• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.485-485
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• 2009

Double side polishing process has been used for various industrial applications, such as polishing of semiconductor substrates and flat panel display glasses. In wafer manufacturing, double side polishing process is applied to improve wafer flatness and to minimize particle generation from wafers in device manufacturing processes, which is recognized as one of the most important processes. Whereas the kinematical modeling and analysis results of single side polishing, extensively used for chemical-mechanical polishing (CMP) in device manufacturing, are well investigated, the studies in conjunction with double side polishing are barely carried out, due to the complication of polishing system and the uncertainty of wafer motion in the carrier. This paper suggests the derivation of kinematical model with consideration of carrier and wafer motion in double side polishing, and then presents the effect of kinematical parameters on material removal amount and its non-uniformity. The kinematical analysis results help to understand the double side polishing process and to control the polishing results.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.5
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• pp.90-95
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• 2007

Single side final polishing is a very important role to stabilize a wafer finally before the device process on the wafer is executed. In this study, the machining variables, such as pressure, machining time, and the velocity of pad table were adopted. These parameters have the major influence on the characteristics of wafer polishing. We investigated the surface roughness changing these variables to find the optimal polishing condition. Pad, slurry, slurry quantity, and oscillation distance were set to the fixed variables. In order to reduce defects and find a stable machining condition, a hall sensor was used on the polishing process. AE sensor was attached to the polishing machine to verify optimal condition. Applying data analysis of the sensor signal, experiments were performed. We can get better surface roughness from loading the quasi static force and improving wafer-holding method.

• Proceedings of the Safety Management and Science Conference
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• 2004.11a
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• pp.189-195
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• 2004

It compared quality characteristics for the stone surface treatment system and its products. With the result, the flame burner equipment was mainly used to the surface treatment of granite, but it occurred greatly the high temperature, the rock fragment, the noise and dust. For the other side, the whetstone polishing machine for the polishing was a maintenance for the specific physical properties of stone, and it did not occur the stone fragment and the dust. The durability of the stone products due to the flame burner was investigated with that it falls to $20\sim25\%$ more than the surface treatment by the whetstone polishing. Share's hardness of the polishing products in the durability test showed more greatly index than the flame burner and conventional product. The polishing products of Pochon stone in the case of the abrasion resistance showed great more $15\%$ than the general products, more $9\%$ than the products by the flame burner.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.06a
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• pp.751-752
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• 2007

• Tribology and Lubricants
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• v.32 no.2
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• pp.56-60
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• 2016

Sapphire has a high hardness and strength and chemical stability as a superior material. It is used mainly as a material for a semiconductor as well as LED. Recently, the cover glass industry used by a sapphire is getting a lot of attention. The sapphire substrate is manufactured through ingot sawing, lapping, diamond mechanical polishing (DMP) and chemical mechanical polishing (CMP) process. DMP is an important process to ensure the surface quality of several nm for CMP process as well as to determine the final form accuracy of the substrate. In DMP process, the material removal is achieved by using the mechanical energy of the relative motion to each other in the state that the diamond slurry is disposed between the sapphire substrate and the polishing platen. The polishing platen is one of the most important factors that determine the material removal characteristics in DMP. Especially, it is known that the geometric characteristics of the polishing platen affects the material removal amount and its distribution. This paper investigated the material removal characteristics and the effects of the polishing platen groove in sapphire DMP. The experiments were preliminarily carried out to evaluate the sapphire material removal characteristics according to process parameters such as pressure, relative velocity and so on. In the experiment, the monitoring apparatus was applied to analyze process phenomena in accordance with the processing conditions. From the experimental results, the correlation was analyzed among process parameters, polishing phenomena and the material removal characteristics. The material removal equation based on phenomenological factors could be derived. And the experiment was followed to investigate the effects of platen groove on material removal characteristics.

• Tribology and Lubricants
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• v.33 no.3
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• pp.106-111
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• 2017

Sapphire is an anisotropic material with excellent physical and chemical properties and is used as a substrate material in various fields such as LED (light emitting diode), power semiconductor, superconductor, sensor, and optical devices. Sapphire is processed into the final substrate through multi-wire saw, double-side lapping, heat treatment, diamond mechanical polishing, and chemical mechanical polishing. Among these, chemical mechanical polishing is the key process that determines the final surface quality of the substrate. Recent studies have reported that the material removal characteristics during chemical mechanical polishing changes according to the crystal orientations, however, detailed analysis of this phenomenon has not reported. In this work, we carried out chemical mechanical polishing of C(0001), R($1{\bar{1}}02$), and A($11{\bar{2}}0$) substrates with different sapphire crystal planes, and analyzed the effect of crystal orientation on the material removal characteristics and their correlations. We measured the material removal rate and frictional force to determine the material removal phenomenon, and performed nano-indentation to evaluate the material characteristics before and after the reaction. Our findings show that the material removal rate and frictional force depend on the crystal orientation, and the chemical reaction between the sapphire substrate and the slurry accelerates the material removal rate during chemical mechanical polishing.

