• 한국재료학회지
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• 제13권5호
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• pp.292-296
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• 2003

In an attempt to enhance phase transformation and homogenization of Mn-doped $FeSi_2$, mechanical alloying of elemental powders was applied. Cold pressing and sintering in vacuum were carried out to produce a dense microstructure, and then isothermal annealing was employed to induce a phase transformation to the $\beta$-$FeSi_2$semiconductor. Phase transitions in this alloy system during the process were investigated by using XRD, EDS and SEM. As-milled powders after 100 h of milling were shown to be metastable state. As-sintered iron silicides consisted of untransformed mixture of $\alpha$-$Fe_2$$Si_{5}$and $\varepsilon$-FeSi phases. $\beta$-$FeSi_2$phase transformation was induced by subsequent isothermal annealing at $830^{\circ}C$, and near single phase of $\beta$-$FeSi_2$was obtained after 24 h of annealing. Thermoelectric properties in terms of Seebeck coefficient, and electrical conductivity were evaluated and correlated with phase transformation. Seebeck coefficient electrical resistivity and hardness increased with increasing annealing time due to $\beta$ phase transformation.

• The Korean Journal of Ceramics
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• 제2권1호
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• pp.19-24
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• 1996

The phase distribution and interface chemistry by the solid-state reaction between SiC and nickel were studied at temperatures between $550 \;and\; 1250^{\circ}C$ for 0.5-100 h. The reaction with the formation of silicides and carbon was first observed above $650^{\circ}C$. At $750^{\circ}C$, as the reaction proceeded, the initially, formed $Ni_3Si_2$ layer was converted to $Ni_2$Si. The thin nickel film reacted completely with SiC after annealing at $950^{\circ}C$ for 2 h. The thermodynamically stable $Ni_2$Si is the only obsrved silicide in the reaction zone up to $1050^{\circ}C$. The formation of $Ni_2$Si layers with carbon precipitates alternated periodically with the carbon free layers. At temperatures between $950^{\circ}C$ and $1050^{\circ}C$, the typical layer sequences in the reaction zone is determined by quantitative microanalysis to be $SiC/Ni_2$$Si+C/Ni_2$$Si/Ni_2$$Si+C/…Ni_2$Si/Ni(Si)/Ni. The mechanism of the periodic band structure formation with the carbon precipitation behaviour was discussed in terms of reaction kinetics and thermodynamic considerations. The reaction kinetics is proposed to estimate the effective reaction constant from the parabolic growth of the reaction zone.

• 한국결정성장학회지
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• 제5권4호
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• pp.358-369
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• 1995

SIC와 금속박막의 반응에 의한 표면구조 및 부착력이 550$^{\circ}C$에서 1450$^{\circ}C$의 온도범위에서 조사되어졌다. SiC/Co계에서는 850$^{\circ}C$ 이상에서, SiC/Ni계에서는 650$^{\circ}C$ 이상에서 여러 가지 규소화물이 형성된 반응이 최초로 나타났다. 코발트는 1050$^{\circ}C$, 0.5 h에서 니켈은 950$^{\circ}C$, 2h에서 SiC와 완전히 반응하여 소모되었다. SiC/Co에서는 CoSi상이 SiC/Ni에서는 Ni$_{2}$Si상이 1250$^{\circ}C$와 1050$^{\circ}C$의 반응에서까지 각각 열역학적으로 안정하게 관찰되어졌다. 탄소는 SiC/Co 반응표면에서는 1450$^{\circ}C$ 이상에서 그리고 SiC/Ni 반응표면에서는 1250$^{\circ}C$ 이상에서의 온도에서 흑연으로 결정화되었다. SiC기판과 금속박막의 임계하중이 scratch test 방법에 의하여 정성적으로 비교되어져, 850$^{\circ}C$에서 1050$^{\circ}C$의 온도범위에서 SiC/Ni couple이 20~33N의 상대적으로 높은 값을 나타내었다.

