• 한국광학회지
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• 제10권5호
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• pp.419-423
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• 1999

측면 연마된 단일모드 광섬유와 다중모드 폴리머 평면도파로 사이의 소산장 결합을 이용한 광필터를 제작하고 그 특성을 측정하였다. 소자의 편광의존성을 줄일 수 있는 방법 제안하였으며 실험으로 검증하였다. 그리고 광필터의 공진파장과 여과 깊이는 평면도파로의 두께와 연마깊이로서 적절히 선택할 수 있음을 실험으로 보였다. 광섬유 연마과정, 폴리머 평면도파로 제작 등을 포함한 소자제작 공정을 소개하였다. 제작된 광필터의 3㏈대역폭은 15nm, 삽입손실은 0.2㏈, 편광에 따른 공진 파장의 차이는 2nm 이하였다. 그리고 주위온도에 의한 공진파장의 이동거리는 -0.35nm/$^{\circ}C$로 측정되었다.

• 한국표면공학회지
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• 제53권1호
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• pp.29-35
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• 2020

In this study, five different specimen preparation methods were introduced and their advantages and disadvantages were presented. One of them, an epoxy mounting method has advantages of constant exposure area, ease of surface preparation without touching the specimen surface during polishing or cleaning, use of small amount of material and ease of specimen reuse by polishing or etching. However, in order to eliminate unexpected errors resulting from preferable reaction at the specimen/epoxy interface and contact resistance between the specimen and copper conducting line for electrical connection, it is recommended to cover the wall side of the specimen with porous anodic oxide films and to remain the contact resistance lower than 1 ohm. The increased contact resistance between the specimen and Cu conducting line appeared to result in increases of anodizing voltage and solution temperature during anodizing by which thickness and hardness of anodizing film on Al2024 alloy were drastically decreased and color of the films became more brightened.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.482-483
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• 2009

In chemical mechanical planarization (CMP) process, the uniformity of stress acting on wafer surface is a key factor for uniform material removal of thin film especially in the oxide CMP. In this paper, we analyze the stress on the contact region between wafer and pad with finite-element analysis (FEA). The setting pressure acting on wafer back side was $500g/cm^2$ and the retainer pressure was changed from 300 to $700g/cm^2$. The polishing test is also done with the same conditions. The material removal rate profiles well-matched with stress distribution.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2001년도 하계학술대회 논문집 C
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• pp.1349-1351
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• 2001

Polycrystalline diamond films are deposited by using a microwave plama CVC system, where the bias-enhanced nucleation (BEN) method is employed. Effects of the varying microwave power, the surface treatment by hydrogen plasma, and the cyclic hydrogen etching during deposition on the crystallinity as well as on the surface roughness of deposited films are examined by Raman spectroscopy, SEM, and AFM. A novel method for achieving a smoother diamond surface is also suggested through the indirect wafer bonding and back-side polishing.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.1227-1230
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• 2003

A roughing process is one of the most important and indispensable shoe manufacturing processes of various types of shoes. This basic process to rough the upper of the shoe is studied to improve the productivity and to reduce the processing time. In this study, the CAM system for shoe roughing is developed. The B-spline surface generated by the developed CAM system ignores the small inclinations of the real roughing surface because the developed roughing tool has potential to rough the roughing surface of the shoe properly. The roughing tool roughs the roughing surface using its side along the generated tool paths. The generated NC codes were applied to 5-axis polishing machine for the test. Experimental results show good evaluation result. The upper of the shoe is roughed properly along the roughing path line and the roughing surface was good to cement the outsole of the shoe.

• 한국결정성장학회지
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• 제10권1호
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• pp.13-16
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• 2000

Progress in Si crystal and wafer technologies is discussed on single crystal growth, wafer fabrication, epitaxial growth, gettering, 300 mm and SOI. As for bulk crystal growth, the mechanism of grown-in defects (voids) formation, the succes of grown-in defect free crystal growth technology and nitrogen doped crystal are shown. New wafer fabrication technologies such as both-side mirror polishing and etchingless process have been developed. The epitaxial growth of SiGe/Si heterostructure for high speed bipolar device is treated. Gettering technology under low temperature process such as RTP is important, and also it is shown that IG effect for Ni could be predicted using computer simulation of precipitate density and size. The development of 300 mm wafer and SOI has made progress steadily.

