• Journal of the Semiconductor & Display Technology
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• v.2 no.1
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• pp.21-24
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• 2003

Sludged silicon powders that are generated during silicon ingot slicing process have potential usage as silicon source in fabricating silicon carbide powders by adding carbon. A thermodynamic calculation is performed to consider a plausible formation condition for the silicon carbide powders. A thin silicon oxide layer around silicon powder is sufficient to supply equilibrium oxygen partial pressure at the formation temperature($1400^{\circ}C$) of the silicon carbide in the Si-C-O ternary system. Formation of silicon carbide by using the sludged silicon powders is more efficient than by using silicon oxide powders.

• The Transactions of the Korean Institute of Electrical Engineers P
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• v.63 no.3
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• pp.125-130
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• 2014

This paper is research result for a development of solar cell silicon ingot glowing(SCSIG) PWM converter system for 120[kW] 3[kA]. The system include 3-phase AC-DC rectifier diode converter of input voltage AC 460[V] and 60[Hz], DC-AC single phase full bridge PWM inverter of high frequency, AC-DC single-phase full wave rectifier using center-tapped of transformer for low voltage 50[V] and large current 3,000[A], carbon resistor load 0.2 [$m{\Omega}$]. PWM switching frequency for IGBT inverter control set 15KHz. The suggested researching contents are designed data sheets of power converter system, PSIM simulation, operating characteristics and analysis results of developed SCSIG system.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.13 no.4
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• pp.182-186
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• 2003

The photovoltaic industry has been forced to lower the production cost in many ways. Ingot preparation technology is growing rapidly toward large-scale production. Multicrystalline silicon ingot of 69 cm square cross section, 240kg has been produced with fully automated equipment. During solidification, heat has been extracted from the bottom of the crucible through the graphite pedestal moving downward. The characteristics of the large ingot grown in this method are found to be uniform structurally and electrically.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.18 no.1
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• pp.45-49
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• 2008

The development of manufacturing process of silicon (Si) ingots is one of the important issues to the growth of the photovoltaic industry. Polycrystalline Si wafers shares more than 60% of the photovoltaic market due to its cost advantage compared to mono crystalline silicon wafers. Several solidification processes have been developed by industry including casting, heat exchange method (HEM) and electromagnetic casting. In this paper, the advanced directional solidification (ADS) method is used to growth of large sized polycrystalline Si ingot. This method has the advantages of the small heat loss, short cycle time and efficient directional solidification. The numerical simulation of the process is applied using a fluid dynamics model to simulate the temperature distribution. The results of simulations are confirmed efficient directional solidification to the growth of large sized polycrystalline Si ingot above 240 kg.

• Journal of the Semiconductor & Display Technology
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• v.22 no.3
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• pp.21-27
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• 2023

In this article, a plate-type megasonic cleaning system with cooling pins is proposed for the sliced ingot, which is a raw material of silicon (Si) wafers. The megasonic system is operated with a lead zirconate titanate (PZT) actuator, which has high electric resistance, thus when it is being operated, it dissipates much heat. So this article proposes a megasonic system with cooling pins. In the design process, finite element analysis was performed and the results were used for the design of the waveguide. The frequency with the maximum impedance value was 998 kHz, which agreed well with the measured value of 997 kHz with 0.1 % error. Based on the results, the 1 MHz waveguide was fabricated. Acoustic pressures were measured, and analyzed. Finally, cleaning tests were performed, and 90 % particle removal efficiency (PRE) was achieved over 10 W power. These results imply that the developed 1 MHz megasonic will effectively clean sliced ingot wafer surfaces.

• Current Photovoltaic Research
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• v.8 no.1
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• pp.17-26
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• 2020

It is clear that monocrystalline Silicon (Si) ingots are the key raw material for semiconductors devices. In the present industries markets, most of monocrystalline Silicon (Si) ingots are made by Czochralski Process due to their advantages with low production cost and the big crystal diameters in comparison with other manufacturing process such as Float-Zone technique. However, the disadvantage of Czochralski Process is the presence of impurities such as oxygen or carbon from the quartz and graphite crucible which later will resulted in defects and then lowering the efficiency of Si wafer. The heat transfer plays an important role in the formation of Si ingots. However, the heat transfer generates convection in Si molten state which induces the defects in Si crystal. In this study, a crystal growth simulation software was used to optimize the Si crystal growth process. The furnace and system design were modified. The results showed the melt-crystal interface shape can affect the Si crystal growth rate and defect points. In this study, the defect points and desired interface shape were controlled by specific crystal growth rate condition.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.18 no.5
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• pp.195-199
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• 2008

