• Journal of the Korean Recycled Construction Resources Institute
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• v.8 no.3
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• pp.269-275
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• 2020

In this study, flexural tests of precast concrete panels according to the thickness of cross-sectional and the with or not of reinforcement were carried out in order to develop and assess of a lightweight precast concrete panel using ultra high performance concrete. For the test, four panels were fabricated, and consisted of one normal concrete panel and three ultra high performance concrete panels. As a test result, it was found that the plain precast panel using ultra high performance concrete had a lower flexural performance than the reinforced normal concrete panel, regardless of the cross-sectional size. The flexural performance of the hollow-sectional precast panel applying ultra high performance concrete, is improved by 150% compared to that of the reinforced normal concrete panel. That is, through additional performance verification and optimization of the cross-sectional design of the panel, the ultra high performance concrete precast panel can be made lighter. Also, the practical use of lightweight precast panels with ultra high performance concrete can be available through evaluation on shear, joint connection and anchoring, etc.

• Composites Research
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• v.13 no.4
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• pp.42-53
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• 2000

A study has been made to establish an optimum condition in the surface treatment and curing method that is important for the fabrication of Al 7075/CFRP laminates. PAA(Phosphoric Acid Anodizing) provided a good adhesive strength and FPL(Sulfuric / Sodium Dichromate Acid Etching) had a similar adhesive strength with PAA. On the other hand, the poor adhesive strength was shown on vapor degrease and CAA(Chromic Acid Anodizing). By using the atomic force microscope(AFM), it was found that the PAA oxide surface obviously had a greater degree of microroughness as compared to vapor degrease, CAA and FPL treated surfaces. These results support the concept of a mechanical interlocking of the adhesive with-in the oxide pores as the predominant adhesion mechanism. In curing methods, the adhesive strength of co-curing method was higher than that of secondary curing method. With respect to stability of specimen shape, the secondary curing method was better than co-curing method. DMA(Dynamic Mechanical Analysis) test revealed $T_g$ in curing times over 60 min is nearly same, so it is estimated they will have similar degree of curing and joint durability in using FM300M adhesive film.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.4
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• pp.1-9
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• 2002

The metallurgical reaction properties between the pad consisted of 0.5 $\mu\textrm{m}$Au/5 $\mu\textrm{m}$Ni/Cu layers on a conventional ball grid array (BGA) substrate and In-15 (wt.%)Pb-5Ag solder ball were characterized during the reflow process and solid aging. During the reflow process of 1 to 5 minutes, it was observed that thin $AuIn_2$ or Ni-In intermetallic layer was formed at the interface of solder/pad. The dissolution rate of the Au layer into the molten solder was about $2\times 10^{-3}$ $\mu\textrm{m}$/sec which is remarkably low in comparison with a eutectic Sn-37Pb solder. After solid aging treatment for 500 hrs at $130^{\circ}C$, the thickness of $Ni_{28}In_{72}$ intermetallic layer was increased to about 3 $\mu\textrm{m}$ in all the conditions nevertheless the initial reflow time was different. These result show that In atoms in the solder alloy were diffused through the $AuIn_2$ phase to react with underlaying Ni layer during solid aging treatment. From the microstructural observation and shear tests, the reaction properties between In-15Pb-5Ag alloy and Au/Ni surface finish were analyzed not to trigger Au-embrittlement in the solder joints unlike Sn-37Pb composition.

• Nuclear Engineering and Technology
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• v.42 no.6
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• pp.662-669
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• 2010

To develop the manufacturing methods for the blanket first wall (FW) of the International Thermonuclear Experimental Reactor (ITER) and to verify the integrity of the joint, Be/Cu mockups were fabricated and tested at the KoHLT-1 (Korea Heat Load Test facility), a graphite heater facility located at the Korea Atomic Energy Research Institute (KAERI). Since Be and Cu joining is the focus of the present study, the fabricated mockups had a CuCrZr heat sink joined with three Be tiles as an armor material, unlike the original ITER blanket FW, which has a stainless steel structure and coolant tubes. Hot isostatic pressing (HIP) was carried out at $580^{\circ}C$ and 100 MPa for 2 hours as the method for Be/Cu joining. Three interlayers, namely, $1{\mu}mCr/10{\mu}mCu$, $1{\mu}mTi/0.5{\mu}mCr/10{\mu}mCu$, and $5{\mu}mTi/10{\mu}mCu$ were applied as a coating to the Be tiles by a physical vapor deposition (PVD) method. A shear test was performed with the specimens, which were fabricated by the same methods as those used to fabricate the mockups. The average values were 125 MPa to 180 MPa, and the samples with the $1{\mu}mCr/10{\mu}mCu$ interlayer showed the lowest value. No defect or delamination was found in the joints of the mockups by the developed ultrasonic test using a flat-type probe with a 10 MHz frequency and a 0.25 inch diameter. High heat flux (HHF) tests were performed at $1.0\;MW/m^2$ heat flux for each mockup using the given conditions, and the results were analyzed by ANSYS-CFX code. For the test criteria, an expected fatigue lifetime about 1,000 cycles was obtained by analysis with ANSYS-mechanical code. Mockups using the interlayers of $1{\mu}mTi/0.5{\mu}mCr/10{\mu}mCu$ and $5{\mu}mTi/10{\mu}mCu$ survived up to 1,100 cycles over the required number of cycles. However, one of the Be tiles in the other two mockups using the $1{\mu}mCr/10{\mu}mCu$ interlayer was detached during the screening test, and others were detached by discharge after 862 cycles. The integrity of the joints using the proposed interlayers was proven by the HHF test, but the other interlayer requires more study before it can be used for the joining of Be to Cu. Moreover, it was confirmed that the measured temperatures agreed well with the analysis temperatures, which were used to estimate the lifetime and that the developed facility showed its capability of the long time operation.