• 한국결정성장학회지
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• 제5권2호
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• pp.109-121
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• 1995

SiC/Co 반응커플을 Ar/4 vol% $H_2$분위기하에서 $950^{\circ}C$에서 $1250^{\circ}C$ 범위에서 4시간에서 100시간까지 열처리하였다. $950^{\circ}C$ 이상의 온도에서의 고상반응으로 여러 가지 규소화물과 탄소석출이 형성되었다. 이 반응 zone에 있어서의 전형적인 반응층의 순서는 $SiC/CoSi + C/Co_2Si + C/Co_2Si/Co_2Si + C/{\cdots\cdots}/Co_2Si/Co$이었다. 그리고 탄소 석출거동을 동반한 주기적인 띠구조의 형성기구가 반응운동학과 열역학적인 고찰을 통하여 조사되어졌고 논하여졌다. 이 반응의 zone의 서장은 시간의 함수관계를 가지며 이러한 반응운동학이 반응상수의 측정을 통하여 제시되어진다. 또한 microhardness 측정을 통하여 반응 zone의 기계적인 물성이 조사되어졌다.

• 한국재료학회지
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• 제25권2호
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• pp.90-94
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• 2015

We prepared 8 samples of non-silver and silver-added master alloys containing silicon to confirm the existence of nickel-silicides. We then prepared products made of 14K and 18K white gold by using the prepared master alloys containing 0.25, 0.35, and 0.50 wt% silicon to check for nickel release. We then employed the EN 1811 testing standard to investigate the nickel release of the white gold products, and we also confirmed the color of the white gold products with an UV-VIS-NIR-color meter. We observed $NiSi_x$ residue in all master alloys containing more than 0.50 wt% Si with EDS-nitric acid etching. For the white gold products, we could not confirm the existence of $NiSi_x$ through XRD after aqua-regia etching. In the EN 1811 test, only the white gold products with 0.25 wt% silicon master alloys successfully passed the nickel release regulations. Moreover, we confirmed that our white gold products showed excellent Lab indices as compared to those of commercial white gold ones, and the silver-added master alloys offered a larger L index. Our results indicate that employing 0.25 wt% silicon master alloys might be suitable for white gold products without nickel-silicide defects and nickel release problems.

• 한국재료학회지
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• 제27권2호
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• pp.94-99
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• 2017

Dinickel-silicide $(Ni_2Si)/glass$ was employed as a counter electrode for a dye-sensitized solar cell (DSSC) device. $Ni_2Si$ was formed by rapid thermal annealing (RTA) at $700^{\circ}C$ for 15 seconds of a 50 nm-Ni/50 nm-Si/glass structure. For comparison, $Ni_2Si$ on quartz was also prepared through conventional electric furnace annealing (CEA) at $800^{\circ}C$ for 30 minutes. XRD, XPS, and EDS line scanning of TEM were used to confirm the formation of $Ni_2Si$. TEM and CV were employed to confirm the microstructure and catalytic activity. Photovoltaic properties were examined using a solar simulator and potentiostat. XRD, XPS, and EDS line scanning results showed that both CEA and RTA successfully led to tne formation of nano $thick-Ni_2Si$ phase. The catalytic activity of $CEA-Ni_2Si$ and $RTA-Ni_2Si$ with respect to Pt were 68 % and 56 %. Energy conversion efficiencies (ECEs) of DSSCs with $CEA-Ni_2Si$ and $RTA-Ni_2Si$catalysts were 3.66 % and 3.16 %, respectively. Our results imply that nano-thick $Ni_2Si$ may be used to replace Pt as a reduction catalytic layer for a DSSCs. Moreover, we show that nano-thick $Ni_2Si$ can be made available on a low-cost glass substrate via the RTA process.

• 한국재료학회지
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• 제5권7호
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• pp.820-828
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• 1995

