silicon nitride ceramics can have profound effects on their properties. Here it is shown that the grain growth behavior, in particular its anisotropy, is a function of the specific additives, which allow one to tune the microstructure from one consisting of more equiaxed grains to one with very elongated grains. Recent studies are discussed that provide an understanding of the atomic level processes by which these additives influence grain shapes. Next the microstructural (and compositional) parameters are discussed that can be used to modify the thermal conductivity, as well as fracture toughness of silicon nitride ceramics. As a result of the open <0001> channels in $\beta-Si_3N_4$, the c-axis conductivity can be exceptionally high. Thus, the formation of elongated c-axis grains, particularly when aligned can result in conductivity values approaching those of AlN ceramics. In addition, the controlled formation of elongated grains can also be used to significantly enhance the fracture toughness. At the same time, both properties are shown to be affected by the composition of the densification additives. Utilizing such understanding, one will be able to tailor the ceramics to achieve the properties desired for specific applications.

• 한국해양공학회지
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• 제23권5호
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• pp.32-38
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• 2009

Silicon nitride samples with aligned whisker seeds were prepared with different amounts of yttria and alumina as the sintering additives. Their sintering behaviors and the microstructural developments between $1850^{\circ}C$ and $2050^{\circ}C$ were examined. The sample with larger amount of the sintering additives showed faster densification and grain growth. Even though addition of the aligned whisker seeds slightly retarded densification of silicon nitride, it improved the flexural strength and the fracture toughness. Both the flexural strength and the fracture toughness of silicon nitride with the aligned whisker seeds were increased as the amount of the sintering additives was increased.

• 한국전기전자재료학회논문지
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• 제27권1호
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• pp.39-44
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• 2014

Silicon nitride thin film deposited with Plasma Enhanced Chemical Vapor Deposition was treated by a nitrogen plasma generated by Inductively Coupled Plasma at room temperature. The treatment was investigated by Fourier Transform Infrared Spectroscopy and Atomic Force Microscopy on the surface at various RF source powers at two RF bias powers. The amount of hydrogen was reduced and the surface roughness of the films was decreased remarkably after the plasma treatment. In order to understand the causes, we analyzed the plasma diagnostics by Optical Emission Spectroscopy and Double Langmuir Probe. Based on these analysis results, we show that the nitrogen plasma treatment was effective in the improving of the properties silicon nitride thin film for flexible display.

• 한국정밀공학회지
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• 제26권4호
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• pp.47-54
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• 2009

In the last few years, lasers have found new applications as tools for ceramic machining which is laser-assisted machining(LAM). LAM process for the machining of difficult-to-machine materials such as structural ceramics, has recently been studied on silicon nitride workpiece for a wide range of operating condition. However, there have been few studies on rake angle in LAM process. In this paper we analyzed difference of machinability between positive and negative rake angle in tools. We have obtained interesting results that we could eliminate chattering, lower specific cutting and cutting ratio in case of positive rake angle. The results suggest that positive rake angled tools can make more plastic deformation and stable cutting of silicon nitride in comparison with negative rake angled one.

• 대한기계학회논문집
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• 제17권6호
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• pp.1441-1455
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• 1993

본 연구에서는 최신기법에 의해서 제조된 HIP제 질화규소와 지르코니아를 실험재료로 하여 무윤활하에서의 미끄럼마찰·마멸실험을 수행하여 마찰·마멸특성을 규명하고, SEM을 이용한 마멸면의 미시적 관찰을 통해서 세라믹의 마멸기구를 조사하 여 세라믹마멸기구의 마멸모델을 제시하고자 한다. 제시된 마멸모델에서 파괴역학을 도입하여 이론해석과 고찰을 수행하여 보다 실용적인 세라믹의 마멸율울 평가할 수 있 는 새로운 무차원 파라메터를 제안하고자 한다.

• 한국레이저가공학회지
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• 제12권1호
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• pp.25-33
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• 2009

In laser-assisted machining (LAM), laser beam is used to locally increase the temperature of a workpiece and thus to enhance the machinability. In order to set the temperature of the material removal area of a workpiece at an optimal value, process parameters, such as laser power, feed rate, and rotational velocity, have to be carefully controlled. In this work, the effects of laser power and feed rate on the temperature distribution of a silicon nitride rotating at a constant velocity were experimentally investigated. Using a pyrometer, temperatures at various locations of the silicon nitride were measured both in circumferential and axial directions. The measured temperatures were fitted to a quadratic equation to approximate the temperature at the cutting location. The machining results showed that cutting force and tool wear were decreased when the temperature at the cutting location was increased.

• 한국세라믹학회지
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• 제46권5호
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• pp.478-483
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• 2009

Thermal shock and hot corrosion resistance of silicon nitride ceramics are investigated in this study. Silicon nitrides are fabricated by nitride pressureless sintering (NPS) process, which process is the continuous process of nitridation reaction of Si metal combined with subsequent pressureless sintering. The results of thermal shock test show it sustains 400MPa of initial strength during test in the designated condition of ${\Delta}T=700{\sim}25^{\circ}C$ up to maximum 4,800 cycles. Hot corrosion tests also reveal that the strength degradation of NPS silicon nitride did not occur at $700^{\circ}C$ with an exposure in Ar, $H_2$, Na and K for 1,275 h.