• 한국태양에너지학회:학술대회논문집
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• 한국태양에너지학회 2011년도 춘계학술발표대회 논문집
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• pp.116-120
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• 2011

In this paper, we studied the optimization of the screen pringting method for crystalline silicon solar cell fabrication. The 156 * 156 mm2 p-type silicon wafers with $200{\mu}m$ thickness and $0.5-3{\Omega}cm$ resistivity were used after texturing, doping, and passivation. Screen printing method is a common way to make the c-Si solar cell with low-cost and high-efficiency. We studied the optimized condition for screen printing with crystalline silicon solar cell as changing the printing direction (finger line or bus bar), finger width, and mesh angle. As a result, the screen printing with finger line direction showed higher finger height and better conversion efficiency, compared with one with bus bar direction. The experiments with various finger widths and mesh angles were also carried out. The characteristics of solar cells was obtained by measuring light current-voltage, optical microscope and electroluminescence.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1996년도 추계학술대회 논문집 학회본부
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• pp.425-427
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• 1996

New fabrication technique was developed to make three dimensional silicon microstructure with five fold vertical steps through entire wafer thickness. Each step is pre-defined on multiply stacked thermal oxide and silicon nitride (O/N) layers by photolithographies. Multi-stepped silicon microstructure is formed by anisotropic etch in aqueous KOH solution with the patterned nitride film as masking layer. Fabricated microstructure consists of four $16{\mu}m$ thick flexural spring beams, $290{\mu}m$ thick proof mass, mesas for overrange stop with $10{\mu}m$ height from the surface of the proof mass, and the other mesas and V grooves used for assembling this structure to the packaging frame of pendulous servo accelerometer. Using the numerical finite element method (FEM) simulator: ABAQUS, mechanical characteristics of the fabricated microstructure by the developed technique was compared with those of the same structure processed by one step silicon bulk etch followed by oxidation and patterning the etched region.

• 공업화학
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• 제16권5호
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• pp.614-619
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• 2005

폴리올, 실리콘 수지, 변성 실리콘 수지 등을 유화제로 유화시켜 수용성 소포제를 제조하였다. 제조한 소포제에 대하여 소포성, 상분리 시간, 점도 등을 측정하였다. PPG 혼합물의 상분리 시간은 PPG 400>PPG 3000>PPG 1000이었다. PPG 1000을 혼합하였을 때는 다른 것에 비하여 뛰어난 소포성을 나타내었다. 실리콘 수지 혼합물의 상분리 시간은 TSF-451-350>TSF-451-200>TSF-451-50이었다. TSF-451-50을 혼합하였을 때는 상용성 부족으로 혼합물의 부피가 증가되었다. 고분자량의 실리콘 수지를 사용할수록 소포성은 좋지 않았다. 변성 실리콘 수지는 물에 잘 분산되었지만 폴리올에 대한 상용성은 좋지 않았다. 유화제에 대한 소포성은 SPAN 20>SPAN 60>SPAN 80의 순이었다. SPAN 80은 실리콘 수지에 대하여 혼합성이 좋지 않았지만 YAS 6406이나 PPG 1000에 대해서는 좋은 혼합성을 나타내었다.

• 통합자연과학논문집
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• 제8권3호
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• pp.147-152
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• 2015

Photoluminescent porous silicon (PSi) were prepared by an electrochemical etch of n-type silicon under the illumination with a 300 W tungsten filament bulb for the duration of etch. The red photoluminescence emitting at 620 nm with an excitation wavelength of 450 nm is due to the quantum confinement of silicon nanocrystal in porous silicon. As-prepared PSi was sonicated, fractured, and centrifuged in toluene to obtain photoluminescence silicon quantum dots. BET and BHJ methods were employed to study the specific surface area of as-prepared PSi. Optical characterization of red photoluminescent silicon nanocrystal was investigated by UV-vis and fluorescence spectrometer. Also SEM and TEM images of porous silicon and nanoparticles were investigated.