• Asian-Australasian Journal of Animal Sciences
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• v.32 no.1
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• pp.126-136
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• 2019

Objective: This study was performed to compare fat content, reducing sugar contents, sensory traits, and fatty acid (FA) and volatile compound profiles in longissimus thoracis (LT) among Korean cattle (KC), Holstein (HO), and Angus (AN) steers. Methods: Twelve LT samples (about 500 g each) of KC with an average age of $31{\pm}0.42months$, an average carcass weight of $431{\pm}12.5kg$, and a quality grade (QG) of 1+ were obtained from the joint livestock products market. Twelve LT samples of HO cattle with an average age of $24{\pm}0.54months$, an average carcass weight of $402{\pm}7.81kg$, and a QG of 2 were also obtained from the same market. Twelve LT samples of AN steers with an average age of about 20 months and a QG of choice were purchased from a beef delivery company. After slaughter, samples were kept at $4^{\circ}C$ for 42 days and prepared for immediate analysis or stored at appropriate conditions. The chemical composition, color, pH, shear force, collagen content, reducing sugars, sensory evaluation, FA composition, and volatile compound content for each LT sample were analyzed. Results: The LT of KC had the highest (p<0.05) fat content, the highest reducing sugar content, and the highest scores in the sensory evaluation (flavor, tenderness, juiciness, and overall acceptance). All the sensory traits were positively correlated (p<0.001) with intramuscular fat and reducing sugar content. Several FAs and volatile compound profiles varied among the breeds. KC LT had the highest (p<0.05) concentrations of acetaldehyde, 3-methyl butanal, and 3-hydroxy-2-butanone, and these volatile compounds were positively correlated (p<0.05) with all the sensory traits. Conclusion: Variations in fat content and reducing sugar contents and FA and volatile compound profiles may contribute to differences in the sensory quality of LT among breeds.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.65-70
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• 2021

In this study, interfacial properties and mechanical properties of joints were reported after Cu pads finished with organic solderability preservative (OSP) on flame retardant-4 (FR-4) printed circuit board (PCB) and electronic components were joined with a Sn-57Bi-1Ag solder paste by using a laser bonding process. The laser bonding process was performed under various bonding conditions with changing a laser power and a bonding time and effects of bonding conditions on interfacial and mechanical properties of joints were analyzed. In order to apply for industry, properties of bonding joints using a reflow bonding process which are widely used were compared. When the laser bonding process were performed, we observed that Cu₆Sn₅ intermetallic compounds (IMCs) were fully formed at the interface although the bonding times were very short about 2 and 3 s. Furthermore, void formations of the joints by using the laser bonding process were suppressed at the joints with comparing to the reflow bonding process and shear strengths of bonding joints were higher than that by using the reflow bonding process. Therefore, in spite of a very short bonding time, it is expected that joints will be stably formed and have a high mechanical strength by using the laser bonding process.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.55-61
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• 2022

In this study, properties of Pb-free solder joints which were combined using Sn-3.0Ag-0.5Cu (SAC305) Pb-free solder with a mid-temperature type of melting temperature and Sn-57Bi-1Ag Pb-free solder with a low-temperature type of melting temperature were reported. Combined Pb-free solder joints were formed by reflow soldering processes with ball grid array (BGA) packages which have SAC305 solder balls and flame retardant-4 (FR-4) printed circuit boards (PCBs) which printed Sn-57Bi-1Ag solder paste. The reflow soldering processes were performed with two types of temperature profiles and interfacial properties of combined Pb-free solder joints such as interfacial reactions, formations of intermetallic compounds (IMCs), diffusion mechanisms of Bi, and so on were analyzed with the reflow process conditions. In order to compare reliability characteristics of combined Pb-free solder joints, we also conducted thermal shock test and analyzed changes of mechanical properties for joints from a shear test during the thermal shock test.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.3
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• pp.40-50
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• 2023

