• 제목/요약/키워드: silicon sensor

검색결과 532건 처리시간 0.025초

비정질 실리콘 희생층을 이용한 니켈산화막 볼로미터 제작 (Fabrication of Nickel Oxide Film Microbolometer Using Amorphous Silicon Sacrificial Layer)

  • 김지현;방진배;이정희;이용수
    • 센서학회지
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    • 제24권6호
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    • pp.379-384
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    • 2015
  • An infrared image sensor is a core device in a thermal imaging system. The fabrication method of a focal plane array (FPA) is a key technology for a high resolution infrared image sensor. Each pixels in the FPA have $Si_3N_4/SiO_2$ membranes including legs to deposit bolometric materials and electrodes on Si readout circuits (ROIC). Instead of polyimide used to form a sacrificial layer, the feasibility of an amorphous silicon (${\alpha}-Si$) was verified experimentally in a $8{\times}8$ micro-bolometer array with a $50{\mu}m$ pitch. The elimination of the polyimide sacrificial layer hardened by a following plasma assisted deposition process is sometimes far from perfect, and thus requires longer plasma ashing times leading to the deformation of the membrane and leg. Since the amorphous Si could be removed in $XeF_2$ gas at room temperature, however, the fabricated micro-bolomertic structure was not damaged seriously. A radio frequency (RF) sputtered nickel oxide film was grown on a $Si_3N_4/SiO_2$ membrane fabricated using a low stress silicon nitride (LSSiN) technology with a LPCVD system. The deformation of the membrane was effectively reduced by a combining the ${\alpha}-Si$ and LSSiN process for a nickel oxide micro-bolometer.

유기 가스 검지를 위한 다공질 실리콘층의 전기 저항 의존성 (Dependence of Electrical Resistance in Porous Silicon Layer for Detecting Organic Vapors)

  • 박광열;김성진;이상훈;최복길
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2002년도 하계학술대회 논문집 Vol.3 No.2
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    • pp.792-796
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    • 2002
  • In this work, porous silicon(PS) layer is used as a sensing material to detect organic gases. To do this, PS sensors with membrane structure are fabricated. The sensors were made by applying the technologies of membrane formation by anisotropic etching of silicon, and PS layer formation by anodization in HF solution. From fabricated sensors, current-voltage (I-V) curves were measured against ethanol (called alcohol), methanol and acetone gases evaporated from 0.1 to 0.5% solution concentrations at $36^{\circ}C$. As the result, all curves showed rectifying behavior due to a diode structure between Si and PS, and the conductance of sensor devices increased largely with the organic solution concentration at high voltage of 5V.

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휘발성 유기화합물 탐지용 다공성 실리콘 Microcavity 센서 (Porous Silicon Microcavity Sensors for the Detection of Volatile Organic Compounds)

  • 박철영
    • 통합자연과학논문집
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    • 제2권3호
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    • pp.211-214
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    • 2009
  • A new porous silicon (PSi) microcavity sensor for the detection of volatile organic compounds (VOCs) was developed. PSi microcavity sensor exhibiting unique reflectivity was successfully obtained by an electrochemical etching of silicon wafer. When PSi was fabricated into a structure consisting of two high reflectivity muktilayer mirrors separated by an active layer, a microcavity was formed. This PSi microcavity is very sensitive structures. Reflection spectrum of PSi microcavity indicated that the full-width at half-maximum (FWHM) was of 10 nm and much narrower than that of fluorescent organic molecules or quantum dot. The detection of volatile organic compounds (VOCs) using PSi microcavity was achieved. When the vapor of VOCs condensed in the nanopores, the refractive indices of entire particle increased. When PSi microcavity was exposed to acetone, ether, and toluene, PSi microcavity in reflectivity was red shifted by 28 nm, 33 nm, and 20 nm for 2 sec, respectively.