• 한국세라믹학회지
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• 제46권5호
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• pp.534-539
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• 2009

Reaction Bonded Silicon Carbide(RBSC) has been used for engineering ceramics due to low-temperature fabrication and near-net shape products with excellent structural properties such as thermal shock resistance, corrosion resistance and mechanical strength. Recently, attempts have been made to develop hot gas filter with gradient pore structure by RBSC to overcome weakness of commercial clay-bonded SiC filter such as low fracture toughness and low reliability. In this study a fabrication process of porous RBSC with multi-layer pore structure with gradient pore size was developed. The support layer of the RBSC with multi-layer pore structure was fabricated by conventional Si infiltration process. The intermediate and filter layers consisted of phenolic resin and fine SiC powder were prepared by dip-coating of the support RBSC in slurry of SiC and phenol resin. The temperature of $1550^{\circ}C$ to make Si left in RBSC support layer infiltrate into dip-coated layer to produce SiC by reacting with pyro-carbon from phenol resin.

• Current Photovoltaic Research
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• 제9권4호
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• pp.111-122
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• 2021

Silicon heterojunction technology (HJT) solar cells have received considerable attention due to advantages that include high efficiency over 26%, good performance in the real world environment, and easy application to bifacial power generation using symmetric device structure. Furthermore, ultra-highly efficient perovskite/c-Si tandem devices using the HJT bottom cells have been reported. In this paper, we discuss the unique feature of the HJT solar cells, the fabrication processes and the current status of technology development. We also investigate practical challenges and key technologies of the HJT solar cell manufacturers for reducing fabrication cost and increasing productivity.

• 한국생산제조학회지
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• 제22권5호
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• pp.831-836
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• 2013

This study demonstrates the process of fabricating patterns using tribonanolithography (TNL),with laboratory-made micro polycrystalline diamond (PCD) tools that are attached to an atomic force microscope (AFM). The various patterns are easily fabricated using mechanical scratching, under various normal loads, using the PCD tool on single crystal silicon, which is the master mold for replication in this study. Then, polydimethylsiloxane (PDMS) replica molds are fabricated using precise pattern transfer processes. The transferred patterns show high dimensional accuracy as compared with those of TNL-processed silicon micro molds. TNL can reduce the need for high cost and complicated apparatuses required for conventional lithography methods. TNL shows great potential in that it allows for the rapid fabrication of duplicated patterns through simple mechanical micromachining on brittle sample surfaces.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 추계학술대회 논문집
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• pp.54-54
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• 2009

AFM anodic oxidation has the capability of patterning complex nano-patterns under relatively high speeds and low voltage. We report the fabrication using a atomic force microscopy (AFM) of silicon nano-ribbon and nano-field effect transistors (FETs). The fabricated nano-patterns have great potential characteristics in various fields due to their interesting electronic, optical and other profiles. The results shows that oxide width and the separation between the oxide patterns can be optimally controlled. The subsequently fabricated silicon nano-ribbon and nano-FET working devices were controled by various tip-sample bias-voltages and scan speed of AFM anodic oxidation. The results may be applied for highly integration circuits and sensitive optical sensor applications.

• 한국정밀공학회지
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• 제23권3호
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• pp.56-60
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• 2006

A high-resolution shadow mask, or called a nanostencil was fabricated for high resolution lithography. This high-resolution shadowmask was fabricated by a combination or MEMS processes and focused ion beam (FIB) milling. 500 nm thick and $2{\times}2mm$ large membranes wore made on a silicon wafer by micro-fabrication processes of LPCVD, photolithography, ICP etching and bulk silicon etching. A subsequent FIB milling enabled local membrane thinning and aperture making into the thinned silicon nitride membrane. Due to the high resolution of the FIB milling process, nanoscale apertures down to 70 nm could be made into the membrane. By local deposition through the apertures of nanostencil, nanoscale patterns down to 70 nm could be achieved.

• KSTLE International Journal
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• 제9권1_2호
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• pp.10-12
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• 2008

Silicon micro-patterns were fabricated on Si (100) wafers using photolithography and DRIE (Deep Reactive Ion Etching) fabrication techniques. The patterned shapes included micro-pillars and micro-channels. After the fabrication of the patterns, the patterned surfaces were chemically modified by coating Z-DOL (perfluoropolyether, PFPE) thin films. The surfaces were then evaluated for their micro-friction behavior in comparison with those of bare Si (100) flat, Z-DOL coated Si (100) flat and uncoated Si patterns. Experimental results showed that the chemically treated (Z-DOL coated) patterned surfaces exhibited the lowest values of coefficient of friction when compared to the rest of the test materials. The results indicate that a combination of both the topographical and chemical modification is very effective in reducing the friction property. Combined surface treatments such as these could be useful for tribological applications in miniaturized devices such as Micro/Nano-Electro-Mechanical-Systems (MEMS/NEMS).