• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.05a
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• pp.767-770
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• 2000

A novel process is newly developed for building RP(Rapid Prototyping) parts using a sheet lamination technique. The build process of existing sheet lamination type RP machines consists of the following steps : feeding, lamination and cutting. In this process, the laminated part of an object is often scratched by a cutter or damaged by a laser beam due to the cutting operation preceded by lamination, In addition, decubing of the unused portion from the laminated block is difficult. In the new process, cutting operation is performed before lamination. The cutting operation takes place while a paper sheet is firmly attached on the plate using electrostatic force. Then liquid glue is applied to the calculated region of the given contour for lamination. The process aims to manufacture a $2k RP machine, what we call the Freeform Mater I, that can use A4 or latter-size used papers. A prototype machine that demonstrates the design concept is built and further research issues are discussed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1997.11a
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• pp.443-446
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• 1997

This paper presents green sheet Properties of multilayer chip filter for mobile communication. The role of solid loading content and lamination conditions in determining some of the green sheet properties are present. The optimun conditions were obtained solid loading 62:38, lamination temperature 7$0^{\circ}C$, lamination press 300~400 Kg/$\textrm{cm}^2$.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.06a
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• pp.811-812
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• 2008

• Journal of the Korean Ceramic Society
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• v.43 no.4 s.287
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• pp.253-258
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• 2006

In the lamination process of multi-layer ceramic modules, the occurrence of delamination comes into repeatedly. To completely improve the lamination process of LTCC sheets, a binder film was introduced between the layers. The binder film did not originate the delamination until the thickness under $40{\mu}m$. After lamination, the thickness of the binder film was determined by the infilteraion of binder by the pressure, and after the bake-out, was dependent on the decomposition of binder resin. Any detectable defect was not observed in the multilayer structure with Ag inner electrodes.

• 한국태양에너지학회:학술대회논문집
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• 2008.11a
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• pp.42-47
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• 2008

In this paper, we analyze the electrical characteristics of PV depending on distance among solar cells before and after lamination process. From the result, the PV module's maximum power increases about 3.37% when solar cells's distance is 10mm. And the maximum power increases up to 8.42% when solar cells's maximum distance is 50mm. It is assumed that PV module's surface temperature decreases because of increasing distance between solar cells that would give high power generation. Also, short distance between solar cell and frame result in contamination on glass. When considering reduced maximum power caused by contaminant, from that. we can fabricated PV module of lower cost with high performance.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.690-690
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• 2013

Field에 설치된 PV모듈은 가혹한 외부 환경에 노출되어 외부 하중, 온도 변화, 자외선, 수분 등의 영향을 받게 된다. 특히 PV모듈 내부로 수분이 침투 하였을 경우에는 태양전지와 전극의 부식 등 발전성능을 크게 저하시킬 수 있다. 이러한 외부 환경으로부터 태양전지가 안정적으로 발전할 수 있도록 PV 모듈은 전면재료인 유리와 후면재료인 Back Sheet를 진공 상태에서 압력을 가해 봉합하는 Lamination 공정을 거쳐 제작 되어 진다. 특히 Lamination 공정에 사용되는 EVA (ethylene vinyl acetate)는 PV모듈의 내구성능을 좌우할 수 있는 가장 중요한 재료중 하나이다. 본 논문에서는 Lamination 공정에 사용되어지는 EVA의 수분 침투의 특성에 관한 연구를 수행하였다. 공정 조건에 따른 EVA에 침투 되는 수분의 양을 확인하기 위해 Lamination 공정 조건을 변경하여 실험을 진행하였다. 그리고 외부 환경 변화에 의한 영향을 확인하기 위해 EVA가 수분에 노출 되는 시간과 온도를 변화시켜 보았다. 실험의 결과는 외부에 노출된 PV 모듈의 내부에 침투할 수 있는 수분의 양을 예상할 수 있게 하며, 수분 침투에 의한 내구성의 저하를 감소시키기 위한 최적의 Lamination 공정 조건과 봉합재 선정을 위한 기초 자료를 제공한다.

• Journal of the Korean Society for Precision Engineering
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• v.14 no.6
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• pp.37-43
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• 1997

The technology of Laser lamination joining of silicon steel sheets has been studied in this paper. Conventional sheets lamination process does not meet the requirments for the improvement electric parts performance. In response to this, a new Laser spot joining method has been developed. This study performs the Laser spot lamination joining while synchronizing the sillicon steel sheets in the dies with the press movement. Several conclusions have been drawn in this paper. Effects of beam focus, power, atmosphere gas and press oil etc.

• Journal of the Korean Ceramic Society
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• v.34 no.6
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• pp.601-610
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• 1997

In cofiring of multilayered alumina with tungsten, the change of camber with lamination condition was experimented and the effect of sintering shrinkage of alumina and tungsten was investigated. From the exact measurement of sintering shrinkage of tungsten thick film, as lamination pressure increased, the sintering shrinkage of alumina decreased but that of tungsten thick film was not changed. So it was though that the main factor which induced the sintering shrinkage difference between ceramics and metal with lamination condition was the change of sintering shrinkage of ceramics. In case of high lamination pressure, high green sheet density, the cofired specimen showed low camber due to low shrinkage difference between alumina and tungsten and there was a linear relation between camber and shrinkage difference. It was found that this shrinkage difference could change the thickness of tungsten film and the microstructure within via hole during cofiring.

• Journal of the Korean Ceramic Society
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• v.33 no.11
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• pp.1267-1275
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• 1996

Green sheet was prepared by tape casting in the composition of (1-x)Pb(Mg1/3Nb2/3)O3-PbTiO3 system using Pb(Mg1/3Nb2/3)O3 and PbTiO3 synthesized with PbO, Nb2O5 MgO and TiO2 The densest green sheet was obtained in the weight ratio 70:30 of powder to binder. Green sheet wasmultilayered in metal mould and formed into lamination at 7$0^{\circ}C$, 300kg/cm2 The lamination was sintered at 110$0^{\circ}C$ 2hr, Dielectric constant and Curie temperature of disc type sintered body was highered with increasing the amount of PbTiO3 and was in the range of 19000-21000, -7~45$^{\circ}C$ respectively. Green and sintered relative density of lamination was 61% and 95% respectively.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.12
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• pp.1112-1117
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• 2006

The properties of LTCC green tape with addition of binder were investigated in order to understand an effects of binder on multilayer processing. A green sheet form was fabricated through tape casting method with the MLS-22 powder. The lamination density increased with increasing amount of binder and lamination pressure. With increasing amount of binder, the elongation of ceramic sheets increased but the tensile stress and air-permeability decreased. The addition of excessive binder is caused defects in the green sheet during via hole punching. The optimum condition of the via hole without defects was observed from amount of the binder 10 wt%.