초청정 Si 기판위에 Ti을 증착하여 형성시킨 Ti-silicide의 상전이와 각상의 표면 및 계면형상을 Ti 증착두께, 열처리 온도, 기판의 방위에 따라 조사하였다. 초 고진공 챔버에서 각각 400$\AA$ 및 200$\AA$의 Ti를 50$0^{\circ}C$부터 90$0^{\circ}C$까지 10$0^{\circ}C$간격으로 가열되어 있는 Si(100) 및 Si(111) 기판에 증착하여 Ti-silicide를 형성하였다. 형성된 Ti-silicide를 XRD, SEM, TEM으로 상전이와 각상의 표면 및 계면 형상을 관찰하였다. 관찰결과 C49에서 C54상으로의 상전이 온도는 $650^{\circ}C$정도이었고, 기판의 방위와 박막의 증착 두께에 따라 상전이 온도의 변화가 관찰되었으며, 이 상전이 온도의 변화를 표면에너지와 체적에너지에 기초를 둔 고찰을 통해 설명하였다. 그리고 C49상은 증착한 박막에서의 Si 원자의 비균질한 확산 특성으로 인해 거친 계면을 나타내고 있으나, C54상은 비교적 균질한 계면을 나타내고 있으며 응집화에 의해 island가 형성된 것이 관찰되었다.

• 열처리공학회지
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• 제31권1호
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• pp.6-11
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• 2018

The anodic oxidation behavior of Si-containing aluminum alloy for diecasting was investigated. Especially, the property changes during anodization both on aluminum 1050 and 9 weight percentage silicon containing aluminum (Al-9Si) alloys were analyzed by the static current test. In order to fabricate a uniform anodic oxidation film by effect of Al-Si compound, nitric acid containing hydrofluoric acid had been used as a desmutter for aluminum alloy after alkaline etching. It was found that the level of voltage of Al-9Si alloy during the static current test was almost as double as higher than aluminum 1050 through anodization. By adding hydrofluoric acid in the nitric acid electrolyte, the silicon compound on the surface was removed, and the optimum amount of added hydrofluoric acid could be derived. It was also observed that the size of silicon compound formed on the surface could be refined by heat treatment at $500^{\circ}C$ and followed water quenching.

• 한국재료학회지
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• 제6권7호
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• pp.692-699
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• 1996

nptype Si(100)웨이퍼를 precleaning하고 HF 용액에 dip etching한 후 E-beam dvaporator에 장착하여 Co 단일막($170\AA$, $340\AA$)과 Co/Ti 이중막($200\AA$/ $(50-100)\AA$)을 성장시켰다. 시편의 RTA 과정에서는 N2분위기에서 direct annealing 방식으로 열처리 온도와 시간을 변화시켜가며 Co-silicidation 공정을 수행하였다. Co 단일막으로 형성된 Co-실리사이드의 면저항은 $500^{\circ}C\leq$T$\leq$$850^{\circ}C$범위에서 열처리 온도와 시간의 변화에 관계없이 거의 일정한 값을 나타내었다. Co/Ti 이중막의 경우 Co-실리사이드의 형성온도가 Co 단일막의 경우에 비해 높게 나타나고 낮은 비저항의 CoSi2를 얻기 위해서는 $800^{\circ}C$이상의 온도로 열처리해야 함을 알 수 있었다. XRD 분석결과, Co 단일막으로부터 얻어진 CoSi2는 (111) 및 (220) 결정상을 나타내었으나, Co/Ti 이중막에 의한 CoSi2는 (200)결정상만이 나타나서 Si(100)기판과 에피층을 이루고 있음을 알 수 있었다. 본 실험에서 CoSi2의 비저항은 약 $18\mu$$\Omega$.cm로 나타났으며, TEM 및 AES 분석으로부터 Co/Ti bilayer-실리사이드가 다량의 Si과 Ti 외에 소량의 Co가 섞여있는 표면 복합층과, Si과 Co만이 존재하는 내부 에피층으로 구성됨을 확인하였다.

• 한국재료학회지
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• 제14권6호
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• pp.402-406
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• 2004

$WSi_2$, $TiSi_2$, $CoSi_2$, and $TaSi_2$ are general silicides used today in semiconductor devices. $WSi_2$ thin films have been proposed, studied and used recently in CMOS technology extensively to reduce sheet resistance of polysilicon and $n^{+}$ region. However, there are several serious problems encountered because $WSi_2$ is oxidized and forms a native oxide layer at the interface between $WSi_2$ and $Si_3$$N_4$. In this study, we have introduced 20 $slm-N_2$ gas from top to bottom of the furnace in order to control native oxide films between $WSi_2$ and $Si_3$$N_4$ film. In resulting SEM photographs, we have observed that the native oxide films at the surface of $WSi_2$ film are removed using the long injector system.