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박막구조를 가진 폴리실리콘 압저항형 습도센서의 연구 (Study on Piezoresistive Humidity Sensor using Polycrystalline Silicon with Membrane)

  • 박성일;박새광
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1994년도 하계학술대회 논문집 C
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    • pp.1422-1424
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    • 1994
  • This paper deals with piezoresistive humidity sensor using polycrystalline silicon (Poly-Si ) with membrane in sensors of semiconductor. Poly-Si piezoresistors which have no temperature dependancy are deposited on silicon wafer, membrane is formed with micromachining technology, then polyimide is formed as a hygroscopic layer. Whereas the principle of conventional humidify sensors are based on the change in electrical properties of the material, the humidity induced volume change of a polyimide layer leads to a deformation of a silicon membrane in this case. This deformation is transformed into an output voltage by Poly-Si piezoresistive. Wheatstone bridge. Fabricated piezoresistive humidity sensors showed good linearity, response time, and long term stability.

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수중 내 베타선 모니터링 센서 개발을 위한 기초연구 (Feasibility Study on Development of an Underwater Beta-ray Monitoring Sensor)

  • 박혜민;주관식
    • 센서학회지
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    • 제25권5호
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    • pp.333-336
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    • 2016
  • In this study, a beta monitoring sensor was developed as a part of basic research for quantitative beta monitoring underwater, and its performance was evaluated using a calibration source. A beta detection sensor was manufactured by using SiPM(silicon photomultiplier) and $CaF_2$:Eu, YAG:Ce, YAP:Ce scintillator. A large-area light guide was introduced to improve beta-ray detection efficiency. As calibration sources, the Beta source $^{90}Sr$, which is the main fission product of a nuclear accident, and the gamma source $^{137}Cs$ are used. In the performance evaluation, it is confirmed that scintillator $CaF_2:Eu$ gives the highest beta-ray detection response. Compared to gamma ray, beta-ray detection responsivity and detection efficiency are verified. Therefore, this study is expected to contribute to basic research in the development of an underwater beta-ray monitoring system.

실리콘 저항형 압력센서의 온도 보상에 관한 연구 (A Study on Temperature Compensation of Silicon Piezoresistive Pressure Sensor)

  • 최시영;박상준;김우정;정광화;김국진
    • 대한전자공학회논문지
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    • 제27권4호
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    • pp.563-570
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    • 1990
  • A silicon pressure sensor made of a full bridge of diffused resistors was designed and fabricated using semiconductor integrated circuit process. Thin diaphragms with 30\ulcorner thickness were obtained using anisotropic wet chemical etching technique. Our device showed strong temperature dependence. Compensation networks are used to compensate for the temperature dependence of the pressure sensor. The bridge supply voltage having positive temperature coefficient by compensation networks was utilized against the negative temperature coefficient of bridge output voltage. The sensitivity fluctuation of pressure sensor before temperature compensation was -1700 ppm/\ulcorner, while it reduced to -710ppm\ulcorner with temperature compensation. Our result shows that the we could develop accurate and reliable pressure sensor over a wide temperature range(-20\ulcorner~50\ulcorner).

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선택적인 다공질 실리콘 에칭법을 이용한 압저항형 실리콘 가속도센서의 제조 (Fabrication of Piezoresistive Silicon Acceleration Sensor Using Selectively Porous Silicon Etching Method)

