• 대한전자공학회논문지
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• 제25권11호
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• pp.1286-1293
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• 1988

자기정렬 DMOS 트랜지스터의 채널 길이에 관한 수식을 2차원적인 Caussian 농도분포식으로부터 유도하였다. 본 논문에서는 제시된 채널 길이에 관한 수식은 기판의 농도, 이중확산된 각 영역의 표면 농도와 수직 접합 깊이의 함수로 이루어져 있으며, 계산된 실험치와 잘 일치하고 있다. 또한 고전압용 DMOS 트랜지스터에서 채널 punchthrough를 억제할 수 있는 최소 채널 길이를 채널영역의 평균농도를 이용하여 계산하였으며 소자 simulation을 통하여 최적의 채널 조건(채널농도분포 및 채널 길이)를 예측할 수 있음을 확인하였다.

• Journal of Magnetics
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• 제11권2호
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• pp.83-86
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• 2006

Controlling magnetic domains in soft underlayer (SUL) of perpendicular magnetic recording (PMR) is an important issue for the application of PMR in HDD. We studied the magnetic domain structures in SUL using the finite element based micromagnetic simulation (FEMM) for the SUL models with different thicknesses. The purpose is to simulate the magnetic domain wall noise when the SUL thickness and saturation magnetization are changed. The simulation results show that a 15 nm SUL forms simpler Neel wall domain wall pattern and 40 nm SUL forms complex Bloch wall. To visualize the effect of these domain walls stray field at a read sensor position, the magnetic stray field of the domain walls at air bearing surface (ABS) which is 50 nm above the SUL was simulated and the results imply that Bloch walls have stronger stray field with more complicated field patterns than Neel walls and this becomes a significant noise source. Therefore, the thickness of the SUL should be controlled to avoid the formation of Bloch walls.

• 반도체디스플레이기술학회지
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• 제21권2호
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• pp.38-44
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• 2022

Plasma density in semiconductor fabrication equipment becomes higher to achieve the improved the throughput of the process, but the increase of surface corrosion of the ceramic coated chamber wall has been observed by the increased plasma density. Plasma chamber wall coating with aerosol deposition prefer to be firm and uniform to prevent the potential creation of particle inside the chamber from the deformation of the coating materials, and the aerosol discharge nozzle is a good control factor for the deposited coating condition. In this paper, we investigated the design of the nozzle of the aerosol deposition to form a high-quality coating film. Computational fluid dynamics (CFD) study was employed to minimize boundary layer effect and shock wave. The degree of expansion, and design of simulation approach was applied to found out the relationship between the divergence angle and nozzle length as the key parameter for the nozzle design. We found that the trade-off tendency between divergence angle and nozzle length through simulation and quantitative analysis, and present the direction of nozzle design that can improve the uniformity of chamber wall coating.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2004년도 Asia Display / IMID 04
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• pp.149-152
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• 2004

A new joint source channel coding reduces both input-width and average current consumption to transmit image data to LCD source drivers. As a source coding, it is based on entropy coding of differential pulse code modulation scheme, especially using median edge detector of image predictor. As a channel coding, it is not a simple pulse amplitude modulation, but linked by source entropy to reduce average amplitude. Simulation results show 1/4 width is achievable by 16-valued transmission with keeping conventional current consumption (0.36 to 1.3).

• 산업공학
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• 제23권3호
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• pp.205-212
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• 2010

The learning curve model is a mathematical form which represents the relationship between the manufacturing experience and its effectiveness. The semiconductor manufacturing is widely known as an appropriate example for the learning effect due to its complicated manufacturing processes. In this paper, I propose a new compound learning curve model for semiconductor products in which the general learning curve model and the growth curve are composed. The dependent variable and the effective independent variables of the model were abstracted from the existing learning curve models and selected according to multiple regression processes. The simulation results using the historical DRAM data show that the proposed compound learning curve model is one of adequate models for describing learning effect of semiconductor products.

• 산업공학
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• 제21권2호
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• pp.141-150
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• 2008

In this paper, an efficient control method for semiconductor fabrication process is presented. Generally, control is performed with data which is under the influence of process disturbance. EWMA is one of the most popular control methods in semiconductor fabrication that effectively deals with varying process condition. A new method using EWMA, called the Dual Damping EWMA, is presented in this study to reduce over-control by separating weight factor of input and output. The goal is to reflect Drift but reduce the effects of White noise in run to run control. Simulation is performed to evaluate the performance of DPEWMA and to compare with EWMA and Double EWMA.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2000년도 제15차 학술회의논문집
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• pp.61-61
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• 2000

Since FMS(Flexible Manufacturing System) such as semiconductor production systems have the characteristic that each device has to be commonly used in several stages, it is difficult to find an optimal solution. In this paper, we proposed the new algorithm which can get the optimal ratio of sharing resources. We will implement the proposed algorithm to semiconductor production systems. We introduce the optimal algorithm, which is modeled and analyzed by ExSpect, a petri net based simulation tool. When there exist conflicts of sharing resources, the scheduling method is adopted, which gives a priority to the most preceded process. The suggested algorithm can be used not only in semiconductor production systems but also in various FMS.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2003년도 통신소사이어티 추계학술대회논문집
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• pp.335-339
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• 2003

This Paper describes the design and the simulation results of the RF CMOS Class-E Power Amplifier for a 2.4GHz ISM band. This circuit is composed two connected amplifiers. where Class F amplifier drives Class E amplifier. The proposed circuit can reduce the total power dissipation of the driving stage and can work with higher efficiency. The power amplifier has been implemented in a standard 0.25$\mu\textrm{m}$ CMOS technology and is shown to deliver 100mW output Power to load with 41％ power added efficiency(PAE) from a 2.5V supply.

• 대한안전경영과학회지
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• 제7권5호
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• pp.255-273
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• 2005

Overlay parameter control of the semiconductor photolithography process is researched in this paper. Overlay parameters denote the error in superposing the current pattern to the pattern previously created. The reduction of the overlay deviation is one of the key factors in improving the quality of the semiconductor products. The semiconductor process is affected by numerous environment and equipment factors. Through process condition prediction and control, the overlay inaccuracy can be reduced. Generally, three types of process condition change exist; uncontrollable white noise, slowly changing drift, and abrupt condition shift. To effectively control the aforementioned process changes, control scheme using adaptive deadband is proposed. The suggested approach and existing control method are cross evaluated through simulation.

• 반도체디스플레이기술학회지
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• 제9권4호
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• pp.71-76
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• 2010

According to recent changes in industry for semiconductor devices, a low-temperature treatment has become a necessity. These changes relate to size refinement and the development of new materials. While variation in cooling efficiency does not affect the yield when using a high-temperature treatment, uniform cooling efficiency is necessary avoid "inconsistencies/bends" in low temperature treatments. However it is difficult to increase temperature stabilization in low temperature treatments. In this paper, using CFD (Computer Fluid Dynamics), we analyze and manipulate the design and input of the low-temperature system to attempt to control for temperature variations within the quartz tube, of which airflow appears to be a predominant factor. This simulation includes variable inputs such as airflow rate, head pressure, and design manipulations in the S.C.U. (Super Cooling Unit).