• Journal of the Korea Institute of Building Construction
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• v.2 no.3
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• pp.163-170
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• 2002

Recently, polishing tile(porcelain homogeneous polished tile) was used in the construction field as a finishing material. But, there happened some problems such as tile exfoliation by construction condition in early ages. Also, for use of polishing tile in the dry wall system which used to lightweight wall, the examination of adhesive stability of polishing tile is needed. In this study, adhesive strength of Polishing tile was investigated by tile bond types on gypsum board and non asbestos board coated by tar-urethane and Polymer modified cementitious waterproofing membrane(Series I). Then, the effect of heat stress and vibration was estimated on gypsum and non asbestos board(Series II). As the result of study are the follows; (1) Polishing tile(600$\times$400mm) construction on waterproofing layer : Both laboratory estimation and spot examination sieve were happened that fall of tile because their hardening speed is late. (2) To using powder style adhesives in the dry wail with waterproofing layer : Adhesive strength of tile is Influenced by interface bond area and base side condition. (3) Shock and heat stresses : obvious decline of adhesive strength is not happened

• Journal of the Optical Society of Korea
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• v.9 no.3
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• pp.99-102
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• 2005

Directional couplers of gradient-index plastic optical fibers were fabricated and characterized. In particular, we have employed a core-facet technique to make the directional couplers, which require mechanical side polishing and linkage. We have measured insertion loss, excess loss, and coupling ratio of the fabricated couplers as a function of polishing depth and coupling length. We found that polishing depth of $\~300{\mu}m$ and coupling length of $\~35mm$ are optimum conditions for minimizing the insertion and excess losses and for achieving 1: 1 coupling ratio.

• Restorative Dentistry and Endodontics
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• v.36 no.2
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• pp.119-124
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• 2011

Objectives: The purpose of this experiment was to evaluate four different polishing systems of their polishability and polishing time. Materials and Methods: 4 mm diameter and 2 mm thickness Teflon mold was made. Z-250 (3M ESPE) hybrid composite resin was slightly overfilled and pressed with slide glass and cured with Optilux 501 for 40 sec each side. Then the surface roughness (glass pressed: control group) was measured with profilometer. One surface of the specimen was roughened by #320 grit sand paper and polished with one of the following polishing systems; Sof-Lex (3M ESPE), Jiffy (Ultradent), Enhance (Dentsply/Caulk), or Pogo (Dentsply/Caulk). The surface roughness and the total polishing time were measured. The results were analyzed with one-way ANOVA and Duncan's multiple range test. Results: The surface roughness was lowest in Pogo, and highest in Sof-Lex. Polishing times were shortest with Pogo, and followed by the Sof-Lex, Enhance and Jiffy. Conclusions: One-step polishing system (Pogo) is very effective to get the smooth surface in a short time, therefore it can be recommended for final polishing system of the restoration.

• The Journal of Advanced Prosthodontics
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• v.4 no.4
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• pp.179-186
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• 2012

PURPOSE. The aim of this study was to evaluate the efficiency of manual polishing over autoglazed and overglazed porcelain and their effect on plaque accumulation. MATERIALS AND METHODS. Thirty-six porcelain discs were fabricated out of which 18 each was subjected for autoglazing and overglazing. Half surface of the discs was left intact; the remaining half was roughened with medium grit diamond bur. Roughened surfaces were repolished by porcelain polishing kits (Shofu, DFS, Eve). All the surfaces were evaluated by the perthometer and SEM. Six discs from each sample were placed in human volunteer's mouth for 72 hours to evaluate the plaque accumulation. Acquired data was subjected to ANOVA comparative evaluation. RESULTS. Roughened surfaces had average roughness value of $2.88{\pm}0.1935{\mu}m$. The repolished surfaces by porcelain correction kits Shofu, DFS and Eve, average roughness value reduced to $0.6250{\pm}0.1036$, $0.9192{\pm}0.0953$, $0.9017{\pm}0.1305$ respectively. Autoglazed and overglazed surfaces showed the mean roughness value (Ra) of $0.4217{\pm}0.0685$, $0.3450{\pm}0.0729$. SEM study showed the improved surfaces when subjected for polishing. Plaque accumulation percentage was the highest on roughened surface ($93.83{\pm}6.2552%$), followed by porcelain discs polished by commercial kits. Autoglazed surfaces found to be the best surfaces with the least plaque accumulation ($0.5237{\pm}0.4209%$). CONCLUSION. All the polishing kits used in the study reduced the average roughness by approximately 77%. Corrected porcelain surfaces should ideally be reglazed, alternatively, polish the surfaces before final cementation.