Production of the silicon feedstock for the semiconductor industry cannot meet the requirement for the solar cell industry because the production volume is too small and production cost is too high. This situation stimulates the solar cell industry to try the lower grade silicon feedstock like UMG (Upgraded Metallurgical Grade) silicon of 5$\sim$6 N in purity. However, this material contains around 1 ppma of dopant atoms like boron or phosphorous. Calculation of the composition profile of these impurities using segregation coefficient during crystal growth makes us expect the change of the type from p to n : boron rich area in the early solidified part and phosphorous rich area in the later solidified part of the silicon ingot. It was expected that the change of the growth speed during the silicon crystal growth is effective in controlling the amount of the metal impurities but not effective in reducing the amount of dopants.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.23 no.3
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• pp.119-123
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• 2013

Most of the world's solar cells in photovoltaic industry are currently fabricated using crystalline silicon. Czochralski-grown silicon crystals are more expensive than multicrystalline silicon crystals. The future of solar-grade Czochralski-grown silicon crystals crucially depends on whether it is usable for the mass-production of high-efficiency solar cells or not. It is generally believed that the main obstacle for making solar-grade Czochralski-grown silicon crystals a perfect high-efficiency solar cell material is presently light-induced degradation problem. In this work, the substitution of boron with gallium in p-type silicon single crystal is studied as an alternative to reduce the extent of lifetime degradation. The diamond-wire sawing technology is employed to slice the silicon ingot. In this paper, the quality of the diamond wire-sawn gallium-doped silicon wafers is studied from the chemical, electrical and structural points of view. It is found that the characteristic of gallium-doped silicon wafers including texturing behavior and surface metallic impurities are same as that of conventional boron-doped Czochralski crystals.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.24 no.2
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• pp.47-53
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• 2014

Three kinds of crystalline silicon have been used for the solar cell grade. First of all, single crystalline silicon is the main subject to enhance the production yield. Most of the efforts are focused on the control of the melt-crystal interface shape affected by the crystal-crucible rotation rate. The main subject in the multi-crystalline silicon ingot is the contamination control. Faster Ar gas flow above the melt surface will lower the carbon contamination in the crystal. And also, twin boundary electrically inactive is found to be more effective than grain boundary for the improvement of the MCLT. In the case of mono-like silicon material, propagation of the multi-crystalline silicon growing from the inner side crucible is the problem lowering the portion of the single crystalline part at the center of the ingot. Crystal growing apparatus giving higher cooling rate at the bottom and lower cooling rate at the side crucible was suggested as the optimum solution obtaining higher quality of the mono-like silicon ingot. Proper application of the seeds at the bottom of the crucible would be one of the solutions.

• Nuclear Engineering and Technology
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• v.42 no.4
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• pp.442-449
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• 2010

Recently, the neutron irradiation for large diameter silicon (Si)-ingots of more than 8" diameter is requested to satisfy the demand for the neutron transmutation doping silicon (NTD-Si). By increasing the Si-ingot diameter, the radial non-uniformity becomes larger due to the neutron attenuation effect, which results in a limit of the feasible diameter of the Si-ingot. The current evaluation method has a certain limit to precisely evaluate the radial uniformity of Si-ingot because the current evaluation method does not consider the effect of the Si-ingot diameter on the radial uniformity. The objective of this study is to propose a new evaluation method of radial uniformity by improving the conventional evaluation approach. To precisely predict the radial uniformity of a Si-ingot with large diameter, numerical verification is conducted through comparison with the measured data and introducing the new evaluation method. A new concept of a gradient is introduced as an alternative approach of radial uniformity evaluation instead of the radial resistivity gradient (RRG) interpretation. Using the new concept of gradient, the normalized reaction rate gradient (NRG) and the surface normalized reaction rate gradient (SNRG) are described. By introducing NRG, the radial uniformity can be evaluated with one certain standard regardless of the ingot diameter and irradiation condition. Furthermore, by introducing SNRG, the uniformity on the Si-ingot surface, which is ignored by RRG and NRG, can be evaluated successfully. Finally, the radial uniformity flattening methods are installed by the stainless steel thermal neutron filter and additional Si-pipe to reduce SNRG.