Recently, the number of components of smartphones increases rapidly, while the PCB size continuously decreases. Therefore, 3D technology with a stacked PCB has been developed to improve component density in smartphone. For the s tacked PCB, it i s very important to obtain solder bonding quality between PCBs. We investigated the effects of the properties, thickness, and number of layers of interposer PCB and sub PCB on warpage of PCB through experimental and numerical analysis to improve the reliability of the stacked PCB. The warpage of the interposer PCB decreased as the thermal expansion coefficient (CTE) of the prepreg decreased, and decreased as the glass transition temperature (Tg) increased. However, if temperature is 240℃ or higher, the reduction of warpage is not large. As FR-5 was applied, the warpage decreased more compared to FR-4, and the higher the number and thickness of the prepreg, the lower the warpage. For sub PCB, the CTE was more important for warpage than Tg of the prepreg, and increase in prepreg thickness was more effective in reducing the warpage. The shear tests indicated that the dummy pad design increased bonding strength. The tumble tests indicated that crack occurrence rate was greatly reduced with the dummy pad.

• The Journal of Engineering Geology
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• v.26 no.3
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• pp.383-392
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• 2016

This study is to evaluate the physical and mechanical properties on the Ipseok-dae columnar joints of Mt. Mudeung National Park. For these purposes, physical and mechanical properties as well as discontinuity property on the Mudeungsan tuff, measurement of vibration and local meteorology around columnar joints, and ground deformation by self-weight of columnar joints were examined. For the physical and mechanical properties, average values were respectively 0.65% for porosity, 2.69 for specific gravity, 2.68 g/cm³ for density, and 2411 m/s for primary velocity, 323 MPa for uniaxial compressive strength, 81 GPa Young's modulus, and 0.25 for Poisson's ratio. For the joint shear test, average values were respectively 3.15 GPa/m for normal stiffness, 0.38 GPa/m for shear stiffness, 0.50 MPa for cohesion, and 35° for internal friction angle. The JRC standard and JRC chart was in the range of 4~6, and 1~1.5, respectively. The rebound value Q of silver schmidt hammer was 57 (≒ 90 MPa). It corresponds 20% of the uniaxial compressive strength of intact rock. The maximum vibration value around the Ipseok=dae columnar joints was in the range of 0.57 PPV (mm/s)~2.35 PPV (mm/s). The local meteorology of surface temperature, air temperature, humidity, and wind on and around columnar joints appeared to have been greatly influenced the weather on the day of measurement. For the numerical analysis of ground deformation due to its self-weight of the Ipseok-dae columnar joints, the maximum displacement of the right ground shows when the ground distance is approximately 2 m, while drastically decreased by 2~4 m, thereafter was insignificant. The maximum displacement of the middle ground shows when the ground distance is approximately 0~2 m, while drastically decreased by 3~10 m, thereafter was insignificant. The maximum displacement of the left ground shows when the ground distance is approximately 5~6 m, while drastically decreased by 6~10 m, thereafter was insignificant.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.3
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• pp.19-27
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• 2003

Surface finishes of PCB laminates are important in the solder joint reliability of flip chip package because the types and thicknesses of intermetallic compound(IMC), and compositions and hardness of solders are affected by them. In this study, effects of surface finishes of PCB on the low cycle fatigue resistance of Sn-based lead-free solders; Sn-3.5Ag, Sn-3.5Ag-XCu(X=0.75, 1.5), Sn-3.5Ag-XBi(X=2.5, 7.5) and Sn-0.7Cu were investigated for the Cu and Au/Ni surface finish treatments. Displacement controlled room temperature lap shear fatigue tests showed that fatigue resistance of Sn-3.5Ag-XCu(X=0.75, 1.5), Sn-3.5Ag and Sn-0.7Cu alloys were more or less the same each other but much better than that of Bi containing alloys regardless of the surface finish layer used. In general, solder joints on the Au/Ni finish showed better fatigue resistance than those on the Cu finish. Cross-sectional fractography revealed microcracks nucleation inside of the interfacial IMC near the solder mask edge, more frequently on the Cu than the Au/Ni surface finish. Macro cracks followed the solder/IMC interface in the Bi containing alloys, while they propagated in the solder matrix in other alloys. It was ascribed to the Bi segregation at the solder/IMC interface and the solid solution hardening effect of Bi in the $\beta-Sn$ matrix.