  • 심준환;김동기;조찬섭;태흥식;함성호;이종현
    • 센서학회지
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    • 제5권5호
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    • pp.21-29
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    • 1996
  • (111), $n/n^{+}/n$ 3층 구조의 실리콘 기판을 HF 용액 내에서 양극반응시켜 선택확산된 $n^{+}$ 층에 다공질 실리콘층(Porous Silicon Layer : PSL)을 형성한 후, 이를 5% NaOH 수용액에서 식각하여 미세구조를 제조하는 다공질 실리콘 식각법을 이용한 실리콘 미세구조의 제조법으로 8개의 빔을 갖는 압저항형 실리콘 가속도센서를 제조하였다. 제조된 가속도센서의 매스 패드(mass pad)의 반경, 빔 길이, 빔 폭, 그리고 빔 두께는 각각 $700\;{\mu}m$, $50;{\mu}m$, $100\;{\mu}m$, $7\;{\mu}m$ 였다. 자동차의 응용을 위하여 50g 범위의 가속도를 측정할 수 있도록 진동질량은 2 mg으로 제조하였다. 이때, 진동질량을 부가하는 방법은 Pb/Sn/Ag 솔더 페이스트를 매스 패드에 디스펜싱한 후, 3-zone reflow 장치를 사용하여 열처리하였다. 제조된 가속도센서의 충격응답에 대한 감쇠시간은 약 30 ms로 나타났으며, 가산회로로 합한 출력의 감도는 2.9 mV/g이며, 비선형특성은 full scale 출력에서 2%이하로 측정되었다. 그리고 각 브릿지의 편차는 ${\pm}5%$ 미만으로 나타났다. 또한 측정된 타축감도는 약 4% 이하로 나타났으며, 시뮬레이션 결과로 부터 얻은 센서의 공진주파수는 2.15 KHz이었다.

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CVD공정으로 제작된 멀티레이어 그래핀의 압저항 효과를 이용한 직접화된 압력센서 개발 (Development of Integration Pressure Sensor Using Piezoresistive Effect of Chemical Vapor Deposition (CVD) Produced Multilayer Graphene)

  • 임대윤;하태원;이칠형
    • 센서학회지
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    • 제32권6호
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    • pp.470-474
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    • 2023
  • In this study, a diaphragm-type pressure sensor was developed using multi-layer(four-layer) graphene produced at 1 nm thickness by thermally transferring single-layer graphene produced by chemical vapor deposition (CVD) to a 6" silicon wafer. By measuring the gauge factor, we investigated whether it was possible to produce a pressure sensor of consistent quality. As a result of the measurement, the pressure sensor using multilayer graphene showed linearity and had a gauge factor of about 17.5. The gauge factor of the multilayer graphene-based pressure sensor produced through this study is lower than that of doped silicon, but is more sensitive than a general metal sensor, showing that it can be sufficiently used as a commercialized sensor.

턴널전류 효과를 이용한 미소가속도계의 마이크로머시닝 공정에서 온도분포 해석 (Analysis of the Temperature Distribution at Micromachining Processes for Microaccelerometer Based on Tunneling Current Effect)

  • 김옥삼
    • 한국생산제조학회지
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    • 제9권5호
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    • pp.105-111
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    • 2000
  • Micronization of sensor is a trend of the silicon sensor development with regard to a piezoresistive silicon pressure sensor, the size of the pressure sensor diaphragm have become smaller year by year, and a microaccelerometer with a size less than 200~300${\mu}{\textrm}{m}$ has been realized. Over the past four or five years, numerical modeling of microsensors and microstructures has gradually been developed as a field of microelectromechanical system(MEMS) design process. In this paper, we study some of the micromachining processes of single crystal silicon(SCS) for the microaccelerometer, and their subsequent processes which might affect thermal and mechanical loads. The finite element method(FEM) has been a standard numerical modeling technique extensively utilized in structural engineering discipline for component design of microaccelerometer. Temperature rise sufficiently low at the suspended beams. Instead, larger temperature gradient can be seen at the bottom of paddle part. The center of paddle part becomes about 5~2$0^{\circ}C$ higher than the corner of paddle and suspended beam edges.

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집적화된 실리콘 압력센서의 제작 (Fabrication of Integrated Silicon Pressure Sensor)

  • 이보나;이영준;정승민;이문기
    • 전자공학회논문지A
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    • 제30A권6호
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    • pp.22-30
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    • 1993
  • An integrated silicon pressure sensor with frequency output has been fabricated, measured, and tested. The standard bipolar process is applied and thin diaphragm was formed using EDP anisotropic etchant. Output frequency was 769 Hz-3.1 kHz at the pressure range of 0-10 psi. It operates at the temperature range of 0-50$^{\circ}C$. The frequency sensitivity was 233 Hz/psi and temperature sensitivity was 0.3 Hz/$^{\circ}C$. The power dissipation was 50mW.

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