• 대한기계학회논문집A
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• 제31권5호
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• pp.550-555
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• 2007

The effective fracture toughness testing of materials intended for application in Micro Electro Mechanical Systems (MEMS) devices is required in order to improve understanding of how micro sized material used in device may be expected to perform upon the micro scale. ${\gamma}$-TiAl based materials are being considered for application in MEMS devices at elevated temperatures. Especially, in Alloy 4, both ${\alpha}_2$ and ${\gamma}$ lamellae were altered markedly in 3,000 h, $700^{\circ}C$ exposure. Parallel decomposition of coarse ${\alpha}_2$ into bunches of very fine (${\alpha}_2+{\gamma}$) lamellae. Parallel decomposition of coarse ${\alpha}_2$ into bunches of very fine (${\alpha}_2+{\gamma}$) lamellae. The materials were examined 2 types Alloy 4 on heat exposed specimen($700^{\circ}C$, 3,000 h) and no heat exposed one. Micro sized cantilever beams were prepared mechanical polishing on both side at $25{\sim}30{\mu}m$ and electro final stage polishing to observe lamellar orientation of same colony with EBSD (Electron Backscatter Diffraction Pattern). Through lamellar orientation as inter-lamellae or trans-lamellae, Cantilever beam was fabricated with Focused Ion Beam(FIB). The directional behavior of the lamellar structure was important property in single material, because of the effects of the different processing method and variations in properties according to lamellar orientation. In MEMS application, it is first necessary to have a reliable understanding of the manufacturing methods to be used to produce micro structure.

• 한국광학회지
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• 제25권4호
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• pp.200-206
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• 2014

본 논문에서는 직경 $125{\mu}m$의 싱글모드 광섬유에 입사된 빔을 다방향으로 방사하기 위하여 이론적으로 계산된 값을 광학설계 프로그램인 LightTools를 이용하여 광섬유 끝단에 원뿔형 구조물을 모델링 하고 입사된 모든 빔이 전반사 되어 측면으로 방사되는 광섬유 팁과, 전방과 측면으로 동시에 방사가 가능한 광섬유 팁에 대해 시뮬레이션을 하였다. 이러한 결과를 가지고 광섬유 끝단에 펨토초 레이저와 $CO_2$ 레이저를 이용하여 원뿔형 구조물을 제작하고 시뮬레이션 결과와 비교 분석하는 연구를 수행하였다.

• 대한소아치과학회지
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• 제23권2호
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• pp.389-400
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• 1996

In Class II amalgam restoration in deciduous molar, failure rate and incidence of recurrent caries are high as children become older. In order to preserve deciduous molars till the physiologic exfoliation time, stainless steel crown is a choice of the treatment. As a result of a careless treatment, such as overhanging margin, poor marginal adaptation, poor proximal contour and inadequate mesiodistal width give rise to interfering eruption of the adjacent teeth, recurrent caries and chronic gingival irritation and insufficient arch length respectively. In this study, 252 s.s. crowned teeth extracted due to physiologic exfoliation or periapical lesion. The purpose of this study is to analyze the marginal adaptation of stainless steel crown to the deciduous molar in order to obtain better clinical result. The results were as follows : 1. Between the length of s.s. crown and the marginal gap of crown, positive correlations were shown. 2. Largest amount of marginal gap was shown at buccal side in upper deciduous molars and lower first deciduous molar, lingual side in lower second deciduous molar. But no significant diffrence were found statistically compared to second most largest one. 3. Incidence of exposed restoration and recurrent caries were higher in proximal surface than buccal/lingual surface. And extension of restoration below the margin of s.s. crown gives rise to higher rate of recurrent caries. 4. Defect of contour was found in 34%, frequently found in lower 1st deciduous molar and upper 1st deciduous molar. 5. Marginal polishing defects were found in 23%. 6. Ledge was formed in 10% especially in lower 1st deciduous molar and lower 2nd deciduous molar. 7. 16% of the teeth had wear facet due to traumatic occlusion, 7% of them had occlusal perforation.

• 대한심미치과학회지
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• 제23권1호
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• pp.16-26
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• 2014

CAD/CAM에서 사용할 수 있는 소재는 composite, ceramic, hybrid 그리고 metal이 있다. 그중에 진료실 CAD/CAM에서는 주로 monolithic ceramic 테크닉을 사용하는 데, monolithic ceramic 테크닉이란 한 가지 소재로만 제작하는 방법을 말한다. 블럭상태의 소재를 최종치아형태로 깎아 폴리싱해서 사용하거나, 열을 가해서 사용하는 방법으로, 기존의 도재 축조 작업이 필요 없다. 심미성에서는 다소 부족하지만, 1시간 안에 제작이 가능하므로 1회, 1일 방문으로 치료를 완료할 수 있고, 소재의 안정성이 높으며(녹이거나 상변화를 시키지 않음에 따라 왜곡이 생기거나 강도가 약해질 가능성이 적음), 컴퓨터 조작(CAD 작업)으로 치아를 디자인하여 제작하므로 진료실에서 쉽게 작업할 수 있다는 장점이 있다. 이 테크닉에 사용할 수 있는 소재를 임상적 관점에서 세대별로 따라 분류해 보았다.